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STM32G0B1VBT6

STMicroelectronics

STM32G0B1VBT6 by STMicroelectronics

STM32G0B1VBT6 by STMicroelectronics is a 32-bit microcontroller with Cortex-M0 CPU family, offering 13 timers, 12 DMA channels, and 16-ch 12-bit ADCs. With a max clock frequency of 48 MHz and low power mode, it's ideal for industrial applications requiring high-speed processing and energy efficiency. The package style is flatpack with a low profile and fine pitch, making it suitable for compact designs in various electronic devices.

Median Price

$4.382

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 3,124 parts In-Stock

1+ parts

$2.950

100+ parts

$2.609

1k+ parts

$2.478

10k+ parts

-

3,124

$2.950

$2.609

$2.478

-

Chip1Stop

Japan . 1,620 parts In-Stock

1+ parts

$5.815

100+ parts

$4.235

1k+ parts

$3.059

10k+ parts

$2.962

1,620

$5.815

$4.235

$3.059

$2.962

Verical

USA . 3,124 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,124

-

-

-

-

Avnet

USA . 360 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

360

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,381 parts In-Stock

1+ parts

$5.045

100+ parts

-

1k+ parts

-

10k+ parts

-

4,381

$5.045

-

-

-

Nova Conductors

Japan . 54 parts In-Stock

1+ parts

$5.263

100+ parts

-

1k+ parts

-

10k+ parts

-

54

$5.263

-

-

-

IBS Electronics

USA . 24,930 parts In-Stock

1+ parts

-

100+ parts

$3.352

1k+ parts

$3.100

10k+ parts

$3.071

24,930

-

$3.352

$3.100

$3.071

ComSIT Distribution GmbH

Germany . 8,714 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,714

-

-

-

-

Vyrian

USA . 7,828 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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7,828

-

-

-

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Anansix

USA . 301 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

301

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 1,771 parts In-Stock

1+ parts

$2.720

100+ parts

$2.652

1k+ parts

$2.638

10k+ parts

-

1,771

$2.720

$2.652

$2.638

-

Ampacity Inc.

Singapore . 1,493 parts In-Stock

1+ parts

$2.740

100+ parts

-

1k+ parts

-

10k+ parts

-

1,493

$2.740

-

-

-

Corphita

USA . 3,164 parts In-Stock

1+ parts

$4.780

100+ parts

-

1k+ parts

-

10k+ parts

-

3,164

$4.780

-

-

-

Aranea Global

USA . 1,000 parts In-Stock

1+ parts

$5.158

100+ parts

-

1k+ parts

$4.951

10k+ parts

-

1,000

$5.158

-

$4.951

-

IDEA Electronic Components Group

UK . 352 parts In-Stock

1+ parts

$17.836

100+ parts

-

1k+ parts

$16.052

10k+ parts

-

352

$17.836

-

$16.052

-

AZTECH Wire

Italy . 988 parts In-Stock

1+ parts

$22.210

100+ parts

-

1k+ parts

-

10k+ parts

-

988

$22.210

-

-

-

Microchip USA

USA . 2,606 parts In-Stock

1+ parts

$31.637

100+ parts

-

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-

10k+ parts

-

2,606

$31.637

-

-

-

MKK Technologies

India . 60 parts In-Stock

1+ parts

$33.540

100+ parts

-

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-

10k+ parts

-

60

$33.540

-

-

-

DigiPath Technology Company

USA . 60 parts In-Stock

1+ parts

$33.540

100+ parts

-

1k+ parts

-

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-

60

$33.540

-

-

-

Corohmni

South Africa . 173 parts In-Stock

1+ parts

$38.320

100+ parts

-

1k+ parts

-

10k+ parts

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173

$38.320

-

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$40.214

100+ parts

$38.204

1k+ parts

$38.204

10k+ parts

-

1,000

$40.214

$38.204

$38.204

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Aztec Data Supply Inc.

USA . 1,462 parts In-Stock

1+ parts

$74.620

100+ parts

-

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-

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1,462

$74.620

-

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Parana Technologies

USA . 2,005 parts In-Stock

1+ parts

-

100+ parts

$21.326

1k+ parts

-

10k+ parts

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2,005

-

$21.326

-

-

Argo Parts USA

USA . 1,970 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,970

-

-

-

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Continental Prestige Electronics

USA . 465 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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465

-

-

-

-

Overview

Unleash the power of innovation with the STM32G0B1VBT6 microcontroller by STMicroelectronics. Crafted with precision and expertise, this versatile device opens up a world of possibilities for your projects. From industrial automation to consumer electronics, the STM32G0B1VBT6 offers unmatched performance and reliability. With its cutting-edge features and top-notch quality, this microcontroller delivers exceptional value and efficiency to customers. Experience the difference with STMicroelectronics and revolutionize the way you create and develop with the STM32G0B1VBT6.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and cost-effectiveness, making it suitable for a wide range of applications.

