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STM32G061K8T6

STMicroelectronics

STM32G061K8T6 by STMicroelectronics

STM32G061K8T6 microcontroller from STMicroelectronics features a 32-bit Cortex-M0+ CPU, operates at a max voltage of 3.6V, and includes 18 ADC channels. With low power modes and extensive connectivity options, it's ideal for industrial applications. Its compact design ensures efficient integration in various devices.

Median Price

$3.850

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 141 parts In-Stock

1+ parts

$3.850

100+ parts

$2.100

1k+ parts

$1.430

10k+ parts

$1.390

141

$3.850

$2.100

$1.430

$1.390

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 751 parts In-Stock

1+ parts

$2.736

100+ parts

-

1k+ parts

-

10k+ parts

-

751

$2.736

-

-

-

Vyrian

USA . 11,850 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

11,850

-

-

-

-

Anansix

USA . 2,260 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,260

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,749 parts In-Stock

1+ parts

$2.592

100+ parts

-

1k+ parts

-

10k+ parts

-

3,749

$2.592

-

-

-

Microchip USA

USA . 4,765 parts In-Stock

1+ parts

$13.256

100+ parts

-

1k+ parts

-

10k+ parts

-

4,765

$13.256

-

-

-

IDEA Electronic Components Group

UK . 1,819 parts In-Stock

1+ parts

$73.554

100+ parts

-

1k+ parts

$66.199

10k+ parts

-

1,819

$73.554

-

$66.199

-

MKK Technologies

India . 1,759 parts In-Stock

1+ parts

$138.314

100+ parts

-

1k+ parts

-

10k+ parts

-

1,759

$138.314

-

-

-

DigiPath Technology Company

USA . 1,759 parts In-Stock

1+ parts

$138.314

100+ parts

-

1k+ parts

-

10k+ parts

-

1,759

$138.314

-

-

-

Parana Technologies

USA . 1,480 parts In-Stock

1+ parts

-

100+ parts

$87.945

1k+ parts

-

10k+ parts

-

1,480

-

$87.945

-

-

Overview

Unlock the potential of your next project with the STM32G061K8T6 microcontroller from STMicroelectronics. Renowned for their quality and innovation, STMicroelectronics delivers a versatile solution perfect for low-power applications across IoT, industrial automation, and consumer electronics. With its compact design and robust features, including advanced ADC/DAC capabilities, this microcontroller ensures seamless connectivity and impressive performance, empowering you to create smarter, more efficient designs. Experience reliability and excellence that set your projects apart!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy construction ensures good reliability and protection against environmental factors.

Surface Mount: YES

Surface mount capability allows for compact designs and ease of integration into modern electronic devices.

Maximum Supply Voltage: 3.6 V

With a maximum voltage of 3.6V, this microcontroller can be used in low voltage applications without risk of damage.

On Chip Data RAM Width: 8

An 8-bit RAM width allows efficient data handling, suitable for a variety of applications.

Package Shape: SQUARE

The square package shape is space-efficient and can simplify PCB layout.

Bit Size: 32

The 32-bit architecture provides enhanced computational performance over 8-bit and 16-bit controllers.

DAC Channels: YES

Having digital to analog converters enables direct control of analog devices, improving flexibility in applications.

No. of Terminals: 32

32 terminals provide sufficient input/output pins for complex interfacing needs.

Package Style (Meter): FLATPACK, LOW PROFILE

The low profile flatpack design ensures minimal height, which is crucial for compact electronic designs.

Minimum Supply Voltage: 1.7 V

Operational down to 1.7V, this microcontroller is suitable for battery-operated or energy-efficient applications.

Maximum Operating Temperature: 85 °C

The high operating temperature range allows for use in industrial applications where conditions can be demanding.

CPU Family: Cortex-M0+

Based on the efficient Cortex-M0+ architecture, it delivers a balance of performance and low power consumption.

No. of External Interrupts: 30

With 30 external interrupts, the microcontroller can respond to multiple events, enhancing versatility and responsiveness.

Minimum Operating Temperature: -40 °C

The -40 °C minimum ensures reliability in extreme environments, suitable for industrial and outdoor applications.

ADC Channels: YES

The presence of ADC channels allows for direct reading of sensors and other analog signals, enhancing measurement capabilities.

