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STM32H725AGI3TR

STMicroelectronics

STM32H725AGI3TR by STMicroelectronics

STM32H725AGI3TR by STMicroelectronics is a 32-bit microcontroller with Cortex-M7 CPU family, offering 24 timers and 38-Ch 16-Bit ADC. With a max clock frequency of 50 MHz, it supports various peripherals like Ethernet, CAN(3), and USB. Ideal for applications requiring low power mode and high-speed processing in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,749 parts In-Stock

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4,749

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Anansix

USA . 2,558 parts In-Stock

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2,558

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Digiode

USA . 2,349 parts In-Stock

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2,349

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Nova Conductors

Japan . 900 parts In-Stock

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900

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Distributors (Availability)

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AZTECH Wire

Italy . 247 parts In-Stock

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$6.590

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247

$6.590

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Semicontronic

India . 1,223 parts In-Stock

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$21.000

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$20.475

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$20.370

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1,223

$21.000

$20.475

$20.370

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Ampacity Inc.

Singapore . 737 parts In-Stock

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$30.000

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737

$30.000

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Microchip USA

USA . 5,045 parts In-Stock

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$30.754

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$30.754

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IDEA Electronic Components Group

UK . 727 parts In-Stock

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$44.093

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$39.684

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727

$44.093

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$39.684

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Aztec Data Supply Inc.

USA . 4,028 parts In-Stock

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$54.210

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4,028

$54.210

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Corohmni

South Africa . 890 parts In-Stock

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$62.498

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890

$62.498

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MKK Technologies

India . 641 parts In-Stock

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$82.914

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641

$82.914

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DigiPath Technology Company

USA . 641 parts In-Stock

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$82.914

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$82.914

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Argo Parts USA

USA . 3,730 parts In-Stock

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Continental Prestige Electronics

USA . 2,554 parts In-Stock

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Parana Technologies

USA . 1,516 parts In-Stock

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$52.720

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Corphita

USA . 778 parts In-Stock

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Robosynatics

Brazil . 300 parts In-Stock

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300

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Lucentia Tech

USA . 300 parts In-Stock

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$0.418

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$0.418

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$0.418

300

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$0.418

$0.418

$0.418

Bastille Electronics

Australia . 100 parts In-Stock

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Overview

Unlock unparalleled performance and efficiency with the STM32H725AGI3TR microcontroller by STMicroelectronics. As a leader in the industry, STMicroelectronics delivers cutting-edge technology that sets new standards for microcontrollers. With a wide range of applications in mind, this microcontroller offers superior value and benefits to customers seeking high-quality solutions. Dive into a world of possibilities and experience the advantages of the STM32H725AGI3TR today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protects the microcontroller from external elements, making it suitable for various environmental conditions.

Integrated Cache: YES

Having an integrated cache improves the performance of the microcontroller by reducing access time to frequently used data and instructions.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in power supply options, offering compatibility with a wide range of applications.

ADC Channels: YES

The presence of Analog-to-Digital Converter channels enables the microcontroller to interface with analog sensors and convert real-world signals into digital data for processing.

Minimum Supply Voltage: 1.62 V

The low minimum supply voltage helps in reducing power consumption and making the microcontroller suitable for battery-powered applications.

CPU Family: CORTEX-M7

Being part of the Cortex-M7 CPU family ensures high performance, efficient power consumption, and advanced features, making it a reliable choice for complex embedded systems.

ROM Words: 1048576

The large ROM capacity allows for storing a significant amount of program data, enabling the microcontroller to run complex applications without external memory.

Maximum Clock Frequency: 50 MHz

With a high maximum clock frequency, the microcontroller can execute instructions quickly, enabling fast response times in real-time applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller with various integrated peripherals, it offers enhanced processing power, efficiency, and versatility for diverse applications.

RAM Bytes: 577536

The ample RAM capacity allows for storing and manipulating a significant amount of data in real-time, supporting multitasking and complex algorithms.

Technical Specifications

Microcontrollers STM32H725AGI3TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M7

Maximum Clock Frequency:

50 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B169

Length:

7 mm

Low Power Mode:

YES

No. of DMA Channels:

16

No. of I/O Lines:

121

No. of Serial I/Os:

14

No. of Terminals:

169

No. of Timers:

24

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA169,13X13,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

RAM Bytes:

577536

ROM Words:

1048576

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

550 rpm

Maximum Supply Current:

360 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.62 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

ETHERNET, CAN(3), I2C(5), I2S(4), LPUART, SAI(2), SDMMC(2), SPI(6), SWPMI, UART(5), USART(5), USB

Peripherals:

ANALOG COMPARATOR(2), BOR, DMA(16), LCD, POR, RTC, TIMER(24), WDT(2)

Analog To Digital Convertors:

38-Ch 16-Bit, 17-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32H725AGI3TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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