Integrated Cache: YES

Improves data access speed and overall performance of the microcontroller.

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and manufacturing costs.

Maximum Supply Voltage: 3.6 V

Provides flexibility in power supply options for various electronic systems.

On Chip Data RAM Width: 8

Enables efficient data processing and storage capabilities for the microcontroller.

Package Shape: SQUARE

Helps in optimizing PCB space utilization and layout design.

Bit Size: 32

High bit size allows for complex computations and data processing tasks.

DAC Channels: YES

Enables the generation of analog signals, expanding the microcontroller's functionality.

No. of Terminals: 100

Offers versatility in interfacing with external components and peripherals.

Package Style: FLATPACK, LOW PROFILE, FINE PITCH

Facilitates compact and space-saving PCB designs.

Minimum Supply Voltage: 1.7 V

Allows for operation in low-power applications while maintaining efficiency.

Maximum Operating Temperature: 85 °C

Ensures reliable performance even in harsh environmental conditions.

CPU Family: CORTEX-M0

Belongs to the energy-efficient Cortex-M0 family for optimized power consumption.

Minimum Operating Temperature: -40 °C

Supports operation in extreme cold environments without compromising performance.

ADC Channels: YES

Enables the microcontroller to interface with analog sensors and input devices.

DMA Channels: YES

Enhances data transfer efficiency and frees up CPU resources for other tasks.

Terminal Position: QUAD

Simplifies PCB layout and enhances signal integrity in multi-terminal configurations.

ROM Words: 131072

Provides ample program storage capacity for firmware and software applications.

Maximum Seated Height: 1.6 mm

Allows for slim and compact electronic device designs.

Digital To Analog Convertors: 2-Ch 12-Bit

Offers precise analog signal generation capabilities for various applications.

Width: 4 mm

Compact form factor enables integration into space-constrained devices.

Peripherals: BOR, COMPARATOR(3), DMA(12), POR, RTC, TIMER(13), WDT(2)

Offers a wide range of built-in peripherals for enhanced functionality.

Maximum Clock Frequency: 48 MHz

Provides high-speed processing capability for demanding applications.

Length: 14 mm

Optimal length for fitting into various electronic devices and systems.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial temperature ranges.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes RISC architecture for efficient data processing and control operations.

No. of Timers: 13

Supports multiple timing functions and event scheduling in the microcontroller.

RAM Bytes: 147456

Offers significant random access memory for storing data and variables during operation.

Technology: CMOS

Utilizes CMOS technology for efficient power consumption and performance.

Terminal Form: GULL WING

Facilitates reliable solder connections and secure terminal mounting.

Analog To Digital Convertors: 16-Ch 12-Bit

Allows for precise conversion of analog signals into digital data for processing.

Maximum Supply Current: 100 mA

Specifies the maximum current draw for proper power supply design.

Nominal Supply Voltage: 3 V

Indicates the recommended operating voltage for stable performance.

No. of DMA Channels: 12

Provides multiple DMA channels for efficient data transfer and processing.

No. of Serial I/Os: 10

Enables communication with multiple serial devices for data exchange.

PWM Channels: YES

Supports pulse-width modulation for controlling motors and voltage levels.

Connectivity: CAN(2), I2C(3), I2S(2), LPUART(2), SPI(3), USART(6), USB

Offers various communication interfaces for versatile connectivity options.

ROM Programmability: FLASH

Allows for easy reprogramming and updating of firmware through flash memory.

Terminal Pitch: 0.5 mm

Specifies the pitch distance for terminal connections, aiding in PCB layout.

Format: FIXED-POINT

Utilizes fixed-point arithmetic for precise numerical calculations and data processing.

Speed: 64 rpm

Indicates the maximum processing speed of the microcontroller for efficient operation.

Low Power Mode: YES

Features low power modes for energy-efficient operation and battery conservation.

On Chip Program ROM Width: 8

Enables storage of program code directly on the chip for quick access and execution.

No. of I/O Lines: 94

Offers multiple I/O lines for connecting external devices and components.

Technical Specifications

Microcontrollers STM32G0B1VBT6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

3-ch internal adc available

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

NO

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED-POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Low Power Mode:

YES

No. of DMA Channels:

12

No. of I/O Lines:

94

No. of Serial I/Os:

10

No. of Terminals:

100

No. of Timers:

13

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

RAM Bytes:

147456

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

64 rpm

Maximum Supply Current:

100 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

4 mm

Peripheral IC Type:

Connectivity:

CAN(2), I2C(3), I2S(2), LPUART(2), SPI(3), USART(6), USB

Peripherals:

BOR, COMPARATOR(3), DMA(12), POR, RTC, TIMER(13), WDT(2)

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32G0B1VBT6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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