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STM32G0C1KEU6N

STMicroelectronics

STM32G0C1KEU6N by STMicroelectronics

STM32G0C1KEU6N microcontroller from STMicroelectronics features a 32-bit Cortex-M0 CPU, operates b/w -40 °C to 85 °C, and supports up to 48 MHz clock speed. With integrated ADC/DAC channels and low power modes, it's ideal for industrial applications. Its compact design ensures efficient performance in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,839 parts In-Stock

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7,839

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Digiode

USA . 2,912 parts In-Stock

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2,912

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Anansix

USA . 1,642 parts In-Stock

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1,642

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Distributors (Availability)

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AZTECH Wire

Italy . 1,160 parts In-Stock

1+ parts

$16.620

100+ parts

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1,160

$16.620

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Microchip USA

USA . 6,570 parts In-Stock

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$24.940

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6,570

$24.940

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IDEA Electronic Components Group

UK . 1,199 parts In-Stock

1+ parts

$55.747

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$50.173

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1,199

$55.747

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$50.173

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MKK Technologies

India . 1,334 parts In-Stock

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$104.829

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1,334

$104.829

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DigiPath Technology Company

USA . 1,334 parts In-Stock

1+ parts

$104.829

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1,334

$104.829

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Corphita

USA . 2,987 parts In-Stock

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2,987

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Parana Technologies

USA . 2,089 parts In-Stock

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$66.654

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2,089

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$66.654

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Overview

Elevate your projects with the STM32G0C1KEU6N microcontroller from STMicroelectronics—where quality meets innovation. Designed for versatility, it excels in applications ranging from industrial automation to IoT, offering low power consumption without compromising performance. With robust features like a dual DAC and multiple communication interfaces, it's perfect for dynamic designs. Trust in ST's legacy of excellence to maximize your development potential and deliver reliable solutions every time.

Feature Benefit Bullets

Surface Mount: YES

The surface mount capability makes it easier to integrate into compact designs and improves assembly efficiency.

Maximum Supply Voltage: 3.6 V

A relatively low maximum supply voltage enhances compatibility with low-power systems and portable devices.

On Chip Data RAM Width: 8

The 8-bit data RAM width ensures efficient data processing and storage for a variety of applications.

Package Shape: SQUARE

The square package shape facilitates better heat dissipation and optimized PCB layout.

Bit Size: 32

A 32-bit architecture allows for more complex calculations and improved performance in demanding applications.

DAC Channels: YES

Having DAC channels built-in provides the necessary analog output for applications requiring precision control.

No. of Terminals: 32

With 32 terminals, this microcontroller offers extensive connectivity options for various peripherals.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The design promotes efficient heat management and allows for slim profile PCBs.

Minimum Supply Voltage: 1.7 V

A low minimum supply voltage enables operation in battery-powered environments, extending battery life.

Maximum Operating Temperature: 85 °C

The high operating temperature rating allows use in demanding environments without compromising performance.

CPU Family: CORTEX-M0

The CORTEX-M0 CPU family is known for its low power consumption while providing robust processing capabilities.

Minimum Operating Temperature: -40 °C

The wide temperature range ensures reliable performance in harsh environmental conditions.

ADC Channels: YES

Built-in ADC channels enable the microcontroller to easily interface with analog sensors for data acquisition.

DMA Channels: YES

The presence of DMA channels improves data transfer efficiency, freeing the CPU for other tasks.

Terminal Position: QUAD

A quad terminal position allows for versatile mounting options on various PCB styles.

ROM Words: 524288

With 524288 ROM words, the microcontroller has ample space for complex firmware and applications.

Maximum Seated Height: 0.6 mm

The low seated height is advantageous for space-constrained designs.

Digital To Analog Converters: 2-Ch 12-Bit

The 2-channel 12-bit DACs provide high-resolution analog outputs, ideal for applications requiring precision.

Width: 5 mm

Compact width aids in design flexibility, especially for handheld and portable devices.

Peripherals: BOR, COMPARATOR(3), DMA(12), POR, RTC, TIMER(21), WDT(2)

A wide variety of integrated peripherals simplify design by reducing the need for external components.

Maximum Clock Frequency: 48 MHz

The 48 MHz clock frequency provides sufficient processing power for a variety of real-time applications.

Length: 5 mm

The short length complements the compact design, ideal for miniaturized electronics.

Temperature Grade: INDUSTRIAL

Classified for industrial use, ensuring durability and reliability in challenging environments.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture allows for efficient instruction execution, enhancing performance per watt.

No. of Timers: 14

Having 14 timers provides extensive functionality for real-time event management and timing operations.

RAM Bytes: 147456

Ample RAM size ensures smooth multitasking and efficient handling of larger data sets.

Technology: CMOS

CMOS technology supports low power consumption, making it suitable for battery-operated applications.

Terminal Form: NO LEAD

No lead terminal form reduces environmental impact and enhances compatibility for soldering processes.

Analog To Digital Converters: 12-Ch 12-Bit

The 12-channel, 12-bit ADCs allow for simultaneous measurements from multiple sensors, improving data acquisition speed.

Maximum Supply Current: 9.4 mA

The low supply current promotes energy efficiency, making this microcontroller ideal for low-power applications.

Nominal Supply Voltage: 3 V

The nominal supply voltage supports a stable operating condition while enhancing compatibility with common power supplies.

No. of DMA Channels: 12

With 12 DMA channels, the microcontroller can handle direct data transfers, optimizing performance and reducing CPU load.

No. of Serial I/Os: 8

Eight serial I/Os provide versatile communication options for connecting various peripherals and modules.

PWM Channels: YES

Support for PWM channels facilitates efficient motor control and signal modulation applications.

Connectivity: CAN(2), I2C(3), I2S(2), LPUART(2), SPI(3), USART(6), USB

Diverse connectivity options ensure compatibility with a broad range of devices and communication standards.

ROM Programmability: FLASH

Flash ROM programmability allows for easy firmware updates and modifications post-deployment.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch supports high-density designs, facilitating compact layouts.

Format: FIXED POINT

The fixed point format is effective for precise calculations in control systems and digital signal processing.

Speed: 64 rpm

The speed rating supports applications requiring consistent and reliable performance in low-speed scenarios.

Low Power Mode: YES

The low power mode helps conserve energy during idle periods, extending battery life.

On Chip Program ROM Width: 8

An 8-bit program ROM width is suitable for compact applications that do not require extensive code.

No. of I/O Lines: 29

Having 29 I/O lines provides flexibility for interfacing with various components and peripherals.

Technical Specifications

Microcontrollers STM32G0C1KEU6N attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

NO

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-XQCC-N32

Length:

5 mm

Low Power Mode:

YES

No. of DMA Channels:

12

No. of External Interrupts:

0

No. of I/O Lines:

29

No. of Serial I/Os:

8

No. of Terminals:

32

No. of Timers:

14

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

RAM Bytes:

147456

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

64 rpm

Maximum Supply Current:

9.4 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), I2C(3), I2S(2), LPUART(2), SPI(3), USART(6), USB

Peripherals:

BOR, COMPARATOR(3), DMA(12), POR, RTC, TIMER(21), WDT(2)

Analog To Digital Convertors:

12-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32G0C1KEU6N Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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