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STM32G0B1KCU6N

STMicroelectronics

STM32G0B1KCU6N by STMicroelectronics

STM32G0B1KCU6N by STMicroelectronics is a 32-bit microcontroller with Cortex-M0 CPU family, operating at 48 MHz. It features 147456 bytes of RAM, 262144 ROM words, and 10-Ch 12-Bit ADC channels. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities.

Median Price

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4

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Vyrian

USA . 5,044 parts In-Stock

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Digiode

USA . 4,294 parts In-Stock

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Anansix

USA . 2,614 parts In-Stock

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Nova Conductors

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AZTECH Wire

Italy . 852 parts In-Stock

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$5.006

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Ampacity Inc.

Singapore . 433 parts In-Stock

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$15.000

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Corohmni

South Africa . 1,049 parts In-Stock

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Aztec Data Supply Inc.

USA . 1,976 parts In-Stock

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$53.140

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IDEA Electronic Components Group

UK . 239 parts In-Stock

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$70.000

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$63.000

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MKK Technologies

India . 1,516 parts In-Stock

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$131.631

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DigiPath Technology Company

USA . 1,516 parts In-Stock

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Continental Prestige Electronics

USA . 6,226 parts In-Stock

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Argo Parts USA

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Corphita

USA . 3,744 parts In-Stock

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Authorized Procurement Solutions

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Parana Technologies

USA . 72 parts In-Stock

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$83.696

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Overview

Unlock the potential of your projects with the STM32G0B1KCU6N microcontroller by STMicroelectronics. Offering top-notch quality and reliability, this powerful device is perfect for a wide range of applications. From industrial automation to consumer electronics, this Cortex-M0 CPU family product is designed to deliver exceptional performance. With integrated cache and a wide array of peripherals, including ADC channels and PWM channels, this microcontroller provides unmatched value and benefits to customers. Trust in STMicroelectronics to meet all your embedded system needs with the STM32G0B1KCU6N.

Feature Benefit Bullets

Integrated Cache: YES

Having an integrated cache allows for faster data access and improved performance, making this microcontroller a great choice for applications requiring high-speed processing.

Surface Mount: YES

The ability to be surface mounted makes installation easier and more efficient, making this microcontroller a convenient choice for compact designs or mass production.

Maximum Supply Voltage: 3.6 V

With a relatively high maximum supply voltage, this microcontroller is suitable for applications that require higher voltage levels, providing flexibility in design.

On Chip Data RAM Width: 8

The wide on-chip data RAM width enhances data processing capabilities, making this microcontroller a powerful choice for tasks that involve handling large amounts of data simultaneously.

Package Shape: SQUARE

The square package shape offers a compact footprint, maximizing board space efficiency and making this microcontroller ideal for designs with space constraints.

Bit Size: 32

The 32-bit architecture allows for higher computational power and precision, making this microcontroller a reliable choice for demanding tasks that require complex calculations.

DAC Channels: YES

The inclusion of DAC channels enables analog signal processing, making this microcontroller suitable for applications requiring precise control over analog outputs.

No. of Terminals: 32

With a sufficient number of terminals, this microcontroller offers ample connectivity options, making it versatile for various interfaces and peripherals.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of different package styles provides flexibility in mounting and cooling options, making this microcontroller adaptable to different environmental conditions and design requirements.

Minimum Supply Voltage: 1.7 V

The low minimum supply voltage allows for operation in power-constrained environments, making this microcontroller energy-efficient and suitable for battery-powered applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this microcontroller can withstand elevated temperatures, making it ideal for industrial or harsh environments.

CPU Family: CORTEX-M0

Belonging to the Cortex-M0 family ensures compatibility with industry-standard architectures and tools, making this microcontroller a reliable choice for development and programming.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature capability enables operation in cold environments, making this microcontroller suitable for outdoor or refrigerated applications.

ADC Channels: YES

The availability of ADC channels allows for analog signal conversion, enhancing the microcontroller's versatility for applications requiring precise analog inputs.

DMA Channels: YES

Supporting DMA channels enables efficient data transfer without CPU intervention, enhancing performance for applications with high data throughput requirements.

Terminal Position: QUAD

The quad terminal position provides a stable and secure connection, ensuring reliable operation in applications that involve movement or vibration.

ROM Words: 262144

With a large ROM capacity, this microcontroller can store extensive program code, making it suitable for applications that require complex algorithms or multiple functions.

Maximum Seated Height: 0.6 mm

The low maximum seated height allows for compact and thin designs, making this microcontroller a good choice for slim form factor applications.

Digital To Analog Convertors: 2-Ch 12-Bit

Offering two 12-bit DAC channels enhances analog output resolution, making this microcontroller suitable for applications requiring precise analog control.

