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STM32G473CCU6TR

STMicroelectronics

STM32G473CCU6TR by STMicroelectronics

STM32G473CCU6TR by STMicroelectronics is a 32-bit microcontroller with Cortex-M4 CPU family, operating at max 48 MHz. It features 131072 bytes of RAM, 262144 ROM words, and 21-Ch 12-Bit ADC channels. Ideal for industrial applications requiring high-speed processing and multiple connectivity options like I2C, I2S, QSPI, and USART.

Median Price

$6.107

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 142,500 parts In-Stock

1+ parts

$6.269

100+ parts

-

1k+ parts

-

10k+ parts

$2.709

142,500

$6.269

-

-

$2.709

Chip1Stop

Japan . 870,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$3.115

870,000

-

-

-

$3.115

Verical

USA . 142,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$6.107

142,500

-

-

-

$6.107

Distributors (In-Stock)

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ComSIT Distribution GmbH

Germany . 9,375 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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9,375

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-

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Vyrian

USA . 8,758 parts In-Stock

1+ parts

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8,758

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Digiode

USA . 4,562 parts In-Stock

1+ parts

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4,562

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Anansix

USA . 1,090 parts In-Stock

1+ parts

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1,090

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 327 parts In-Stock

1+ parts

$11.860

100+ parts

-

1k+ parts

-

10k+ parts

-

327

$11.860

-

-

-

Microchip USA

USA . 5,261 parts In-Stock

1+ parts

$14.901

100+ parts

-

1k+ parts

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10k+ parts

-

5,261

$14.901

-

-

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IDEA Electronic Components Group

UK . 1,649 parts In-Stock

1+ parts

$22.626

100+ parts

-

1k+ parts

$20.363

10k+ parts

-

1,649

$22.626

-

$20.363

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MKK Technologies

India . 1,362 parts In-Stock

1+ parts

$42.546

100+ parts

-

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10k+ parts

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1,362

$42.546

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DigiPath Technology Company

USA . 1,362 parts In-Stock

1+ parts

$42.546

100+ parts

-

1k+ parts

-

10k+ parts

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1,362

$42.546

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-

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Corphita

USA . 1,730 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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1,730

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Parana Technologies

USA . 1,312 parts In-Stock

1+ parts

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100+ parts

$27.052

1k+ parts

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10k+ parts

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1,312

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$27.052

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-

Overview

Unlock the power of innovation with the STM32G473CCU6TR by STMicroelectronics. This cutting-edge microcontroller boasts integrated cache, high-speed performance, and a wide range of connectivity options. Perfect for industrial applications, this device offers top-notch reliability and efficiency. Trust STMicroelectronics to deliver top-quality products that exceed expectations. Embrace the future of technology with the STM32G473CCU6TR and experience seamless integration, enhanced functionality, and unmatched value for your projects.

Feature Benefit Bullets

Integrated Cache: YES

Having an integrated cache improves the overall performance of the microcontroller by reducing the access time for frequently used instructions and data.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the microcontroller onto a PCB, saving time and effort during the manufacturing process.

Maximum Supply Voltage: 3.6 V

The higher maximum supply voltage allows for flexibility in power supply options, making it suitable for a wide range of applications.

On Chip Data RAM Width: 8

Having a wider data RAM width enables faster data processing and storage capabilities, making the microcontroller suitable for demanding tasks.

Package Shape: SQUARE

The square package shape allows for efficient use of space on the PCB and facilitates easier routing of traces, enhancing overall design flexibility.

Bit Size: 32

With a 32-bit architecture, the microcontroller can handle larger data sets and execute more complex instructions, making it suitable for high-performance applications.

DAC Channels: YES

The presence of DAC channels enables the microcontroller to generate analog voltages, making it suitable for applications requiring precise analog output signals.

No. of Terminals: 48

Having a higher number of terminals allows for greater connectivity options and enables the microcontroller to interface with a wide range of external devices and peripherals.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The diverse package styles offer flexibility in mounting options and thermal management, making the microcontroller suitable for various environmental conditions and space constraints.

Minimum Supply Voltage: 1.71 V

The lower minimum supply voltage allows for power-efficient operation and extends the battery life in portable applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range ensures reliable performance in harsh industrial environments with elevated temperatures.

CPU Family: CORTEX-M4

The Cortex-M4 architecture offers high performance and energy efficiency, making the microcontroller suitable for real-time embedded applications.

No. of External Interrupts: 16

The availability of multiple external interrupts enhances the microcontroller's responsiveness to external stimuli, enabling efficient multitasking and event handling.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable operation in extreme cold environments, making the microcontroller suitable for a wide range of applications.

ADC Channels: YES

The presence of ADC channels enables the microcontroller to convert analog signals into digital data, allowing for precise measurement and control in various applications.

