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STM32G0C1RCT6TR

STMicroelectronics

STM32G0C1RCT6TR by STMicroelectronics

STM32G0C1RCT6TR microcontroller from STMicroelectronics features a 32-bit Cortex-M0 CPU, operates b/w -40 °C to 85 °C, and supports up to 48 MHz clock speed. With 19 ADC channels and dual DACs, it's ideal for industrial applications requiring precision control. Its compact design ensures efficient integration in space-constrained environments.

Median Price

$3.340

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 27,000 parts In-Stock

1+ parts

-

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$3.340

1k+ parts

$2.585

10k+ parts

-

27,000

-

$3.340

$2.585

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Distributors (In-Stock)

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TME

Poland . 17,000 parts In-Stock

1+ parts

-

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-

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$3.520

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-

17,000

-

-

$3.520

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Vyrian

USA . 3,187 parts In-Stock

1+ parts

-

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-

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3,187

-

-

-

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Anansix

USA . 1,445 parts In-Stock

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1,445

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Digiode

USA . 808 parts In-Stock

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808

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Distributors (Availability)

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AZTECH Wire

Italy . 853 parts In-Stock

1+ parts

$15.250

100+ parts

-

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853

$15.250

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IDEA Electronic Components Group

UK . 2,344 parts In-Stock

1+ parts

$16.903

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-

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$15.213

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2,344

$16.903

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$15.213

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Microchip USA

USA . 3,291 parts In-Stock

1+ parts

$26.072

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3,291

$26.072

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MKK Technologies

India . 945 parts In-Stock

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$31.785

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945

$31.785

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DigiPath Technology Company

USA . 945 parts In-Stock

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$31.785

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945

$31.785

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Corphita

USA . 2,745 parts In-Stock

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2,745

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Parana Technologies

USA . 214 parts In-Stock

1+ parts

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$20.210

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214

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$20.210

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Overview

Unlock the potential of your projects with the STM32G0C1RCT6TR microcontroller from STMicroelectronics. Renowned for its exceptional reliability and performance, this versatile chip is perfect for a wide array of applications, from industrial automation to IoT devices. With low power consumption and advanced features, it empowers you to innovate while keeping costs down. Experience unmatched quality and support from a trusted leader in microcontroller technology!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy body provides reliability and robustness for various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient use of circuit board space.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V allows for compatibility with a wide range of low-power applications.

On Chip Data RAM Width: 8

An 8-bit data RAM width enhances performance in microcontroller applications requiring efficient data processing.

Package Shape: SQUARE

The square package shape is ideal for space-constrained designs while providing stable mounting.

Bit Size: 32

The 32-bit architecture enables the handling of complex applications and more extensive data processing.

DAC Channels: YES

Incorporating DAC channels allows for analog signal output, enhancing versatility in control applications.

No. of Terminals: 64

64 terminals provide ample connectivity options for various peripherals, making it suitable for diverse projects.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The low-profile flatpack style ensures a compact design ideal for space-sensitive applications.

Minimum Supply Voltage: 1.7 V

The low minimum supply voltage allows for flexibility and compatibility with a variety of power sources.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this microcontroller can operate effectively in higher temperature environments.

CPU Family: CORTEX-M0

The CORTEX-M0 family offers low power consumption and high efficiency, making it ideal for battery-operated devices.

Minimum Operating Temperature: -40 °C

The ability to function at -40 °C makes this microcontroller suitable for industrial and outdoor applications.

ADC Channels: YES

Integrated ADC channels allow for accurate digital conversion of real-world signals, enhancing data acquisition.

DMA Channels: YES

DMA channels facilitate efficient data transfer, reducing CPU load and improving overall system performance.

Terminal Position: QUAD

The quad terminal position enhances soldering efficiency and board layout flexibility.

ROM Words: 262144

A large ROM size allows for storage of extensive code, supporting complex applications.

Maximum Seated Height: 1.6 mm

The low seated height is beneficial for compact designs, ensuring devices can fit into tight spaces.

Digital To Analog Convertors: 2-Ch 12-Bit

The presence of dual 12-bit DACs allows for high-resolution analog output, ideal for precision applications.

Width: 10 mm

The compact width contributes to a smaller overall form factor, making it suitable for handheld and portable devices.

Peripherals: BOR, COMPARATOR(3), DMA(12), POR, RTC, TIMER(21), WDT(2)

An extensive list of peripherals enhances functionality, enabling a wide range of applications from timers to real-time data processing.

Maximum Clock Frequency: 48 MHz

A maximum clock frequency of 48 MHz allows for fast processing speed, improving responsiveness and performance.

Length: 10 mm

The short length also aids in reducing overall PCB space requirements.

Temperature Grade: INDUSTRIAL

An industrial temperature grade signifies durability and reliability in challenging environments.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller allows for simplified instruction sets and faster execution times.

No. of Timers: 14

The availability of 14 timers offers extensive timing functionalities, essential for multitasking operations.

RAM Bytes: 147456

Ample RAM size supports complex algorithms and data handling without the risk of memory shortages.

Technology: CMOS

CMOS technology ensures low power consumption, making this microcontroller energy-efficient for battery-powered applications.

Terminal Form: GULL WING

The gull wing design facilitates easy soldering and enhances mechanical stability on PCBs.

Analog To Digital Convertors: 19-Ch 12-Bit

A 19-channel 12-bit ADC provides extensive support for sensor interfacing and data acquisition in analog applications.

Maximum Supply Current: 9.4 mA

A maximum supply current of 9.4 mA aids in power conservation, which is beneficial for portable devices.

Nominal Supply Voltage: 3 V

Operating at a nominal voltage of 3 V is ideal for modern battery-operated devices, enhancing battery life.

No. of DMA Channels: 12

A total of 12 DMA channels provides high-speed data transfer capabilities between peripherals, improving efficiency.

No. of Serial I/Os: 8

With 8 serial I/O lines, this microcontroller can handle multiple communication protocols concurrently.

PWM Channels: YES

Pulse Width Modulation channels enable precise control of motors and other devices, adding to its versatility.

Connectivity: CAN(2), I2C(3), I2S(2), LPUART(2), SPI(3), USART(6), USB

Diverse connectivity options make it adaptable for various communication needs, suitable for complex networking.

ROM Programmability: FLASH

Flash ROM programmability allows for easy updates and modifications during development phases.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch offers high-density layout options, essential for compact designs.

Format: FIXED POINT

Fixed-point format optimizes performance for specific numerical computations, beneficial for DSP applications.

Speed: 64 rpm

The specified speed indicates suitability for specific applications, emphasizing its efficiency.

Low Power Mode: YES

Low power mode capability extends battery life in portable applications, enhancing user experience.

On Chip Program ROM Width: 8

An 8-bit program ROM width provides compatibility with various programming environments.

No. of I/O Lines: 60

Having 60 I/O lines supports extensive interfacing options for numerous external components and sensors.

Technical Specifications

Microcontrollers STM32G0C1RCT6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

NO

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

Low Power Mode:

YES

No. of DMA Channels:

12

No. of External Interrupts:

0

No. of I/O Lines:

60

No. of Serial I/Os:

8

No. of Terminals:

64

No. of Timers:

14

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

RAM Bytes:

147456

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

64 rpm

Maximum Supply Current:

9.4 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), I2C(3), I2S(2), LPUART(2), SPI(3), USART(6), USB

Peripherals:

BOR, COMPARATOR(3), DMA(12), POR, RTC, TIMER(21), WDT(2)

Analog To Digital Convertors:

19-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32G0C1RCT6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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