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STM32G031J4M3TR

STMicroelectronics

STM32G031J4M3TR by STMicroelectronics

STM32G031J4M3TR microcontroller from STMicroelectronics features a 32-bit Cortex-M0 CPU, operates at a max voltage of 3.6V, and includes 6 ADC channels. With low power modes and versatile connectivity options, it's ideal for IoT applications. Its compact design ensures efficient performance in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,834 parts In-Stock

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3,834

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Vyrian

USA . 2,686 parts In-Stock

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2,686

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Anansix

USA . 515 parts In-Stock

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515

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Distributors (Availability)

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AZTECH Wire

Italy . 1,202 parts In-Stock

1+ parts

$19.880

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1,202

$19.880

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IDEA Electronic Components Group

UK . 2,230 parts In-Stock

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$66.994

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$60.295

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2,230

$66.994

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$60.295

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MKK Technologies

India . 2,272 parts In-Stock

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$125.979

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2,272

$125.979

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DigiPath Technology Company

USA . 2,272 parts In-Stock

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$125.979

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2,272

$125.979

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Corphita

USA . 2,878 parts In-Stock

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2,878

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Parana Technologies

USA . 461 parts In-Stock

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$80.102

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461

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$80.102

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Overview

Elevate your designs with the STM32G031J4M3TR microcontroller from STMicroelectronics, a trusted leader in innovation and reliability. This compact powerhouse delivers exceptional performance for diverse applications, including IoT devices, smart sensors, and wearables, all while maintaining low power consumption. Experience seamless integration, robust features, and outstanding support, ensuring you unlock your project’s full potential with unmatched efficiency and quality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making it suitable for a variety of applications.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient assembly processes, making it ideal for space-constrained applications.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in power supply designs while maintaining low power consumption.

On Chip Data RAM Width: 8

An 8-bit width on-chip RAM effectively supports efficient data processing in low-power applications.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space on printed circuit boards, facilitating easier layout design.

Bit Size: 32

A 32-bit architecture provides enhanced performance and allows for more complex computations and data handling.

No. of Terminals: 8

With 8 terminals, it offers sufficient connectivity options for a small form factor while minimizing package size.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for applications requiring a compact footprint.

Minimum Supply Voltage: 1.7 V

A low minimum supply voltage enhances energy efficiency, making the microcontroller excellent for battery-powered devices.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliability in demanding environments, making it suitable for industrial applications.

CPU Family: CORTEX-M0

The Cortex-M0 family is optimized for low power and high performance, offering a good balance for many embedded applications.

Minimum Operating Temperature: -40 °C

The capability to operate in extremely low temperatures expands the application range into harsh environments.

ADC Channels: YES

Integrated ADC channels allow for easy analog signal processing, crucial for applications like sensors and control systems.

DMA Channels: YES

Direct Memory Access (DMA) support enables high-speed data transfers without CPU intervention, enhancing efficiency.

Terminal Position: DUAL

Dual terminal positioning aids versatile PCB layouts and improves manufacturing ease.

ROM Words: 16384

A substantial ROM capacity allows for complex programs to be stored, enabling more functionality.

Maximum Seated Height: 1.75 mm

The low seated height contributes to compact designs while allowing for good thermal management.

Width: 3.9 mm

A narrow width helps in fitting into devices with limited space, making it suitable for portable gadgets.

Peripherals: BOR, DMA(5), POR, RTC, TIMER(9), WDT(2)

A rich set of peripherals enhances functionality and decreases the need for external components, simplifying circuit design.

Maximum Clock Frequency: 48 MHz

A 48 MHz clock frequency provides adequate processing speed for a variety of embedded applications.

Length: 4.9 mm

The short length complements its compact design, making it suitable for modern electronic devices.

Peripheral IC Type: MICROCONTROLLER, RISC

As a RISC microcontroller, it delivers efficient instruction execution suitable for embedded systems.

No. of Timers: 9

Having 9 timers allows for complex timing operations, enhancing control over processes.

RAM Bytes: 8192

An 8 KB RAM provides ample memory for variable storage, supporting more sophisticated applications.

Technology: CMOS

CMOS technology ensures low power consumption while maintaining high-speed performance, crucial for energy efficiency.

Terminal Form: GULL WING

Gull wing terminals provide a robust connection to PCB soldering, enhancing reliability.

Analog To Digital Convertors: 6-Ch 12-Bit

Six 12-bit ADC channels enable high-resolution analog signal capture, critical for accurate sensor interface.

Maximum Supply Current: 7.6 mA

Low supply current aids in extending battery life in portable applications.

Nominal Supply Voltage: 1.8 V

A nominal supply voltage of 1.8 V is excellent for modern low-power applications.

No. of DMA Channels: 5

Five DMA channels improve data handling capabilities, enabling higher performance in multitasking operations.

No. of Serial I/Os: 3

Three serial I/O channels provide flexibility for communication with other devices.

PWM Channels: YES

PWM support allows for efficient control of motors and other timed operations, essential for various control applications.

Connectivity: I2C(2), LPUART, SPI(2), USART(2)

Diverse connectivity options ensure compatibility with multiple devices and sensors, enriching the microcontroller’s usability.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modification of system firmware, improving product lifecycle management.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch enhances component stability and soldering effectiveness.

Format: FIXED POINT

Fixed point format allows efficient computation in applications where floating point is unnecessary, saving processing power.

Speed: 64 rpm

A speed of 64 rpm is functional for controlling actuators and motors, aiding in a variety of automation applications.

Low Power Mode: YES

Low power mode capability is essential for extending battery life in portable devices, making it energy-efficient.

On Chip Program ROM Width: 8

The 8-bit program ROM width caters to efficient program execution tailored for embedded systems.

No. of I/O Lines: 6

Having 6 I/O lines provides sufficient input/output options for diverse interfacing needs in embedded applications.

Technical Specifications

Microcontrollers STM32G031J4M3TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

NO

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

48 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

Low Power Mode:

YES

No. of DMA Channels:

5

No. of I/O Lines:

6

No. of Serial I/Os:

3

No. of Terminals:

8

No. of Timers:

9

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

RAM Bytes:

8192

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1.75 mm

Speed:

64 rpm

Maximum Supply Current:

7.6 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), LPUART, SPI(2), USART(2)

Peripherals:

BOR, DMA(5), POR, RTC, TIMER(9), WDT(2)

Analog To Digital Convertors:

6-Ch 12-Bit

Trade Compliance

STM32G031J4M3TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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