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STM32G0B1CCU7

STMicroelectronics

STM32G0B1CCU7 by STMicroelectronics

STM32G0B1CCU7 microcontroller from STMicroelectronics features a 32-bit Cortex-M0 CPU, operates b/w -40 °C to 105 °C, and supports up to 48 MHz clock speed. It includes integrated DAC and ADC channels for versatile applications. Ideal for industrial automation and IoT devices, it offers low power modes and extensive connectivity options.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,605 parts In-Stock

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8,605

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Digiode

USA . 3,500 parts In-Stock

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3,500

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Anansix

USA . 316 parts In-Stock

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316

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Distributors (Availability)

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AZTECH Wire

Italy . 360 parts In-Stock

1+ parts

$21.670

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360

$21.670

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IDEA Electronic Components Group

UK . 2,254 parts In-Stock

1+ parts

$56.425

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$50.782

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2,254

$56.425

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$50.782

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MKK Technologies

India . 13 parts In-Stock

1+ parts

$106.103

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13

$106.103

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DigiPath Technology Company

USA . 13 parts In-Stock

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$106.103

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13

$106.103

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Corphita

USA . 2,675 parts In-Stock

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2,675

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Parana Technologies

USA . 1,665 parts In-Stock

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$67.464

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1,665

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$67.464

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Overview

Unlock unparalleled performance with the STM32G0B1CCU7 microcontroller from STMicroelectronics—your trusted partner in innovative technology. Designed for industrial applications, this powerful yet efficient solution boasts low power consumption and robust features, ensuring reliability in challenging environments. With integrated peripherals and advanced connectivity options, it empowers developers to create cutting-edge solutions that enhance productivity and innovation. Elevate your projects with the quality and expertise of STMicroelectronics!

Feature Benefit Bullets

Integrated Cache: YES

The inclusion of an integrated cache enhances data access speeds, resulting in quicker processing and improved overall performance.

Surface Mount: YES

Surface mount technology allows for efficient use of board space and facilitates automated assembly, making it suitable for compact designs.

Maximum Supply Voltage: 3.6 V

The maximum supply voltage is optimal for low-power applications, ensuring compatibility with modern power supply standards.

On Chip Data RAM Width: 8

An 8-bit data RAM width provides sufficient memory bandwidth for many applications, balancing performance and power consumption.

Package Shape: SQUARE

The square package shape offers an efficient layout for PCB design, enabling better heat dissipation and placement flexibility.

Bit Size: 32

A 32-bit architecture allows for better processing power and more complex calculations, making it ideal for advanced applications.

DAC Channels: YES

With DAC channels available, the microcontroller can generate analog signals, which is essential for audio and sensor applications.

No. of Terminals: 48

A larger number of terminals facilitates extensive connectivity and multiple peripheral interfacing for versatile application designs.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style ensures effective heat management and is suitable for high-performance applications with space constraints.

Minimum Supply Voltage: 1.7 V

The low minimum supply voltage enhances power efficiency, making the microcontroller suitable for battery-operated devices.

Maximum Operating Temperature: 105 °C

A high maximum operating temperature rating ensures reliability and performance in harsh environments, ideal for industrial applications.

CPU Family: CORTEX-M0

The ARM Cortex-M0 core offers a balance of performance and efficiency, making it suitable for a wide range of embedded applications.

Minimum Operating Temperature: -40 °C

The ability to operate at low temperatures is indicative of robustness in extreme conditions, making this microcontroller suitable for outdoor or industrial use.

ADC Channels: YES

The presence of ADC channels allows for direct analog input processing, providing versatility for sensor integration.

DMA Channels: YES

DMA channels facilitate efficient data transfers, reducing CPU load and enhancing overall processing performance.

Terminal Position: QUAD

Quad terminal positioning allows for compact layout and better routing options on PCBs, ideal for dense designs.

ROM Words: 262144

A generous ROM capacity enables extensive program storage, supporting complex applications with significant code requirements.

Maximum Seated Height: 0.6 mm

The low seated height ensures compatibility with various PCB designs, allowing for more streamlined products.

