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STM32G031C8U3TR

STMicroelectronics

STM32G031C8U3TR by STMicroelectronics

STM32G031C8U3TR microcontroller from STMicroelectronics features a 32-bit Cortex-M0 CPU, operates at 1.7-3.6V, and supports up to 48MHz clock speed. With 8KB RAM and 64KB Flash ROM, it's ideal for low-power applications like IoT devices. Its versatile connectivity includes I2C, SPI, and USART interfaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,489 parts In-Stock

1+ parts

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8,489

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Digiode

USA . 4,053 parts In-Stock

1+ parts

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4,053

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Anansix

USA . 1,912 parts In-Stock

1+ parts

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1,912

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 7,152 parts In-Stock

1+ parts

$13.588

100+ parts

-

1k+ parts

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10k+ parts

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7,152

$13.588

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AZTECH Wire

Italy . 844 parts In-Stock

1+ parts

$20.200

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-

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844

$20.200

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IDEA Electronic Components Group

UK . 1,137 parts In-Stock

1+ parts

$71.411

100+ parts

-

1k+ parts

$64.270

10k+ parts

-

1,137

$71.411

-

$64.270

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MKK Technologies

India . 158 parts In-Stock

1+ parts

$134.284

100+ parts

-

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158

$134.284

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DigiPath Technology Company

USA . 158 parts In-Stock

1+ parts

$134.284

100+ parts

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158

$134.284

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Corphita

USA . 1,244 parts In-Stock

1+ parts

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1,244

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Parana Technologies

USA . 1,095 parts In-Stock

1+ parts

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100+ parts

$85.383

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1,095

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$85.383

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Overview

Unleash your creativity with the STM32G031C8U3TR microcontroller from STMicroelectronics, a leader in innovation and reliability. Designed for low-power applications, this high-performance chip is perfect for IoT devices, wearables, and industrial automation. With its robust features and superior quality, you can easily bring your projects to life while benefiting from enhanced efficiency and flexibility. Elevate your designs with the trusted technology of STMicroelectronics!

Feature Benefit Bullets

Surface Mount: YES

The surface mount feature allows for compact designs and easier integration into PCBs, making it suitable for space-constrained applications.

Maximum Supply Voltage: 3.6 V

This moderate voltage range is compatible with many low-power devices, ensuring versatility in application.

On Chip Data RAM Width: 8

An 8-bit data RAM width is optimal for basic data processing and control tasks, ensuring efficient performance without excessive complexity.

Package Shape: SQUARE

The square package shape provides uniformity in layout and makes the component easy to place on various PCB designs.

Bit Size: 32

A 32-bit architecture allows for handling larger data types and increases processing capabilities compared to 8-bit or 16-bit counterparts.

Number of Terminals: 48

Having 48 terminals provides ample connectivity options, enabling the integration of various peripherals and expansion capabilities.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style offers excellent thermal management and supports high-density applications due to its thin profile.

Minimum Supply Voltage: 1.7 V

The ability to operate at a low voltage of 1.7 V helps in energy-efficient designs, particularly important in battery-powered devices.

Maximum Operating Temperature: 125 °C

Operating at high temperatures ensures reliability in harsh environments, making it suitable for industrial applications.

CPU Family: CORTEX-M0

The ARM Cortex-M0 architecture is efficient and power-saving while retaining powerful performance for embedded applications.

Minimum Operating Temperature: -40 °C

Wide temperature range (-40 °C to 125 °C) enables use in extreme environments, broadening application potential.

ADC Channels: YES

Integrated ADC channels enable the microcontroller to directly interface with analog sensors, eliminating the need for separate ADC components.

DMA Channels: YES

Direct Memory Access (DMA) capabilities enhance performance by allowing peripherals to transfer data without CPU intervention.

Terminal Position: QUAD

Quad terminal positioning facilitates easy access to multiple I/O connections, improving layout options on PCB.

ROM Words: 65536

Having 64k ROM words allows for substantial program storage, accommodating complex applications and algorithms.

Maximum Seated Height: 0.6 mm

A low seated height helps in designing compact electronic products, which is ideal for portable and space-sensitive applications.

Width: 7 mm

At 7 mm, the component is suitable for tight layouts in modern electronics, optimizing space usage.

Peripherals: BOR, DMA(5), POR, RTC, TIMER(9), WDT(2)

The availability of diverse peripherals enhances functionality, making it well-suited for various applications like real-time control and monitoring.

Maximum Clock Frequency: 48 MHz

Working at a maximum clock frequency of 48 MHz allows for efficient processing speed suitable for many embedded tasks.

Length: 7 mm

A compact length of 7 mm aids in miniaturization of electronic designs, accommodating modern form factor requirements.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture promotes higher performance and lower power consumption, leading to efficient processing capabilities.

Number of Timers: 9

Having 9 timers allows for complex time management and control applications in real-time systems.

RAM Bytes: 8192

With 8 KB of RAM, this microcontroller can handle moderate data processing and temporary storage needs effectively.

Technology: CMOS

CMOS technology ensures low power consumption and high integration density, which is essential for portable devices.

Terminal Form: NO LEAD

No lead terminals reduce space requirements and make the device compatible with modern soldering processes.

Analog To Digital Converters: 16-Ch 12-Bit

The inclusion of a 16-channel 12-bit ADC provides high-resolution converted signals, essential for accurate data capture in various applications.

Maximum Supply Current: 7.6 mA

A low supply current of 7.6 mA indicates energy efficiency, suitable for battery-operated designs.

Nominal Supply Voltage: 1.8 V

The nominal supply voltage of 1.8 V supports low-power applications, fostering longer battery life in portable devices.

Number of DMA Channels: 5

Five DMA channels support efficient data transfers without burdening the CPU, optimizing overall system performance.

Number of Serial I/Os: 3

Having 3 serial I/O lines enhances connectivity options for peripherals, improving communication capabilities.

PWM Channels: YES

PWM channel support is essential for applications requiring precise control, such as motor control and dimming LEDs.

Connectivity: I2C(2), LPUART, SPI(2), USART(2)

Multiple connectivity options provide flexibility to interface with various devices, enhancing the versatility of the microcontroller.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications of software, facilitating rapid development cycles.

Terminal Pitch: 0.5 mm

A fine terminal pitch of 0.5 mm is essential for high-density applications and compact PCB layouts.

Format: FIXED POINT

Using a fixed-point format can enhance performance in applications requiring fast calculations without floating-point overhead.

Speed: 64 rpm

A speed specification of 64 rpm indicates capability for tasks requiring controlled motion, suitable for various control applications.

Low Power Mode: YES

The availability of low power mode extends battery life in portable applications, making the microcontroller more versatile.

On Chip Program ROM Width: 8

An 8-bit program ROM width effectively meets the needs of simpler applications without compromising on efficiency.

Number of I/O Lines: 44

Offering 44 I/O lines allows for extensive interfacing possibilities, accommodating a wide range of sensors and devices.

Technical Specifications

Microcontrollers STM32G031C8U3TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

NO

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

48 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-XQCC-N48

Length:

7 mm

Low Power Mode:

YES

No. of DMA Channels:

5

No. of I/O Lines:

44

No. of Serial I/Os:

3

No. of Terminals:

48

No. of Timers:

9

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

RAM Bytes:

8192

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

64 rpm

Maximum Supply Current:

7.6 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), LPUART, SPI(2), USART(2)

Peripherals:

BOR, DMA(5), POR, RTC, TIMER(9), WDT(2)

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

STM32G031C8U3TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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