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STM32G031G8U3

STMicroelectronics

STM32G031G8U3 by STMicroelectronics

STM32G031G8U3 microcontroller from STMicroelectronics features a 32-bit Cortex-M0 CPU, operates at a max voltage of 3.6V, and includes 15 ADC channels. Ideal for low-power applications, it supports various connectivity options like I2C and SPI. Its compact design makes it suitable for space-constrained devices.

Median Price

$3.530

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 3,470 parts In-Stock

1+ parts

$3.530

100+ parts

$1.870

1k+ parts

$1.370

10k+ parts

$1.250

3,470

$3.530

$1.870

$1.370

$1.250

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,352 parts In-Stock

1+ parts

$2.670

100+ parts

-

1k+ parts

-

10k+ parts

-

3,352

$2.670

-

-

-

Vyrian

USA . 12,911 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

12,911

-

-

-

-

Anansix

USA . 2,146 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,146

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,863 parts In-Stock

1+ parts

$2.529

100+ parts

-

1k+ parts

-

10k+ parts

-

2,863

$2.529

-

-

-

Component Stockers USA

USA . 1,113 parts In-Stock

1+ parts

$2.810

100+ parts

$2.070

1k+ parts

$1.480

10k+ parts

-

1,113

$2.810

$2.070

$1.480

-

Microchip USA

USA . 5,313 parts In-Stock

1+ parts

$11.752

100+ parts

-

1k+ parts

-

10k+ parts

-

5,313

$11.752

-

-

-

IDEA Electronic Components Group

UK . 2,046 parts In-Stock

1+ parts

$49.127

100+ parts

-

1k+ parts

$44.214

10k+ parts

-

2,046

$49.127

-

$44.214

-

MKK Technologies

India . 2,307 parts In-Stock

1+ parts

$92.380

100+ parts

-

1k+ parts

-

10k+ parts

-

2,307

$92.380

-

-

-

DigiPath Technology Company

USA . 2,307 parts In-Stock

1+ parts

$92.380

100+ parts

-

1k+ parts

-

10k+ parts

-

2,307

$92.380

-

-

-

Parana Technologies

USA . 115 parts In-Stock

1+ parts

-

100+ parts

$58.739

1k+ parts

-

10k+ parts

-

115

-

$58.739

-

-

Overview

Unlock your project’s potential with the STM32G031G8U3 microcontroller from STMicroelectronics, a leader in innovation and quality. Designed for efficiency and versatility, this compact powerhouse excels in low-power applications, making it ideal for IoT devices, sensors, and consumer electronics. With robust performance in extreme temperatures and a wide range of peripherals, it ensures reliability and seamless integration. Elevate your designs with ST's trusted technology and experience unmatched value!

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for compact designs, making this microcontroller suitable for space-constrained applications.

Maximum Supply Voltage: 3.6 V

Supports a wide range of supply voltages, allowing compatibility with various power sources.

On Chip Data RAM Width: 8

The 8-bit RAM width facilitates efficient data handling and manipulation for applications requiring simple data storage.

Package Shape: SQUARE

The square package shape offers symmetry that can simplify PCB layout and design.

Bit Size: 32

A 32-bit architecture provides high processing power for demanding applications.

No. of Terminals: 28

28 terminals allow for a variety of input/output configurations, providing versatility in circuit design.

Package Style (Meter): CHIP CARRIER, VERY THIN PROFILE

The very thin profile is advantageous for portable devices where size and weight are critical.

Minimum Supply Voltage: 1.7 V

The low minimum supply voltage makes it ideal for battery-powered applications, extending battery life.

Maximum Operating Temperature: 125 °C

High maximum operating temperature allows for use in harsh environments, enhancing reliability.

CPU Family: CORTEX-M0

Part of the popular Cortex-M0 family, it benefits from efficient power consumption and performance.

Minimum Operating Temperature: -40 °C

Can operate in extreme low temperatures, making it suitable for outdoor and industrial applications.

ADC Channels: YES

Inclusion of ADC channels enables sensor interfacing for a variety of applications.

DMA Channels: YES

DMA capability allows for efficient data transfer without CPU intervention, improving overall system performance.

Terminal Position: QUAD

Quad terminal positions allow for easier solderability and better electrical performance.

ROM Words: 65536

Ample ROM space for program storage, facilitating the development of complex applications.

Maximum Seated Height: 0.6 mm

Very low height profile minimizes space requirements on the PCB for slim device designs.

Width: 4 mm

Compact width enhances PCB layout flexibility and aids in miniaturization.

Peripherals: BOR, DMA(5), POR, RTC, TIMER(9), WDT(2)

Rich peripheral set enhances functionality and enables diverse application possibilities.

Maximum Clock Frequency: 48 MHz

A maximum clock frequency of 48 MHz provides sufficient speed for a variety of processing tasks.

Length: 4 mm

Minimized length contributes to overall reduced footprint for space-saving designs.

Peripheral IC Type: MICROCONTROLLER, RISC

As a RISC microcontroller, it offers efficient instruction execution and lower power consumption.

No. of Timers: 9

Multiple timers support various timing applications, including PWM generation and real-time control.

RAM Bytes: 8192

Adequate RAM size for handling complex operations and buffering data in applications.

Technology: CMOS

CMOS technology ensures low power consumption and high integration levels.

Terminal Form: NO LEAD

No-lead design improves thermal performance and reduces risk of mechanical failure.

Analog To Digital Convertors: 15-Ch 12-Bit

15-channel, 12-bit ADCs provide high precision and multiple channel capabilities for diverse sensor applications.

Maximum Supply Current: 7.6 mA

Low maximum supply current helps in conserving battery life in portable applications.

Nominal Supply Voltage: 1.8 V

The nominal voltage is suitable for low power applications, ideal for IoT and wearable devices.

No. of DMA Channels: 5

5 DMA channels facilitate efficient data movement, freeing CPU resources for other tasks.

No. of Serial I/Os: 3

Multiple serial I/O options enhance connectivity with external devices.

PWM Channels: YES

PWM capability allows for precise control in applications such as motor control and LED dimming.

Connectivity: I2C(2), LPUART, SPI(2), USART(2)

Versatile connectivity options enable easy integration with various sensors and peripherals.

ROM Programmability: FLASH

Flash programmability ensures flexibility in updating and modifying the application code.

Terminal Pitch: 0.5 mm

Fine terminal pitch contributes to a high density layout, allowing more functionality in smaller designs.

Format: FIXED POINT

Fixed point format is suitable for many embedded applications, simplifying calculations and processing.

Speed: 64 rpm

Providing a decent operational speed for various applications, ensuring responsiveness.

Low Power Mode: YES

Low power mode features enable energy savings during operation, critical for battery-powered devices.

On Chip Program ROM Width: 8

8-bit program ROM width supports simple and efficient programming and execution of codes.

No. of I/O Lines: 26

26 available I/O lines make it versatile and adaptable for various interfacing needs.

Technical Specifications

Microcontrollers STM32G031G8U3 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

NO

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

48 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-XQCC-N28

Length:

4 mm

Low Power Mode:

YES

No. of DMA Channels:

5

No. of I/O Lines:

26

No. of Serial I/Os:

3

No. of Terminals:

28

No. of Timers:

9

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC28,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

RAM Bytes:

8192

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

64 rpm

Maximum Supply Current:

7.6 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), LPUART, SPI(2), USART(2)

Peripherals:

BOR, DMA(5), POR, RTC, TIMER(9), WDT(2)

Analog To Digital Convertors:

15-Ch 12-Bit

Trade Compliance

STM32G031G8U3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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