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STM32G0B1KEU3NTR

STMicroelectronics

STM32G0B1KEU3NTR by STMicroelectronics

STM32G0B1KEU3NTR microcontroller from STMicroelectronics features a 32-bit Cortex-M0 CPU, operates b/w -40 °C to 125 °C, and supports up to 48 MHz clock speed. It includes integrated DAC and ADC channels for versatile applications. Ideal for automotive use, it offers low power modes and extensive connectivity options.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 6,695 parts In-Stock

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6,695

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Digiode

USA . 734 parts In-Stock

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734

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Anansix

USA . 721 parts In-Stock

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721

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Distributors (Availability)

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AZTECH Wire

Italy . 175 parts In-Stock

1+ parts

$16.800

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175

$16.800

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IDEA Electronic Components Group

UK . 1,548 parts In-Stock

1+ parts

$24.370

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$21.933

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1,548

$24.370

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$21.933

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MKK Technologies

India . 2,110 parts In-Stock

1+ parts

$45.826

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2,110

$45.826

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DigiPath Technology Company

USA . 2,110 parts In-Stock

1+ parts

$45.826

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2,110

$45.826

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Component Stockers USA

USA . 1,552 parts In-Stock

1+ parts

$64.990

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1,552

$64.990

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Corphita

USA . 3,045 parts In-Stock

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3,045

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Parana Technologies

USA . 1,865 parts In-Stock

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$29.138

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1,865

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$29.138

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Overview

Unlock endless possibilities with the STM32G0B1KEU3NTR microcontroller from STMicroelectronics! Renowned for its exceptional quality and reliability, this powerful 32-bit Cortex-M0 device is ideal for automotive and industrial applications. With features like integrated DAC/ADC channels, energy-efficient performance, and a compact design, it offers outstanding value for developers seeking innovation and efficiency. Elevate your projects with ST's trusted technology and experience seamless connectivity and low power consumption!

Feature Benefit Bullets

Integrated Cache: YES

The presence of integrated cache enhances the performance of the microcontroller, allowing for faster data access and improved processing speeds.

Surface Mount: YES

Surface mount capability makes the microcontroller suitable for compact and high-density circuit designs, facilitating easier integration into modern electronics.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6 V, this microcontroller is energy-efficient and can operate effectively in low-power applications.

On Chip Data RAM Width: 8

An 8-bit RAM width ensures compatibility with a variety of data types, making it versatile for handling different applications.

Package Shape: SQUARE

The square package shape allows for efficient use of PCB space, enabling better routing and organization of electrical connections.

Bit Size: 32

A 32-bit architecture enhances the processing power, allowing for more complex computations and greater efficiency in handling larger data sets.

DAC Channels: YES

Inclusion of Digital-to-Analog Converter channels provides the ability to output analog signals, making it suitable for applications requiring sensor interfacing or audio output.

No. of Terminals: 32

Having 32 terminals allows for a greater number of interfaces and peripherals to be connected, increasing the flexibility of the microcontroller.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style ensures effective heat dissipation and allows for a compact design, which is crucial in high-performance applications.

Minimum Supply Voltage: 1.7 V

A low minimum supply voltage allows for battery-powered applications and increases overall energy efficiency.

Maximum Operating Temperature: 125 °C

The ability to operate at high temperatures makes this microcontroller suitable for automotive and industrial applications where extreme conditions are common.

CPU Family: CORTEX-M0

The Cortex-M0 core provides excellent energy efficiency and performance, making it ideal for low-power applications while maintaining powerful processing capabilities.

Minimum Operating Temperature: -40 °C

A wide operating temperature range enables the microcontroller to function reliably in harsh environmental conditions.

ADC Channels: YES

Availability of Analog-to-Digital Converter channels allows for precise analog signal measurements, essential for sensor applications.

DMA Channels: YES

Direct Memory Access channels improve data handling efficiency by allowing peripherals to transfer data without CPU intervention, reducing latency.

Terminal Position: QUAD

Quad terminal positioning provides better electrical performance and allows for simpler PCB design with fewer routing challenges.

ROM Words: 524288

A substantial amount of ROM allows for storing more complex and larger programs, facilitating advanced application development.

Maximum Seated Height: 0.6 mm

A low seated height contributes to a compact design, beneficial in applications where space-saving is crucial.

