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STM32G031C8U6TR

STMicroelectronics

STM32G031C8U6TR by STMicroelectronics

STM32G031C8U6TR by STMicroelectronics is a 32-bit microcontroller with Cortex-M0 CPU, 48 MHz clock frequency, and 16-Ch 12-Bit ADC channels. Ideal for applications requiring low power mode, it features 8192 bytes of RAM, 65536 ROM words, and various peripherals like BOR and RTC.

Median Price

$1.459

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IBS Electronics

USA . 125,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.459

10k+ parts

$1.388

125,000

-

-

$1.459

$1.388

Vyrian

USA . 7,234 parts In-Stock

1+ parts

-

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7,234

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Digiode

USA . 2,788 parts In-Stock

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2,788

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Anansix

USA . 1,774 parts In-Stock

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1,774

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Distributors (Availability)

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Ampacity Inc.

Singapore . 134,924 parts In-Stock

1+ parts

$1.120

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134,924

$1.120

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Semicontronic

India . 134,654 parts In-Stock

1+ parts

$1.120

100+ parts

$1.092

1k+ parts

$1.086

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-

134,654

$1.120

$1.092

$1.086

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Vigor

Singapore . 1,447 parts In-Stock

1+ parts

$1.520

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1,447

$1.520

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Microchip USA

USA . 4,361 parts In-Stock

1+ parts

$11.816

100+ parts

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4,361

$11.816

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AZTECH Wire

Italy . 891 parts In-Stock

1+ parts

$13.931

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891

$13.931

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IDEA Electronic Components Group

UK . 1,426 parts In-Stock

1+ parts

$33.193

100+ parts

-

1k+ parts

$29.873

10k+ parts

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1,426

$33.193

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$29.873

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MKK Technologies

India . 124 parts In-Stock

1+ parts

$62.417

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124

$62.417

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DigiPath Technology Company

USA . 124 parts In-Stock

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$62.417

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124

$62.417

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Continental Prestige Electronics

USA . 6,401 parts In-Stock

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Argo Parts USA

USA . 3,855 parts In-Stock

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3,855

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Corphita

USA . 3,269 parts In-Stock

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3,269

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Parana Technologies

USA . 2,046 parts In-Stock

1+ parts

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100+ parts

$39.687

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2,046

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$39.687

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Bastille Electronics

Australia . 450 parts In-Stock

1+ parts

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450

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Overview

Unlock a world of possibilities with the STM32G031C8U6TR by STMicroelectronics, a cutting-edge microcontroller that offers unmatched performance and reliability. Crafted by one of the leading manufacturers in the industry, this versatile chip is perfect for a wide range of applications. Whether you're designing IoT devices, industrial automation systems, or consumer electronics, this powerful microcontroller provides all the features you need to bring your ideas to life. With its low power consumption, advanced peripherals, and high clock frequency, the STM32G031C8U6TR delivers exceptional value and efficiency, making it the ideal choice for your next project.

Feature Benefit Bullets

Surface Mount: YES

Surface mount package allows for easy and convenient installation on PCBs, saving space and facilitating automated assembly processes.

Maximum Supply Voltage: 3.6 V

Wide supply voltage range allows for flexibility in power supply design and compatibility with a variety of power sources.

On Chip Data RAM Width: 8

8-bit data RAM width enables efficient data processing and storage, especially for tasks requiring low to moderate memory usage.

Package Shape: SQUARE

Square package shape simplifies PCB layout and offers uniformity in design integration, making it easier to incorporate into different circuits.

Bit Size: 32

32-bit architecture provides enhanced processing capabilities, enabling the microcontroller to handle more complex algorithms and calculations efficiently.

No. of Terminals: 48

Plenty of terminals allow for versatile connectivity options, supporting various input/output configurations and interfaces for diverse applications.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Various package styles offer different thermal management options and form factors for optimal performance and integration in space-constrained designs.

Minimum Supply Voltage: 1.7 V

Low minimum supply voltage helps in achieving power efficiency and can extend battery life in portable or energy-efficient applications.

Maximum Operating Temperature: 85 °C

High maximum operating temperature range ensures reliable performance in challenging environmental conditions or extended operation durations.

CPU Family: CORTEX-M0

Based on the energy-efficient ARM Cortex-M0 architecture, offering a balance of low power consumption and high performance for embedded applications.

Minimum Operating Temperature: -40 °C

Wide temperature range allows for reliable operation in harsh or extreme environments, ensuring stability in varying temperature conditions.

ADC Channels: YES

Built-in analog-to-digital converters enable the microcontroller to interface with various sensors, transducers, and analog signals, enhancing versatility in data acquisition.

