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STM32G474CCT6

STMicroelectronics

STM32G474CCT6 by STMicroelectronics

STM32G474CCT6 by STMicroelectronics is a 32-bit microcontroller with Cortex-M4 CPU family, operating at 48 MHz. It features 131072 bytes of RAM, 262144 ROM words, and 20-Ch 12-Bit ADC channels. Ideal for applications requiring low power mode, such as IoT devices and industrial automation systems.

Median Price

$3.180

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Future Electronics

Canada . 12,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.180

10k+ parts

-

12,000

-

-

$3.180

-

Avnet

USA . 1,500 parts In-Stock

1+ parts

-

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-

1k+ parts

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-

1,500

-

-

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 61 parts In-Stock

1+ parts

$6.380

100+ parts

-

1k+ parts

-

10k+ parts

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61

$6.380

-

-

-

Vyrian

USA . 6,235 parts In-Stock

1+ parts

-

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-

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6,235

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Digiode

USA . 1,211 parts In-Stock

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1,211

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Anansix

USA . 414 parts In-Stock

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414

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Bristol Electronics

USA . 6 parts In-Stock

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6

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 6,614 parts In-Stock

1+ parts

$2.700

100+ parts

$2.632

1k+ parts

$2.619

10k+ parts

-

6,614

$2.700

$2.632

$2.619

-

Ampacity Inc.

Singapore . 5,675 parts In-Stock

1+ parts

$3.100

100+ parts

-

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-

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5,675

$3.100

-

-

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Aranea Global

USA . 2,000 parts In-Stock

1+ parts

$6.252

100+ parts

-

1k+ parts

$6.002

10k+ parts

-

2,000

$6.252

-

$6.002

-

Continental Prestige Electronics

USA . 5,011 parts In-Stock

1+ parts

$6.380

100+ parts

-

1k+ parts

-

10k+ parts

$6.252

5,011

$6.380

-

-

$6.252

AZTECH Wire

Italy . 1,009 parts In-Stock

1+ parts

$13.200

100+ parts

-

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1,009

$13.200

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Microchip USA

USA . 3,463 parts In-Stock

1+ parts

$15.861

100+ parts

-

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3,463

$15.861

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Aztec Data Supply Inc.

USA . 61 parts In-Stock

1+ parts

$28.160

100+ parts

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61

$28.160

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IDEA Electronic Components Group

UK . 1,319 parts In-Stock

1+ parts

$33.356

100+ parts

-

1k+ parts

$30.020

10k+ parts

-

1,319

$33.356

-

$30.020

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$54.804

100+ parts

$52.064

1k+ parts

$52.064

10k+ parts

-

2,500

$54.804

$52.064

$52.064

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MKK Technologies

India . 386 parts In-Stock

1+ parts

$62.723

100+ parts

-

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386

$62.723

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DigiPath Technology Company

USA . 386 parts In-Stock

1+ parts

$62.723

100+ parts

-

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386

$62.723

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Corohmni

South Africa . 38 parts In-Stock

1+ parts

$63.670

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38

$63.670

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Argo Parts USA

USA . 1,844 parts In-Stock

1+ parts

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1,844

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Corphita

USA . 1,112 parts In-Stock

1+ parts

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1,112

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Parana Technologies

USA . 553 parts In-Stock

1+ parts

-

100+ parts

$39.882

1k+ parts

-

10k+ parts

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553

-

$39.882

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Overview

Unlock the power of innovation with the STM32G474CCT6 by STMicroelectronics, a cutting-edge microcontroller that delivers unrivaled performance and reliability. With a wide range of applications in various industries, this top-of-the-line product offers seamless integration, advanced features, and unparalleled value for customers seeking superior control and precision. Trust in STMicroelectronics' reputation for excellence and experience the difference with the STM32G474CCT6.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this microcontroller lightweight and durable, ideal for portable devices.

Integrated Cache: YES

The presence of an integrated cache improves the processing speed and efficiency of the microcontroller, making it suitable for high-performance applications.

Surface Mount: YES

The surface mount capability simplifies the assembly process and saves space on the circuit board, making it easy to integrate into compact devices.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this microcontroller can handle a wide range of power sources, increasing its versatility in different applications.

On Chip Data RAM Width: 8

The 8-bit data RAM width enhances data processing capabilities, making the microcontroller suitable for tasks requiring complex calculations.

Package Shape: SQUARE

The square package shape provides a compact form factor, allowing for efficient use of space on the PCB and enabling sleek designs in end products.

Technical Specifications

Microcontrollers STM32G474CCT6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

Low Power Mode:

YES

No. of DMA Channels:

16

No. of External Interrupts:

16

No. of I/O Lines:

38

No. of Serial I/Os:

7

No. of Terminals:

48

No. of Timers:

15

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

RAM Bytes:

131072

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

170 rpm

Maximum Supply Current:

34 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(3), I2C(4), I2S(2), LPUART, QSPI, SAI, SPI(3), USART(3),

Peripherals:

BOR, COMPARATOR(7), DMA(16), POR, RTC, TIMER(15), WDT(2)

Analog To Digital Convertors:

20-Ch 12-Bit

Digital To Analog Convertors:

7-Ch 12-Bit

Trade Compliance

STM32G474CCT6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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