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STM32G0C1REI6NTR

STMicroelectronics

STM32G0C1REI6NTR by STMicroelectronics

STM32G0C1REI6NTR microcontroller from STMicroelectronics features a 32-bit Cortex-M0 CPU, operates b/w -40 °C to 85 °C, and supports up to 64 I/O lines. With integrated ADC/DAC channels and low power modes, it's ideal for industrial applications. Its compact design ensures efficient performance in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,553 parts In-Stock

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8,553

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Digiode

USA . 4,977 parts In-Stock

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4,977

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Anansix

USA . 267 parts In-Stock

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267

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Distributors (Availability)

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AZTECH Wire

Italy . 431 parts In-Stock

1+ parts

$15.530

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431

$15.530

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IDEA Electronic Components Group

UK . 1,184 parts In-Stock

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$62.643

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$56.379

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1,184

$62.643

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$56.379

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MKK Technologies

India . 870 parts In-Stock

1+ parts

$117.796

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870

$117.796

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DigiPath Technology Company

USA . 870 parts In-Stock

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$117.796

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870

$117.796

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Corphita

USA . 2,829 parts In-Stock

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2,829

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Parana Technologies

USA . 11 parts In-Stock

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$74.899

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11

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$74.899

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Overview

Unlock endless possibilities with the STM32G0C1REI6NTR microcontroller from STMicroelectronics, a leader renowned for innovation and quality. This compact powerhouse excels in low-power applications while offering robust performance for industrial automation, smart appliances, and IoT devices. With its impressive flexibility and advanced features, it empowers engineers to create efficient, reliable solutions that enhance productivity and reduce time-to-market. Elevate your projects with ST's trusted technology!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material provides a robust housing, ensuring the microcontroller's longevity in varying environments.

Surface Mount: YES

Surface mount technology allows for compact board designs and simplifies the manufacturing process.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V makes this microcontroller suitable for battery-powered applications.

On Chip Data RAM Width: 8

An 8-bit data RAM width can efficiently handle simple tasks and provide adequate performance for many applications.

Package Shape: SQUARE

The square shape is advantageous for systematic placement on PCBs and enhances thermal performance.

Bit Size: 32

Being a 32-bit microcontroller means it can process data more efficiently and handle complex applications.

DAC Channels: YES

The presence of Digital-to-Analog Converters allows for analog outputs, which is essential for sound and control systems.

No. of Terminals: 64

With 64 terminals, the microcontroller can manage a multitude of interfaces and peripheral devices.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

This package style accommodates higher terminal densities, making it suitable for space-constrained applications.

Minimum Supply Voltage: 1.7 V

A low minimum supply voltage expands its usability in energy-efficient designs.

Maximum Operating Temperature: 85 °C

The ability to operate at high temperatures makes this microcontroller suitable for industrial applications.

CPU Family: CORTEX-M0

Based on the Cortex-M0 architecture, it offers a good balance of performance and power efficiency for many applications.

Minimum Operating Temperature: -40 °C

The capability to operate at extreme low temperatures is important for applications in harsh environments.

ADC Channels: YES

Embedded ADC channels enhance its functionality in acquiring analog signals from sensors.

DMA Channels: YES

DMA channels improve data handling efficiency, allowing for faster data transfers without CPU intervention.

Terminal Position: BOTTOM

Bottom terminal positioning simplifies PCB design and allows for easier integration into compact designs.

ROM Words: 524288

A large ROM capacity facilitates complex program storage, making it versatile for a variety of applications.

Maximum Seated Height: 0.6 mm

The very low profile is ideal for space-sensitive applications and helps reduce the overall size of the device.

Digital To Analog Converters: 2-Ch 12-Bit

The 12-bit resolution of the DACs allows for precise analog output needed in intricate control systems.

Width: 5 mm

A compact width makes it suitable for products where space is a critical consideration.

Peripherals: BOR, COMPARATOR(3), DMA(12), POR, RTC, TIMER(21), WDT(2)

An extensive set of peripherals enables versatile applications, from power management to real-time clock functionality.

Maximum Clock Frequency: 48 MHz

A 48 MHz clock frequency provides sufficient speed for a range of applications without consuming excessive power.

Length: 5 mm

The small length contributes to a compact design, making this microcontroller ideal for portable devices.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable performance in demanding environments.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture allows for efficient instruction execution, enhancing performance in various applications.

No. of Timers: 14

Multiple timers offer flexibility in creating varied timing applications, essential for signal control and output management.

RAM Bytes: 147456

A substantial amount of RAM supports complex processing needs and multi-tasking capabilities, making it efficient for advanced applications.

Technology: CMOS

CMOS technology contributes to low power consumption while maintaining high performance.

Terminal Form: BALL

Ball terminal form enhances connection reliability and optimizes space usage on PCB layouts.

Analog To Digital Convertors: 17-Ch 12-Bit

The high number of ADC channels allows for comprehensive data collection from a variety of sensors.

Maximum Supply Current: 9.4 mA

Relatively low supply current ensures the microcontroller is energy-efficient, extending battery life in portable applications.

Nominal Supply Voltage: 3 V

A standard nominal supply voltage enables compatibility with a broad range of devices and power sources.

No. of DMA Channels: 12

Numerous DMA channels facilitate extensive data management capabilities, improving performance in multitasking environments.

No. of Serial I/Os: 8

A good number of serial I/O lines increases the microcontroller's ability to communicate with various peripherals.

PWM Channels: YES

PWM channel support enables precise control of motors and other devices requiring speed or intensity modulation.

Connectivity: CAN(2), I2C(3), I2S(2), LPUART(2), SPI(3), USART(6), USB

Diverse connectivity options make the microcontroller highly adaptable for various communication needs in embedded systems.

ROM Programmability: FLASH

Flash ROM allows for easy updates and reprogramming, providing flexibility for evolving project requirements.

Terminal Pitch: 0.5 mm

A fine terminal pitch is ideal for high-density applications, optimizing PCB space.

Format: FIXED POINT

The fixed-point format is well-suited for applications in control systems where precise calculations are necessary.

Speed: 64 rpm

The speed rating indicates efficient processing and operational capabilities for relevant applications.

Low Power Mode: YES

The low power mode feature allows for energy savings in battery-operated devices, extending their operational life.

On Chip Program ROM Width: 8

An 8-bit program ROM width supports simpler program architectures, suitable for more confined applications.

No. of I/O Lines: 58

Having 58 I/O lines provides ample flexibility for interfacing with sensors, actuators, and other devices.

Technical Specifications

Microcontrollers STM32G0C1REI6NTR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

NO

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B64

Length:

5 mm

Low Power Mode:

YES

No. of DMA Channels:

12

No. of External Interrupts:

0

No. of I/O Lines:

58

No. of Serial I/Os:

8

No. of Terminals:

64

No. of Timers:

14

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA64,8X8,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

RAM Bytes:

147456

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

64 rpm

Maximum Supply Current:

9.4 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), I2C(3), I2S(2), LPUART(2), SPI(3), USART(6), USB

Peripherals:

BOR, COMPARATOR(3), DMA(12), POR, RTC, TIMER(21), WDT(2)

Analog To Digital Convertors:

17-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32G0C1REI6NTR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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