DMA Channels: YES

Support for direct memory access channels enhances data transfer efficiency, reducing CPU workload and enabling high-speed data handling capabilities.

Terminal Position: QUAD

Quad terminal configuration offers a balanced layout for efficient signal routing and connectivity, facilitating easier PCB design and assembly.

ROM Words: 65536

64 KB of on-chip program memory provides ample space for storing firmware, software, and code, allowing for complex algorithms and applications to be executed smoothly.

Maximum Seated Height: 0.6 mm

Low profile design with a maximum seated height of 0.6 mm enables compact and slim device form factors, ideal for applications with space constraints.

Width: 7 mm

Compact width dimension enables space-efficient placement on the PCB, optimizing board layout and allowing for higher component density in the system.

Peripherals: BOR, DMA(5), POR, RTC, TIMER(9), WDT(2)

Rich peripheral set including brown-out reset, direct memory access, power-on reset, real-time clock, timers, and watchdog timer enhances system functionality and performance.

Maximum Clock Frequency: 48 MHz

High clock frequency capability of 48 MHz enables fast processing speeds, reducing latency and improving overall system responsiveness.

Length: 7 mm

Compact length dimension contributes to the overall small footprint of the microcontroller, making it suitable for applications with space constraints or size limitations.

Peripheral IC Type: MICROCONTROLLER, RISC

Microcontroller with RISC architecture offers optimized instruction set and performance efficiency, ideal for embedded system applications requiring fast and reliable operation.

No. of Timers: 9

Abundance of timers allows for precise timekeeping, scheduling, and event triggering capabilities, enhancing system control and timing functions.

RAM Bytes: 8192

8 KB of on-chip random-access memory provides storage for variables, buffers, and temporary data, supporting efficient data processing and manipulation.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with modern digital circuits, ensuring energy-efficient and reliable operation.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations, offering a safer and more eco-friendly option for electronic manufacturing and disposal.

Analog To Digital Convertors: 16-Ch 12-Bit

16-channel 12-bit analog-to-digital converters provide high-resolution and multi-channel conversion capabilities, enabling accurate and precise measurement of analog signals.

Maximum Supply Current: 6.9 mA

Low maximum supply current consumption ensures energy efficiency and extends battery life in battery-powered applications, reducing overall power consumption.

Nominal Supply Voltage: 1.8 V

Stable nominal supply voltage of 1.8 V supports reliable operation and compatibility with various power sources, offering consistent performance across different environments.

No. of DMA Channels: 5

Multiple direct memory access channels enable concurrent data transfers and efficient handling of data streams, improving system throughput and performance.

No. of Serial I/Os: 3

3 serial input/output interfaces provide connectivity options for serial communication protocols, enabling data exchange with external devices and peripherals.

PWM Channels: YES

Support for pulse-width modulation channels allows for accurate control of motor speed, LED brightness, and other analog outputs, enhancing system control capabilities.

Connectivity: I2C(2), LPUART, SPI(2), USART(2)

Versatile connectivity options including I2C, LPUART, SPI, and USART interfaces facilitate communication with a wide range of external devices, sensors, and peripherals.

ROM Programmability: FLASH

Flash programmable ROM enables easy and efficient firmware updates and code modifications, supporting flexible and agile development processes.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5 mm allows for high-density mounting on the PCB, enabling compact design and efficient use of available board space.

Format: FIXED POINT

Fixed-point format for data representation simplifies arithmetic operations and mathematical calculations, offering efficient and predictable computation for embedded applications.

Speed: 64 rpm

Operational speed of 64 rpm provides fast and responsive performance, meeting the processing requirements of real-time embedded systems and time-sensitive applications.

Low Power Mode: YES

Support for low power mode enables energy-saving operation, extending battery life and reducing power consumption in power-sensitive applications or portable devices.

On Chip Program ROM Width: 8

8-bit on-chip program ROM width allows for efficient storage and execution of program code, enhancing system reliability and performance efficiency.

No. of I/O Lines: 44

Abundance of input/output lines provides ample connectivity options for interfacing with external peripherals, sensors, and devices, supporting versatile system integration.

Technical Specifications

Microcontrollers STM32G031C8U6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

NO

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

48 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-XQCC-N48

Length:

7 mm

Low Power Mode:

YES

No. of DMA Channels:

5

No. of I/O Lines:

44

No. of Serial I/Os:

3

No. of Terminals:

48

No. of Timers:

9

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

RAM Bytes:

8192

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

64 rpm

Maximum Supply Current:

6.9 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), LPUART, SPI(2), USART(2)

Peripherals:

BOR, DMA(5), POR, RTC, TIMER(9), WDT(2)

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

STM32G031C8U6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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