Digital To Analog Convertors: 2-Ch 12-Bit

Having dual 12-bit DACs enhances the microcontroller's capability for generating high-quality analog outputs, ideal for precision applications.

Width: 5 mm

The compact width supports space-constrained design environments while maintaining ample functionality.

Peripherals: BOR, COMPARATOR(3), DMA(12), POR, RTC, TIMER(13), WDT(2)

The variety of peripherals integrated into the microcontroller enriches its functionality, allowing for complex system designs without needing external components.

Maximum Clock Frequency: 48 MHz

A clock frequency of 48 MHz allows for efficient operation and timely processing capable of handling diverse tasks.

Length: 5 mm

The short length aids in creating compact designs while providing substantial features for various applications.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this microcontroller meets rigorous environmental and reliability standards necessary for vehicles.

Peripheral IC Type: MICROCONTROLLER, RISC

As a RISC microcontroller, it delivers efficient performance with minimal instruction cycles, optimizing power consumption and processing speed.

No. of Timers: 13

With 13 integrated timers, the microcontroller supports various timing tasks and events, crucial for control applications.

RAM Bytes: 147456

A high RAM capacity of 147456 bytes allows for more complex programs and data storage, enhancing overall processing ability.

Technology: CMOS

The use of CMOS technology results in lower power consumption and higher density of transistors, contributing to better performance and efficiency.

Terminal Form: NO LEAD

No lead terminal form factors facilitate soldering and improve the reliability of the connection, ensuring better performance in critical applications.

Analog To Digital Convertors: 10-Ch 12-Bit

The presence of 10 channels of 12-bit ADCs allows for multiple simultaneous measurements, making it highly suitable for processing multiple sensor inputs.

Maximum Supply Current: 100 mA

With a maximum supply current of 100 mA, this microcontroller is capable of driving various peripherals without needing external current sources.

Nominal Supply Voltage: 3 V

A nominal supply voltage of 3V aligns with common battery levels, promoting straightforward integration in battery-operated devices.

No. of DMA Channels: 12

With 12 DMA channels available, the microcontroller can efficiently manage data transfers between memory and peripherals, enhancing system throughput.

No. of Serial I/Os: 10

The availability of 10 serial I/Os provides options for connecting various serial devices, increasing the versatility of the microcontroller.

PWM Channels: YES

Presence of PWM channels allows for precise control of motors and other devices, making it ideal for applications requiring fine-tuned output signals.

Connectivity: CAN(2), I2C(3), I2S(2), LPUART(2), SPI(3), USART(6), USB

Diverse connectivity options increases flexibility, allowing the microcontroller to communicate with various devices, enhancing system integration.

ROM Programmability: FLASH

Flash memory programmability provides the ability to update firmware easily, allowing for quick iterations and adaptation in evolving projects.

Terminal Pitch: 0.5 mm

A smaller terminal pitch allows for higher component density on PCBs, making it ideal for miniaturized electronic designs.

Format: FIXED-POINT

The fixed-point format optimizes performance for specific applications, making the microcontroller highly efficient in handling numerical data.

Speed: 64 rpm

A speed rating of 64 rpm provides adequate performance for real-time applications, ensuring timely responses to inputs.

Low Power Mode: YES

The capability for low power mode extends battery life in portable applications, making it suitable for energy-sensitive designs.

On Chip Program ROM Width: 8

An 8-bit program ROM width allows for compatibility with a wide range of programming languages, simplifying development.

No. of I/O Lines: 29

With 29 I/O lines, this microcontroller provides extensive interfacing options for diverse applications, ensuring flexibility in system design.

Technical Specifications

Microcontrollers STM32G0B1KEU3NTR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

2-ch internal adc available

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

NO

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED-POINT

Integrated Cache:

YES

JESD-30 Code:

S-XQCC-N32

Length:

5 mm

Low Power Mode:

YES

No. of DMA Channels:

12

No. of I/O Lines:

29

No. of Serial I/Os:

10

No. of Terminals:

32

No. of Timers:

13

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

RAM Bytes:

147456

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

64 rpm

Maximum Supply Current:

100 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Peripheral IC Type:

Connectivity:

CAN(2), I2C(3), I2S(2), LPUART(2), SPI(3), USART(6), USB

Peripherals:

BOR, COMPARATOR(3), DMA(12), POR, RTC, TIMER(13), WDT(2)

Analog To Digital Convertors:

10-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32G0B1KEU3NTR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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