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STM32G0B1RBI3NTR

STMicroelectronics

STM32G0B1RBI3NTR by STMicroelectronics

STM32G0B1RBI3NTR by STMicroelectronics is a 32-bit microcontroller with Cortex-M0 CPU family, offering 13 timers and 12 DMA channels. With a max clock frequency of 48 MHz, it features 14 ADC channels and 2 DAC channels for precise analog-to-digital conversion. Ideal for automotive applications due to its wide temperature range (-40°C to 125°C) and low power mode capability.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Component Sense

UK . 7,471 parts In-Stock

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Vyrian

USA . 7,026 parts In-Stock

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Anansix

USA . 2,548 parts In-Stock

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Digiode

USA . 1,672 parts In-Stock

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Nova Conductors

Japan . 30 parts In-Stock

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30

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Distributors (Availability)

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AZTECH Wire

Italy . 765 parts In-Stock

1+ parts

$12.772

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-

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765

$12.772

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IDEA Electronic Components Group

UK . 263 parts In-Stock

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$15.596

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-

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$14.036

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263

$15.596

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$14.036

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Microchip USA

USA . 8,655 parts In-Stock

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$23.916

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8,655

$23.916

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Ampacity Inc.

Singapore . 1,615 parts In-Stock

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$28.000

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$28.000

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MKK Technologies

India . 1,532 parts In-Stock

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$29.327

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1,532

$29.327

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DigiPath Technology Company

USA . 1,532 parts In-Stock

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$29.327

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1,532

$29.327

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Argo Parts USA

USA . 1,566 parts In-Stock

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Aranea Global

USA . 1,000 parts In-Stock

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Continental Prestige Electronics

USA . 449 parts In-Stock

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449

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Parana Technologies

USA . 224 parts In-Stock

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$18.647

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Corphita

USA . 113 parts In-Stock

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Overview

Unlock limitless possibilities with the STM32G0B1RBI3NTR by STMicroelectronics, a high-quality microcontroller designed to elevate your projects to new heights. With a wide range of applications in various industries, this innovative product boasts advanced features such as integrated cache and low power mode. Trust in STMicroelectronics' reputation for excellence and innovation, and experience the value and benefits this microcontroller brings to your designs. Power up your creations with the STM32G0B1RBI3NTR and unleash your full potential.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product durable and resistant to physical damage.

Integrated Cache: YES

The presence of integrated cache enhances the processing speed and performance of the microcontroller.

Maximum Supply Voltage: 3.6 V

The higher maximum supply voltage allows for flexibility in power supply options.

On Chip Data RAM Width: 8

Having a wide on-chip data RAM width improves the data processing capabilities of the microcontroller.

Package Shape: SQUARE

The square package shape makes it easier for efficient placement on circuit boards.

Bit Size: 32

The 32-bit architecture allows for handling larger data sizes and improved performance.

DAC Channels: YES

The presence of DAC channels enables the microcontroller to interface with analog devices efficiently.

No. of Terminals: 64

Having 64 terminals provides ample connectivity options for peripherals and external devices.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

This package style ensures a compact and lightweight design of the microcontroller.

Minimum Supply Voltage: 1.7 V

The low minimum supply voltage allows for energy-efficient operation and extends battery life.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature range makes the microcontroller suitable for industrial and automotive applications.

CPU Family: CORTEX-M0

Being part of the Cortex-M0 family ensures a balance between performance and power consumption.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range allows for reliable operation in extreme environmental conditions.

ADC Channels: YES

Having ADC channels enables the microcontroller to convert analog signals to digital data accurately.

DMA Channels: YES

The presence of DMA channels improves data transfer efficiency and reduces the load on the CPU.

Terminal Position: BOTTOM

Having terminals positioned at the bottom facilitates easy and secure connections on the circuit board.

ROM Words: 131072

With 131072 ROM words, the microcontroller can store a large amount of program memory for running complex algorithms.

Maximum Seated Height: 0.6 mm

The low maximum seated height allows for slim and compact device designs.

Digital To Analog Convertors: 2-Ch 12-Bit

The 2-channel, 12-bit DAC provides accurate and high-resolution analog output capabilities.

Width: 5 mm

The compact width of 5mm makes the microcontroller suitable for space-constrained applications.

Peripherals: BOR, COMPARATOR(3), DMA(12), POR, RTC, TIMER(13), WDT(2)

The variety of peripherals offered enhance the microcontroller's functionality and versatility in handling different tasks.

Maximum Clock Frequency: 48 MHz

The high maximum clock frequency enables fast data processing and execution of instructions.

Length: 5 mm

The short length of 5mm contributes to the overall compactness and ease of integration in devices.

Temperature Grade: AUTOMOTIVE

Being automotive-grade ensures reliability and performance in automotive applications where temperature variations are common.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture of the microcontroller ensures efficient and optimized processing of instructions.

No. of Timers: 13

Having 13 timers allows for precise timing and control in various applications.

RAM Bytes: 147456

With 147456 bytes of RAM, the microcontroller can efficiently handle and process data during operation.

Technology: CMOS

The CMOS technology used in the microcontroller offers low power consumption and high noise immunity.

Terminal Form: BALL

The ball terminal form enables reliable connections and easy soldering on the circuit board.

Analog To Digital Convertors: 14-Ch 12-Bit

The 14-channel, 12-bit ADC allows for accurate conversion of multiple analog signals simultaneously.

Maximum Supply Current: 100 mA

The low maximum supply current ensures energy efficiency and reduces power consumption.

Nominal Supply Voltage: 3 V

The 3V nominal supply voltage provides compatibility with standard power sources.

No. of DMA Channels: 12

Having 12 DMA channels improves data transfer efficiency and offloads tasks from the CPU.

No. of Serial I/Os: 10

Having 10 serial I/Os offers flexibility in interfacing with external devices and communication protocols.

PWM Channels: YES

The presence of PWM channels enables precise control of analog output signals for various applications.

Connectivity: CAN(2), I2C(3), I2S(2), LPUART(2), SPI(3), USART(6), USB

The multiple connectivity options facilitate seamless integration of the microcontroller with various communication interfaces and peripherals.

ROM Programmability: FLASH

The flash ROM programmability allows for easy and quick updates to the microcontroller's firmware.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5mm enables high-density mounting and space-saving on the circuit board.

Format: FIXED-POINT

The fixed-point format ensures accurate representation of numerical data and calculations in the microcontroller.

Speed: 64 rpm

With a speed of 64 rpm, the microcontroller can efficiently process instructions and data at a fast rate.

Low Power Mode: YES

The low power mode feature helps in reducing power consumption during idle or low-load scenarios, improving overall energy efficiency.

On Chip Program ROM Width: 8

Having an on-chip program ROM width of 8 enhances the storage capacity and performance of the microcontroller.

No. of I/O Lines: 58

With 58 I/O lines, the microcontroller offers ample connectivity options for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers STM32G0B1RBI3NTR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

3-ch internal adc available

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

NO

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED-POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B64

Length:

5 mm

Low Power Mode:

YES

No. of DMA Channels:

12

No. of I/O Lines:

58

No. of Serial I/Os:

10

No. of Terminals:

64

No. of Timers:

13

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA64,8X8,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

RAM Bytes:

147456

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

64 rpm

Maximum Supply Current:

100 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

5 mm

Peripheral IC Type:

Connectivity:

CAN(2), I2C(3), I2S(2), LPUART(2), SPI(3), USART(6), USB

Peripherals:

BOR, COMPARATOR(3), DMA(12), POR, RTC, TIMER(13), WDT(2)

Analog To Digital Convertors:

14-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32G0B1RBI3NTR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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