DMA Channels: YES

DMA support improves data transfer efficiency, reducing CPU load and enhancing overall performance.

Terminal Position: QUAD

Quad terminal positioning ensures stability and ease of soldering on PCBs.

ROM Words: 65536

A generous ROM capacity of 65536 words allows for complex application code storage.

Maximum Seated Height: 1.6 mm

Low profile height allows for compact designs, making it an ideal choice for space-constrained applications.

Digital To Analog Converters: 2 Ch 12-Bit

Two 12-bit DAC channels offer high-resolution output, suitable for precise control tasks.

Width: 7 mm

The compact width is advantageous for tight PCB layouts and miniaturized devices.

Peripherals: BOR, COMPARATOR(2), DMA(7), POR, PDR, PVD, RTC, TIMER(12), WDT(2)

The extensive peripheral set enhances functionality, allowing varied applications from timing to power management.

Maximum Clock Frequency: 48 MHz

A high clock frequency of 48 MHz supports fast processing, improving application responsiveness.

Length: 7 mm

Like the width, the length of 7 mm contributes to the compactness of the design, ideal for portable devices.

Temperature Grade: INDUSTRIAL

Industrial grade ensures robustness and reliability for demanding applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC microcontroller means it's efficient in processing, consuming less power for operations.

No. of Timers: 12

The inclusion of 12 timers allows for precise timing control in various applications.

RAM Bytes: 18432

Adequate RAM capacity ensures smooth operation even for complex tasks, improving multitasking capabilities.

Technology: CMOS

CMOS technology enables lower power consumption, making it ideal for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals simplify the soldering process, ensuring reliable connections on PCBs.

Analog To Digital Convertors: 18-Ch 12-Bit

With 18 12-bit ADC channels, this microcontroller provides extensive analog input capabilities for sensor integration.

Maximum Supply Current: 7.3 mA

A low maximum supply current of 7.3 mA enhances energy efficiency, crucial for battery-powered designs.

Nominal Supply Voltage: 3 V

The nominal supply voltage of 3V is common in many applications, making it versatile and easy to implement.

No. of DMA Channels: 7

Having 7 DMA channels supports efficient and fast data handling, essential for real-time applications.

No. of Serial I/Os: 3

Three serial I/O ports support diverse communication protocols, increasing compatibility with other devices.

PWM Channels: YES

PWM support is crucial for applications requiring precise control of motors and other devices.

Connectivity: I2C(2), I2S, LPUART, SPI(2), USART(2)

Multiple connectivity options ensure integration with a variety of peripherals and communication standards.

ROM Programmability: FLASH

FLASH programmability offers flexibility for updates and modifications in software applications.

Terminal Pitch: 0.8 mm

A 0.8 mm terminal pitch ensures compatibility with standard PCB design practices.

Format: FIXED POINT

Fixed point formatting allows for efficient numerical calculations in embedded applications.

Speed: 64 rpm

A controlled speed of 64 rpm is ideal for moderate performance tasks without excessive power usage.

Low Power Mode: YES

Low power mode capabilities contribute to energy conservation, particularly beneficial for battery-operated devices.

On Chip Program ROM Width: 8

An 8-bit program ROM width supports compatibility with 8-bit data structures while allowing for larger functionality.

No. of I/O Lines: 30

Having 30 I/O lines significantly enhances versatility in connecting multiple peripherals and sensors.

Technical Specifications

Microcontrollers STM32G061K8T6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

NO

CPU Family:

Cortex-M0+

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G32

Length:

7 mm

Low Power Mode:

YES

No. of DMA Channels:

7

No. of External Interrupts:

30

No. of I/O Lines:

30

No. of Serial I/Os:

3

No. of Terminals:

32

No. of Timers:

12

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

RAM Bytes:

18432

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

64 rpm

Maximum Supply Current:

7.3 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), I2S, LPUART, SPI(2), USART(2)

Peripherals:

BOR, COMPARATOR(2), DMA(7), POR, PDR, PVD, RTC, TIMER(12), WDT(2)

Analog To Digital Convertors:

18-Ch 12-Bit

Digital To Analog Convertors:

2 Ch 12-Bit

Trade Compliance

STM32G061K8T6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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