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STM32G0C1RCI6N

STMicroelectronics

STM32G0C1RCI6N by STMicroelectronics

STM32G0C1RCI6N microcontroller from STMicroelectronics features a 32-bit Cortex-M0 CPU, operates at a max voltage of 3.6V, and includes 17 ADC channels. Ideal for industrial applications, it supports various connectivity options like CAN and USB. Its compact design ensures efficient performance in space-constrained environments.

Median Price

-

Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 6,216 parts In-Stock

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6,216

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Digiode

USA . 4,288 parts In-Stock

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4,288

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Anansix

USA . 2,302 parts In-Stock

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2,302

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Distributors (Availability)

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AZTECH Wire

Italy . 185 parts In-Stock

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$12.680

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185

$12.680

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IDEA Electronic Components Group

UK . 1,946 parts In-Stock

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$15.833

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$14.250

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1,946

$15.833

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$14.250

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MKK Technologies

India . 458 parts In-Stock

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$29.773

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458

$29.773

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DigiPath Technology Company

USA . 458 parts In-Stock

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$29.773

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458

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Corphita

USA . 4,949 parts In-Stock

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4,949

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Parana Technologies

USA . 926 parts In-Stock

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$18.931

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926

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$18.931

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Overview

Unlock endless possibilities with the STM32G0C1RCI6N microcontroller from STMicroelectronics. Renowned for their commitment to quality and innovation, STMicroelectronics delivers a powerhouse that seamlessly integrates into diverse applications—from industrial automation to consumer electronics. Enjoy enhanced performance with low power consumption and versatile connectivity options, ensuring your projects are efficient and future-ready. Elevate your designs with reliability and precision!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight construction, making it suitable for various applications.

Surface Mount: YES

Allows for a compact design and easy integration into modern circuit boards.

Maximum Supply Voltage: 3.6 V

Operates within commonly available voltage ranges, enhancing compatibility with various power systems.

On Chip Data RAM Width: 8

Efficient memory structure for handling 8-bit data processing applications.

Package Shape: SQUARE

Saves PCB space, essential for compact device designs.

Bit Size: 32

Provides a good balance of performance and power consumption for various applications.

DAC Channels: YES

Enables direct digital to analog conversion, facilitating audio and signal processing applications.

No. of Terminals: 64

Provides ample connectivity options for complex designs without sacrificing performance.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Allows for high-density mounting, ideal for space-constrained applications.

Minimum Supply Voltage: 1.7 V

Supports low-power applications, extending battery life in portable devices.

Maximum Operating Temperature: 85 °C

Suitable for automotive and industrial applications where high temperatures are common.

CPU Family: CORTEX-M0

Low power consumption and cost-effective performance, ideal for embedded systems.

Minimum Operating Temperature: -40 °C

Perfect for extreme conditions, enhancing reliability in harsh environments.

ADC Channels: YES

Facilitates the conversion of analog signals to digital, crucial for sensor applications.

DMA Channels: YES

Improves data handling efficiency by allowing data transfers without CPU intervention.

Terminal Position: BOTTOM

Enhances thermal dissipation and minimizes parasitic inductance in high-speed applications.

ROM Words: 262144

Provides plenty of storage for code, supporting complex algorithms.

Maximum Seated Height: 0.6 mm

Compatible with low-profile designs, accommodating compact embedded systems.

Digital To Analog Convertors: 2-Ch 12-Bit

Provides precise digital to analog conversion, ideal for high-quality audio and signal applications.

Width: 5 mm

Compact design that allows for versatility in a variety of applications.

Peripherals: BOR, COMPARATOR(3), DMA(12), POR, RTC, TIMER(21), WDT(2)

Rich peripheral set enhances functionality, making it suitable for a wide range of embedded applications.

Maximum Clock Frequency: 48 MHz

Sufficient processing speed for many real-time applications without excessive power consumption.

Length: 5 mm

Compact size eases integration into space-constrained designs.

Temperature Grade: INDUSTRIAL

Ensures reliability in demanding environments, suitable for industrial and automotive applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Efficient architecture provides high speed and low power consumption.

No. of Timers: 14

Multiple timers allow for precise control and scheduling within applications.

RAM Bytes: 147456

Ample memory for data manipulation and storage in more complex applications.

Technology: CMOS

Ensures low power consumption, making it ideal for battery-operated devices.

Terminal Form: BALL

Allows for a robust connection and excellent heat dissipation.

Analog To Digital Convertors: 17-Ch 12-Bit

High-resolution ADCs enable accurate sensor reading and data acquisition.

Maximum Supply Current: 9.4 mA

Low current draw is beneficial for low-power applications, extending device longevity.

Nominal Supply Voltage: 3 V

Wide acceptance ensures compatibility with standard voltage levels in most applications.

No. of DMA Channels: 12

Facilitates efficient data transfers, freeing CPU cycles for other processing tasks.

No. of Serial I/Os: 8

Offers versatile connectivity options for various peripherals and devices.

PWM Channels: YES

Enable control of motors and other devices, making the microcontroller suitable for actuator applications.

Connectivity: CAN(2), I2C(3), I2S(2), LPUART(2), SPI(3), USART(6), USB

Diverse connectivity options make it ideal for networking and communication in embedded systems.

ROM Programmability: FLASH

Allows for easy updates and changes to the firmware post-deployment.

Terminal Pitch: 0.5 mm

Facilitates tighter placement of circuits, beneficial for board space-saving designs.

Format: FIXED POINT

Suits various applications requiring consistent precision, such as control systems.

Speed: 64 rpm

Designed for efficient processing, balancing performance and power consumption.

Low Power Mode: YES

Extends battery life significantly in portable devices, enhancing user experience.

On Chip Program ROM Width: 8

Efficiently handles 8-bit data processing, suitable for a variety of applications.

No. of I/O Lines: 58

High I/O line count enables maximum flexibility in interfacing with peripherals.

Technical Specifications

Microcontrollers STM32G0C1RCI6N attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

NO

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B64

Length:

5 mm

Low Power Mode:

YES

No. of DMA Channels:

12

No. of External Interrupts:

0

No. of I/O Lines:

58

No. of Serial I/Os:

8

No. of Terminals:

64

No. of Timers:

14

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA64,8X8,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

RAM Bytes:

147456

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

64 rpm

Maximum Supply Current:

9.4 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), I2C(3), I2S(2), LPUART(2), SPI(3), USART(6), USB

Peripherals:

BOR, COMPARATOR(3), DMA(12), POR, RTC, TIMER(21), WDT(2)

Analog To Digital Convertors:

17-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32G0C1RCI6N Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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