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STM32G061F8P6

STMicroelectronics

STM32G061F8P6 by STMicroelectronics

STM32G061F8P6 from STMicroelectronics is a versatile 32-bit microcontroller featuring a max supply voltage of 3.6V, 18 external interrupts, and dual 12-bit DAC channels. Ideal for industrial applications, it operates in extreme temperatures (-40 °C to 85 °C). Its compact design and low power mode make it perfect for embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,433 parts In-Stock

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2,433

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Digiode

USA . 2,098 parts In-Stock

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2,098

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Vyrian

USA . 1,973 parts In-Stock

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1,973

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Distributors (Availability)

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AZTECH Wire

Italy . 1,060 parts In-Stock

1+ parts

$14.800

100+ parts

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1,060

$14.800

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IDEA Electronic Components Group

UK . 1,988 parts In-Stock

1+ parts

$42.182

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-

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$37.964

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1,988

$42.182

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$37.964

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MKK Technologies

India . 165 parts In-Stock

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$79.320

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165

$79.320

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DigiPath Technology Company

USA . 165 parts In-Stock

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$79.320

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165

$79.320

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Corphita

USA . 1,774 parts In-Stock

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1,774

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Parana Technologies

USA . 1,587 parts In-Stock

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$50.435

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1,587

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$50.435

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Overview

Unlock limitless possibilities with the STM32G061F8P6 microcontroller from STMicroelectronics. Renowned for excellence and innovation, ST offers a robust solution that empowers a wide array of applications—from IoT devices to industrial controls. With its low-power performance and advanced features, this versatile MCU ensures efficiency and reliability in any project, giving you the edge to create smart, responsive designs that stand out. Experience quality you can trust!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package ensures durability and resistance to environmental factors, making it suitable for industrial applications.

Surface Mount: YES

Surface mount technology allows for compact designs and ease of integration into modern electronic circuits.

Maximum Supply Voltage: 3.6 V

Supports a safe operating range for various low-power applications, enhancing compatibility with other devices.

On Chip Data RAM Width: 8

8-bit RAM width is efficient for many applications, allowing effective use of memory resources.

Package Shape: RECTANGULAR

The rectangular shape is conducive to efficient PCB layouts, optimizing space usage in electronic designs.

Bit Size: 32

A 32-bit architecture allows for more complex computations and handling of larger data types, enhancing processing capability.

DAC Channels: YES

On-chip DAC channels enable analog signal output, ideal for applications requiring audio or control signals.

No. of Terminals: 20

20 terminals provide ample connectivity options for peripheral devices and sensors.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Thin-profile design reduces the overall footprint in space-constrained applications.

Minimum Supply Voltage: 1.7 V

The low minimum supply voltage supports battery-operated devices, promoting energy efficiency.

Maximum Operating Temperature: 85 °C

An operating temperature of 85 °C ensures reliability in various environmental conditions.

CPU Family: Cortex-M0+

The Cortex-M0+ core is known for its high efficiency and low power consumption, making it ideal for embedded systems.

No. of External Interrupts: 18

A high number of external interrupts allows for responsive designs, enabling quick reactions to events.

Minimum Operating Temperature: -40 °C

Operation from -40 °C ensures that the microcontroller can function reliably in harsh environments.

ADC Channels: YES

Integrated ADC channels facilitate easy interfacing with analog sensors, enhancing versatility.

DMA Channels: YES

DMA support helps in reducing CPU workload by managing data transfers, leading to improved system performance.

Terminal Position: DUAL

Dual terminal positioning enhances flexibility in design and layout for compact applications.

ROM Words: 65536

With 65536 ROM words, it supports larger firmware, accommodating more complex applications.

Maximum Seated Height: 1.2 mm

A low seated height is beneficial for devices where space is a premium, enhancing compatibility with low-profile designs.

Digital To Analog Converters: 2 Ch 12-Bit

The integration of dual 12-bit DAC channels allows for precise analog output, useful for control and audio applications.

Width: 4.4 mm

A compact width makes it suitable for small form-factor devices, saving PCB space.

Peripherals: BOR, COMPARATOR(2), DMA(7), POR, PDR, PVD, RTC, TIMER(12), WDT(2)

A rich set of peripherals enhances functionality, making it well-suited for a variety of applications without needing additional components.

Maximum Clock Frequency: 48 MHz

A maximum clock frequency of 48 MHz provides sufficient processing power for most embedded applications.

Length: 6.5 mm

The compact length allows for integration into various designs, promoting flexibility in product development.

Temperature Grade: INDUSTRIAL

Industrial temperature grade assures reliability and performance in demanding environments.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC microcontroller ensures efficient processing and lower power consumption for embedded applications.

No. of Timers: 12

The inclusion of 12 timers supports various timing and control applications, enhancing the versatility of the microcontroller.

RAM Bytes: 18432

Ample RAM capacity allows for complex computations and temporary data storage, improving overall performance.

Technology: CMOS

CMOS technology results in low power consumption and high noise immunity, making it suitable for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals facilitate easier soldering and assembly, which is beneficial in production environments.

Analog To Digital Converters: 16-Ch 12-Bit

With 16 channels of 12-bit ADC, this microcontroller offers high accuracy for multiple sensor inputs, ideal for data-intensive applications.

Maximum Supply Current: 7.3 mA

A maximum supply current of just 7.3 mA helps to conserve battery life in portable applications.

Nominal Supply Voltage: 3 V

A nominal supply voltage of 3 V indicates compatibility with common battery types, enhancing application flexibility.

No. of DMA Channels: 7

Seven DMA channels improve data handling efficiency, freeing up CPU resources for other tasks.

No. of Serial I/Os: 3

Multiple serial communication interfaces enable the microcontroller to effectively connect with various devices and peripherals.

PWM Channels: YES

Integrated PWM channels facilitate motor control and signal modulation applications, enhancing functionality.

Connectivity: I2C(2), I2S, LPUART, SPI(2), USART(2)

Diverse connectivity options support a wide range of communication requirements, making it highly adaptable.

ROM Programmability: FLASH

Flash ROM programmability allows for easy updates and modifications to firmware, extending product lifecycle.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm is suitable for high-density applications, ensuring effective space utilization on PCBs.

Format: FIXED POINT

Fixed-point format allows efficient processing in applications where floating-point arithmetic is not necessary, saving computational resources.

Speed: 64 rpm

The capability to operate at 64 rpm suggests suitability for certain motor control applications, enhancing versatility.

Low Power Mode: YES

Low power modes extend battery life for portable devices, making it an excellent choice for energy-efficient designs.

On Chip Program ROM Width: 8

An 8-bit program ROM width provides efficient use of memory for code storage, supporting compact applications.

No. of I/O Lines: 18

18 I/O lines provide flexibility in interfacing, enabling the microcontroller to handle various inputs and outputs effectively.

Technical Specifications

Microcontrollers STM32G061F8P6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

NO

CPU Family:

Cortex-M0+

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G20

Length:

6.5 mm

Low Power Mode:

YES

No. of DMA Channels:

7

No. of External Interrupts:

18

No. of I/O Lines:

18

No. of Serial I/Os:

3

No. of Terminals:

20

No. of Timers:

12

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

RAM Bytes:

18432

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

64 rpm

Maximum Supply Current:

7.3 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), I2S, LPUART, SPI(2), USART(2)

Peripherals:

BOR, COMPARATOR(2), DMA(7), POR, PDR, PVD, RTC, TIMER(12), WDT(2)

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

2 Ch 12-Bit

Trade Compliance

STM32G061F8P6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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