DMA Channels: YES

Having DMA channels allows for efficient data transfer between memory and peripherals, reducing the workload on the CPU and improving overall system performance.

Terminal Position: QUAD

The quad terminal position facilitates easy soldering and ensures secure connections, enhancing the reliability of the microcontroller in high-vibration environments.

ROM Words: 262144

The large ROM capacity provides ample storage space for program code and data, making the microcontroller suitable for complex applications with extensive software requirements.

Maximum Seated Height: 0.6 mm

The low maximum seated height allows for compact and slim designs, making the microcontroller suitable for space-constrained applications with height restrictions.

Digital To Analog Convertors: 7-Ch 12-Bit (4)

The multiple DAC channels with high resolution enable the microcontroller to generate precise analog output signals, making it ideal for audio and sensor interfacing applications.

Width: 7 mm

The compact width allows for easy integration into tight spaces and simplifies PCB layout, enabling more efficient and cost-effective designs.

Boundary Scan: YES

The presence of boundary scan capability allows for efficient testing and debugging of the microcontroller during production, leading to higher quality and reliability.

Peripherals: RTC, TIMER(14), WDT(2)

The inclusion of real-time clock, timers, and watchdog timer peripherals enhances the functionality and versatility of the microcontroller for time-critical applications and system monitoring.

Maximum Clock Frequency: 48 MHz

The high maximum clock frequency enables fast execution of instructions and high-speed data processing, making the microcontroller suitable for time-sensitive applications and real-time control.

Length: 7 mm

The compact length allows for space-efficient PCB layouts and compact device designs, making the microcontroller suitable for miniaturized and portable applications.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature rating ensures reliable operation in harsh industrial environments with wide temperature fluctuations, making the microcontroller suitable for rugged applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller, it offers high performance and energy efficiency, making it suitable for embedded control applications that demand fast and reliable operation.

No. of Timers: 14

The presence of multiple timers enables the microcontroller to perform precise timing functions and event scheduling, enhancing its capabilities for time-critical applications and system synchronization.

RAM Bytes: 131072

The large RAM capacity provides ample memory space for data storage and temporary calculations, allowing the microcontroller to handle complex tasks and multitasking efficiently.

Technology: CMOS

The use of CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of voltages, making the microcontroller suitable for battery-operated and versatile applications.

Terminal Form: NO LEAD

The no-lead terminal form simplifies the manufacturing process and enhances solder joint reliability, ensuring robust connections and long-term performance of the microcontroller.

Analog To Digital Convertors: 21-Ch 12-Bit

The multiple ADC channels with high resolution enable the microcontroller to capture and convert analog signals with precision, making it suitable for sensor data acquisition and signal processing applications.

Nominal Supply Voltage: 3 V

The nominal supply voltage of 3V provides a stable power source for the microcontroller, ensuring reliable and consistent operation in various applications and voltage conditions.

No. of DMA Channels: 16

Having 16 DMA channels allows for efficient data transfer and processing, reducing CPU overhead and improving system performance in applications requiring fast and simultaneous data handling.

PWM Channels: YES

The availability of PWM channels enables the microcontroller to generate precise pulse-width modulated signals, making it suitable for motor control, lighting, and power management applications.

Connectivity: I2C(4), I2S(2), QSPI, USART(3)

The multiple connectivity options, including I2C, I2S, QSPI, and USART interfaces, facilitate seamless communication with external devices and peripherals, enhancing the microcontroller's versatility for diverse applications.

ROM Programmability: FLASH

The Flash programmability of ROM allows for flexible and easy updating of program code, configuration settings, and firmware without the need for external memory devices, making the microcontroller suitable for firmware updates and field upgrades.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5mm enables high-density mounting of the microcontroller on the PCB, allowing for space-saving designs and efficient use of board space.

Format: FLOATING POINT

Supporting floating-point format enhances the microcontroller's capabilities for complex mathematical calculations and processing of real numbers, making it suitable for scientific, engineering, and financial applications.

Speed: 170 rpm

The high speed of 170 RPM ensures fast data processing and real-time control, making the microcontroller suitable for applications requiring rapid response and high-speed operation.

Technical Specifications

Microcontrollers STM32G473CCU6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-XQCC-N48

Length:

7 mm

Low Power Mode:

NO

No. of DMA Channels:

16

No. of External Interrupts:

16

No. of I/O Lines:

42

No. of Terminals:

48

No. of Timers:

14

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.24SQ,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

131072

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

170 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Connectivity:

I2C(4), I2S(2), QSPI, USART(3)

Peripherals:

RTC, TIMER(14), WDT(2)

Analog To Digital Convertors:

21-Ch 12-Bit

Digital To Analog Convertors:

7-Ch 12-Bit (4)

Trade Compliance

STM32G473CCU6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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