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STM32G0B1VCI6

STMicroelectronics

STM32G0B1VCI6 by STMicroelectronics

STM32G0B1VCI6 microcontroller from STMicroelectronics features a 32-bit Cortex-M0 CPU, operates at a max voltage of 3.6V, and includes 16 ADC channels. Ideal for industrial applications, it supports various connectivity options like CAN and USB. Its low power mode enhances efficiency in embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,133 parts In-Stock

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5,133

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Digiode

USA . 1,583 parts In-Stock

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1,583

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Anansix

USA . 1,391 parts In-Stock

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1,391

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Distributors (Availability)

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AZTECH Wire

Italy . 401 parts In-Stock

1+ parts

$12.140

100+ parts

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401

$12.140

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IDEA Electronic Components Group

UK . 49 parts In-Stock

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$77.043

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-

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$69.338

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49

$77.043

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$69.338

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MKK Technologies

India . 1,854 parts In-Stock

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$144.874

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1,854

$144.874

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DigiPath Technology Company

USA . 1,854 parts In-Stock

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$144.874

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1,854

$144.874

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Parana Technologies

USA . 1,705 parts In-Stock

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$92.116

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1,705

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$92.116

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Corphita

USA . 1,299 parts In-Stock

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1,299

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Overview

Unlock endless possibilities with the STM32G0B1VCI6 microcontroller from STMicroelectronics, a leader in innovation and quality. Designed for versatility, this compact powerhouse excels in low-power applications while delivering robust performance across various industrial sectors. With integrated DAC and ADC features, it empowers your designs with precision and efficiency. Experience unparalleled reliability and support as you leverage its advanced capabilities to drive your next project forward.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy in the package ensures lightweight and durability, making it suitable for various applications.

Integrated Cache: YES

Having an integrated cache enhances performance by speeding up data access, improving overall processing efficiency.

Surface Mount: YES

Surface mount technology allows for a compact design and ease of automation in manufacturing, optimizing space on PCBs.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6 V, this microcontroller is compatible with a wide range of low-voltage applications.

On Chip Data RAM Width: 8

An 8-bit data RAM width enables efficient data handling for various applications, allowing for flexible data manipulation.

Package Shape: SQUARE

The square shape of the package is conducive to efficient layout and routing in printed circuit boards.

Bit Size: 32

32-bit architecture supports high-performance applications, allowing for complex computations and wider data handling.

DAC Channels: YES

The integration of Digital-to-Analog Converters (DAC) allows for audio and signal processing applications, enhancing versatility.

No. of Terminals: 100

A larger number of terminals increases the microcontroller's connectivity options, allowing for more peripherals to be interfaced.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The very thin profile and fine pitch of the grid array is ideal for high-density designs, saving valuable space.

Minimum Supply Voltage: 1.7 V

A low minimum supply voltage makes this microcontroller suitable for low-power applications, which is ideal for battery-operated devices.

Maximum Operating Temperature: 85 °C

Operating up to 85 °C makes this microcontroller suitable for industrial applications where higher temperatures are prevalent.

CPU Family: CORTEX-M0

The CORTEX-M0 family supports efficient processing and low power consumption, making it ideal for embedded systems.

Minimum Operating Temperature: -40 °C

This microcontroller can operate in extreme temperatures, making it suitable for rugged applications in harsh environments.

ADC Channels: YES

The presence of Analog-to-Digital Converters (ADC) allows for sensor interfacing, making it versatile for different applications.

DMA Channels: YES

Direct Memory Access (DMA) channels improve data transfer rates and performance, reducing CPU load.

Terminal Position: BOTTOM

Bottom terminal positioning facilitates easy and efficient PCB assembly and heat dissipation.

ROM Words: 262144

A large ROM size ensures sufficient space for code storage, enhancing application capabilities.

Maximum Seated Height: 0.6 mm

The low seated height allows for a compact design, making it suitable for thin and portable devices.

Digital To Analog Convertors: 2-Ch 12-Bit

With 2 channels of 12-bit resolution, this DAC supports high-quality analog signal output for audio and control applications.

Width: 7 mm

The width of 7 mm contributes to a compact form factor, making it suitable for space-constrained designs.

Peripherals: BOR, COMPARATOR(3), DMA(12), POR, RTC, TIMER(13), WDT(2)

Multiple integrated peripherals enhance functionality, allowing for complex tasks to be handled within the microcontroller.

Maximum Clock Frequency: 48 MHz

A maximum clock frequency of 48 MHz provides sufficient processing power for moderate-speed applications.

Length: 7 mm

The compact length aids in building smaller circuit designs while maintaining the performance of the microcontroller.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable performance in various environmental conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture provides efficient instruction execution, enhancing performance and power efficiency.

No. of Timers: 13

A high number of timers enables complex timing operations, beneficial for control and scheduling applications.

RAM Bytes: 147456

Substantial RAM size allows for efficient data handling and processing, suitable for demanding applications.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, enhancing reliability in diverse applications.

Terminal Form: BALL

Ball terminal form allows for a smaller footprint on PCBs, optimizing space and improving layout options.

Analog To Digital Convertors: 16-Ch 12-Bit

With 16 channels of 12-bit ADC, it supports a wide variety of sensors, making it ideal for data acquisition.

Maximum Supply Current: 100 mA

A maximum supply current of 100 mA accommodates a range of peripheral devices and ensures robust performance.

Nominal Supply Voltage: 3 V

Optimized for a nominal supply voltage of 3 V, making it efficient for battery and low-power applications.

No. of DMA Channels: 12

12 DMA channels improve data transfer efficiency, making the microcontroller ideal for high-speed applications.

No. of Serial I/Os: 10

10 serial I/Os provide flexible communication options for interfacing with various devices.

PWM Channels: YES

Pulse Width Modulation (PWM) support allows for easy control of motors and other devices, enhancing versatility.

Connectivity: CAN(2), I2C(3), I2S(2), LPUART(2), SPI(3), USART(6), USB

Diverse connectivity options provide compatibility with many devices and communication standards, enhancing application flexibility.

ROM Programmability: FLASH

Flash programmability allows for easy and flexible software updates and customization of applications.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm supports high-density PCB designs, maximizing layout efficiency.

Format: FIXED-POINT

Fixed-point format enhances performance in applications where precise calculations are required, offering reliability.

Speed: 64 rpm

A speed rating of 64 rpm indicates suitability for slower, controlled operations, which is ideal for specific applications.

Low Power Mode: YES

Low power mode capability extends battery life for portable devices, making it ideal for energy-efficient applications.

On Chip Program ROM Width: 8

An 8-bit ROM width allows for efficient code execution and compact program storage.

No. of I/O Lines: 94

A high number of I/O lines enables extensive interfacing capabilities with various components and sensors.

Technical Specifications

Microcontrollers STM32G0B1VCI6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

3-ch internal adc available

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

NO

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED-POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B100

Length:

7 mm

Low Power Mode:

YES

No. of DMA Channels:

12

No. of I/O Lines:

94

No. of Serial I/Os:

10

No. of Terminals:

100

No. of Timers:

13

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA100,12X12,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

RAM Bytes:

147456

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

64 rpm

Maximum Supply Current:

100 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

7 mm

Peripheral IC Type:

Connectivity:

CAN(2), I2C(3), I2S(2), LPUART(2), SPI(3), USART(6), USB

Peripherals:

BOR, COMPARATOR(3), DMA(12), POR, RTC, TIMER(13), WDT(2)

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32G0B1VCI6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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