Digital To Analog Converters: 2-Ch 12-Bit

The dual 12-bit DAC channels provide high-resolution analog outputs, making it suitable for precise control applications.

Width: 7 mm

Compact dimensions enable efficient use of board space, making it suitable for space-constrained applications.

Peripherals: BOR, COMPARATOR(3), DMA(12), POR, RTC, TIMER(13), WDT(2)

An extensive range of built-in peripherals increases functionality and reduces the need for external components, simplifying design.

Maximum Clock Frequency: 48 MHz

A 48 MHz clock frequency provides sufficient speed for most embedded applications, ensuring responsive performance.

Length: 7 mm

The 7 mm length contributes to the overall compact profile, facilitating integration into small devices.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures reliable operation in challenging environments, broadening its application range.

Peripheral IC Type: MICROCONTROLLER, RISC

As a RISC-based microcontroller, it provides efficient processing with a reduced instruction set, enhancing execution speed.

No. of Timers: 13

With 13 timers, it supports complex timing operations necessary for various tasks in embedded systems.

RAM Bytes: 147456

A significant RAM size enables smooth multitasking and enables handling of larger data sets for complex applications.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption and high efficiency, making it ideal for battery-powered devices.

Terminal Form: NO LEAD

A no-lead terminal form factor aids in effective heat dissipation and enhances compatibility with modern PCB designs.

Analog To Digital Convertors: 14-Ch 12-Bit

The 14-channel 12-bit ADC enables diverse analog input processing, accommodating various sensor inputs, which is vital in embedded systems.

Maximum Supply Current: 100 mA

A maximum supply current of 100 mA allows for robust performance while still adhering to low-power design principles.

Nominal Supply Voltage: 3 V

The nominal supply voltage aligns well with common embedded power sources, simplifying integration.

No. of DMA Channels: 12

Having 12 DMA channels allows for efficient data management in memory-intensive applications, reducing CPU burden.

No. of Serial I/Os: 10

Ten serial I/O lines provide ample connectivity options for various peripherals, enhancing the microcontroller's versatility.

PWM Channels: YES

PWM capabilities allow for control of motors and other devices, adding valuable functionality for automation projects.

Connectivity: CAN(2), I2C(3), I2S(2), LPUART(2), SPI(3), USART(6), USB

Extensive connectivity options enhance integration possibilities with various devices and protocols, making it adaptable for a range of applications.

ROM Programmability: FLASH

Flash ROM programmability allows for easy code updates and modifications, ensuring long-term flexibility in applications.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch provides compatibility with advanced PCB designs, allowing for high-density connections.

Format: FIXED-POINT

Fixed-point format processing allows for efficient mathematical calculations typical in embedded systems, enhancing processing efficiency.

Speed: 64 rpm

The specified speed is effective for low-speed applications, making the microcontroller suitable for various control tasks.

Low Power Mode: YES

Low power mode capabilities assist in energy conservation, ideal for applications requiring long battery life.

On Chip Program ROM Width: 8

An 8-bit program ROM width allows for efficient instruction processing, balancing performance and power consumption.

No. of I/O Lines: 44

With 44 I/O lines available, the microcontroller can interface with multiple peripherals, providing great flexibility for complex systems.

Technical Specifications

Microcontrollers STM32G0B1CCU7 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

3-ch internal adc available

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

NO

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED-POINT

Integrated Cache:

YES

JESD-30 Code:

S-XQCC-N48

Length:

7 mm

Low Power Mode:

YES

No. of DMA Channels:

12

No. of I/O Lines:

44

No. of Serial I/Os:

10

No. of Terminals:

48

No. of Timers:

13

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

RAM Bytes:

147456

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

64 rpm

Maximum Supply Current:

100 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Connectivity:

CAN(2), I2C(3), I2S(2), LPUART(2), SPI(3), USART(6), USB

Peripherals:

BOR, COMPARATOR(3), DMA(12), POR, RTC, TIMER(13), WDT(2)

Analog To Digital Convertors:

14-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32G0B1CCU7 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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