Width: 5 mm

The compact width dimension saves board space and facilitates integration into tight layouts, making this microcontroller suitable for space-constrained designs.

Peripherals: BOR, COMPARATOR(3), DMA(12), POR, RTC, TIMER(13), WDT(2)

The variety of peripherals available enhances the microcontroller's capabilities and versatility, making it suitable for a wide range of applications that require different interfacing options.

Maximum Clock Frequency: 48 MHz

With a high maximum clock frequency, this microcontroller can execute tasks quickly and efficiently, making it suitable for applications that demand high-speed processing.

Length: 5 mm

The compact length dimension contributes to space-efficient design layouts, making this microcontroller a good choice for small form factor applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh industrial environments, making this microcontroller suitable for industrial automation or control systems.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller ensures efficient and optimized processing, making it a reliable choice for applications requiring fast and precise execution of code.

No. of Timers: 13

With 13 timers available, this microcontroller offers extensive timing functions, making it suitable for applications that require precise timekeeping or scheduling capabilities.

RAM Bytes: 147456

The generous RAM capacity allows for storing and manipulating large amounts of data, making this microcontroller suitable for memory-intensive applications.

Technology: CMOS

The CMOS technology used in this microcontroller offers low power consumption and high noise immunity, making it an energy-efficient and reliable choice for battery-powered or noise-sensitive applications.

Terminal Form: NO LEAD

The no-lead terminal form simplifies the mounting process and improves reliability, making this microcontroller easy to handle and suitable for automated assembly.

Analog To Digital Convertors: 10-Ch 12-Bit

With ten 12-bit ADC channels, this microcontroller enables accurate analog signal conversion, making it suitable for applications with multiple analog input requirements.

Maximum Supply Current: 100 mA

The low maximum supply current consumption promotes energy efficiency, making this microcontroller suitable for applications with strict power consumption requirements.

Nominal Supply Voltage: 3 V

The nominal supply voltage of 3V ensures compatibility with common power sources, making this microcontroller easy to integrate into existing systems or designs.

No. of DMA Channels: 12

Having 12 DMA channels allows for efficient data transfer and processing, enhancing the microcontroller's performance in applications with high data throughput demands.

No. of Serial I/Os: 10

With 10 serial I/Os available, this microcontroller supports multiple communication interfaces, making it versatile and suitable for applications that require interfacing with various devices.

PWM Channels: YES

The presence of PWM channels enables precise control over digital signals, making this microcontroller suitable for applications requiring accurate pulse width modulation.

Connectivity: CAN(2), I2C(3), I2S(2), LPUART(2), SPI(3), USART(6), USB

The diverse connectivity options ensure compatibility with a wide range of communication protocols, making this microcontroller versatile and suitable for interfacing with different devices and systems.

ROM Programmability: FLASH

The flash programmability of ROM enables easy and flexible firmware updates, making this microcontroller suitable for applications that require frequent software modifications.

Terminal Pitch: 0.5 mm

The fine terminal pitch allows for high-density mounting, making this microcontroller suitable for applications that demand compact circuit designs and miniaturization.

Format: FIXED-POINT

Using a fixed-point format simplifies numerical calculations and optimizes processing speed, making this microcontroller efficient for applications requiring precise arithmetic operations.

Speed: 64 rpm

The speed rating of 64 rpm indicates the microcontroller's processing capability, making it suitable for applications that require specific performance levels.

Low Power Mode: YES

The availability of low power mode allows for energy-saving operation, making this microcontroller suitable for battery-powered or energy-efficient applications.

On Chip Program ROM Width: 8

The wide on-chip program ROM width enhances code storage capacity, making this microcontroller suitable for applications that require extensive program memory.

No. of I/O Lines: 29

With 29 I/O lines, this microcontroller offers ample interfacing options, making it versatile for applications requiring connectivity to multiple external devices.

Technical Specifications

Microcontrollers STM32G0B1KCU6N attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

2-ch internal adc available

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

NO

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED-POINT

Integrated Cache:

YES

JESD-30 Code:

S-XQCC-N32

Length:

5 mm

Low Power Mode:

YES

No. of DMA Channels:

12

No. of I/O Lines:

29

No. of Serial I/Os:

10

No. of Terminals:

32

No. of Timers:

13

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

RAM Bytes:

147456

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

64 rpm

Maximum Supply Current:

100 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Peripheral IC Type:

Connectivity:

CAN(2), I2C(3), I2S(2), LPUART(2), SPI(3), USART(6), USB

Peripherals:

BOR, COMPARATOR(3), DMA(12), POR, RTC, TIMER(13), WDT(2)

Analog To Digital Convertors:

10-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32G0B1KCU6N Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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