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STM32G474VEH3

STMicroelectronics

STM32G474VEH3 by STMicroelectronics

STM32G474VEH3 by STMicroelectronics is a 32-bit microcontroller with Cortex-M4 CPU, 524288 ROM words, and 131072 RAM bytes. It features 42-Ch 12-Bit ADCs, 7-Ch 12-Bit DACs, and up to 48 MHz clock frequency. Ideal for applications requiring high-speed data processing, precision analog-to-digital conversion, and extensive peripheral connectivity.

Median Price

$9.920

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 95 parts In-Stock

1+ parts

$9.920

100+ parts

$6.390

1k+ parts

$6.170

10k+ parts

-

95

$9.920

$6.390

$6.170

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,900 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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7,900

-

-

-

-

Digiode

USA . 4,175 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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4,175

-

-

-

-

Chip Stock

USA . 3,185 parts In-Stock

1+ parts

-

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-

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3,185

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-

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Anansix

USA . 2,749 parts In-Stock

1+ parts

-

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-

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2,749

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-

-

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Component Sense

UK . 746 parts In-Stock

1+ parts

-

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-

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746

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Nova Conductors

Japan . 500 parts In-Stock

1+ parts

-

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-

1k+ parts

-

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500

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 195 parts In-Stock

1+ parts

$21.910

100+ parts

-

1k+ parts

-

10k+ parts

-

195

$21.910

-

-

-

Ampacity Inc.

Singapore . 2,443 parts In-Stock

1+ parts

$30.000

100+ parts

-

1k+ parts

-

10k+ parts

-

2,443

$30.000

-

-

-

Semicontronic

India . 2,130 parts In-Stock

1+ parts

$35.000

100+ parts

$34.125

1k+ parts

$33.950

10k+ parts

-

2,130

$35.000

$34.125

$33.950

-

IDEA Electronic Components Group

UK . 761 parts In-Stock

1+ parts

$57.347

100+ parts

-

1k+ parts

$51.613

10k+ parts

-

761

$57.347

-

$51.613

-

Aztec Data Supply Inc.

USA . 3,164 parts In-Stock

1+ parts

$57.910

100+ parts

-

1k+ parts

-

10k+ parts

-

3,164

$57.910

-

-

-

Advanced Electronics

New Zealand . 300 parts In-Stock

1+ parts

$69.093

100+ parts

$65.639

1k+ parts

$65.639

10k+ parts

-

300

$69.093

$65.639

$65.639

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Corohmni

South Africa . 73 parts In-Stock

1+ parts

$71.501

100+ parts

-

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73

$71.501

-

-

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MKK Technologies

India . 1,757 parts In-Stock

1+ parts

$107.838

100+ parts

-

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1,757

$107.838

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-

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DigiPath Technology Company

USA . 1,757 parts In-Stock

1+ parts

$107.838

100+ parts

-

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1,757

$107.838

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-

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Continental Prestige Electronics

USA . 6,934 parts In-Stock

1+ parts

-

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6,934

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Corphita

USA . 4,274 parts In-Stock

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4,274

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Argo Parts USA

USA . 4,029 parts In-Stock

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4,029

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Parana Technologies

USA . 953 parts In-Stock

1+ parts

-

100+ parts

$68.567

1k+ parts

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953

-

$68.567

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Bastille Electronics

Australia . 40 parts In-Stock

1+ parts

-

100+ parts

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40

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Overview

Unlock the power of innovation with the STM32G474VEH3 microcontroller by STMicroelectronics. As a leader in the industry, STMicroelectronics guarantees top-quality products that deliver exceptional performance. Ideal for a wide range of applications, this microcontroller offers unmatched value with its advanced features and capabilities. From integrated cache to multiple ADC and DAC channels, this product provides endless possibilities for your projects. Experience seamless connectivity and optimized processing speed with the STM32G474VEH3, setting new standards in the world of microcontrollers. Elevate your designs and bring your ideas to life with this cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy makes this product lightweight and durable, ideal for portable or rugged applications.

Integrated Cache: YES

The integrated cache enhances processing speed and efficiency, making this product suitable for high-performance tasks.

Surface Mount: YES

The surface mount capability allows for easy and secure installation on printed circuit boards, saving time and effort in assembly.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6V, this product is compatible with a wide range of power sources for flexible application.

On Chip Data RAM Width: 8

The 8-bit width of on-chip data RAM provides ample storage capacity for efficient data handling and processing.

Package Shape: SQUARE

The square package shape offers a compact design, saving valuable space in electronic devices or systems.

Bit Size: 32

The 32-bit architecture enables high-speed processing and complex computations, suitable for advanced applications.

DAC Channels: YES

The presence of DAC channels allows for accurate analog signal conversion, making this product ideal for applications requiring precise control.

No. of Terminals: 100

With 100 terminals, this microcontroller offers a high level of connectivity and integration capabilities for diverse interfaces and peripherals.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

The grid array, thin profile, and fine pitch package style offers easy installation and secure solder connections for reliable performance.

Technical Specifications

Microcontrollers STM32G474VEH3 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B100

JESD-609 Code:

e1

Length:

8 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

16

No. of External Interrupts:

16

No. of I/O Lines:

86

No. of Serial I/Os:

9

No. of Terminals:

100

No. of Timers:

15

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA100,10X10,32

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

131072

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.1 mm

Speed:

170 rpm

Maximum Supply Current:

42 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

8 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(3), I2C(4), I2S(2), LPUART, QSPI, SAI, SPI(4), UART(2), USART(3), USB

Peripherals:

BOR, COMPARATOR(7), DMA(16), POR, RTC, TIMER(15), WDT(2)

Analog To Digital Convertors:

42-Ch 12-Bit

Digital To Analog Convertors:

7-Ch 12-Bit

Trade Compliance

STM32G474VEH3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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