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STM32G031C4U6

STMicroelectronics

STM32G031C4U6 by STMicroelectronics

STM32G031C4U6 microcontroller from STMicroelectronics features a 32-bit Cortex-M0 CPU, operates at a max voltage of 3.6V, and includes 16 ADC channels. With low power modes and versatile connectivity options, it's ideal for IoT applications. Its compact design supports efficient embedded systems.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 4,844 parts In-Stock

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4,844

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Digiode

USA . 1,009 parts In-Stock

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1,009

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Anansix

USA . 805 parts In-Stock

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805

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Distributors (Availability)

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Vigor

Singapore . 2,243 parts In-Stock

1+ parts

$1.360

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2,243

$1.360

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Microchip USA

USA . 4,852 parts In-Stock

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$10.899

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$10.899

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IDEA Electronic Components Group

UK . 315 parts In-Stock

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$17.719

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$15.947

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315

$17.719

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$15.947

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AZTECH Wire

Italy . 916 parts In-Stock

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$20.220

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916

$20.220

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Component Stockers USA

USA . 6,381 parts In-Stock

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$22.750

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$22.750

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MKK Technologies

India . 2,057 parts In-Stock

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$33.320

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DigiPath Technology Company

USA . 2,057 parts In-Stock

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$33.320

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$33.320

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Corphita

USA . 1,634 parts In-Stock

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1,634

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Parana Technologies

USA . 1,239 parts In-Stock

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$21.186

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1,239

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$21.186

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Overview

Unlock your project’s potential with the STM32G031C4U6 microcontroller from STMicroelectronics. Renowned for quality and innovation, STMicroelectronics delivers this compact powerhouse designed for efficiency and versatility in a wide range of applications—from IoT devices to automotive systems. Enjoy superior performance with low power consumption, ensuring longevity and reliability. Elevate your designs and experience seamless integration with robust connectivity options and advanced peripherals, all backed by a trusted industry leader.

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for efficient use of space on printed circuit boards, making it ideal for compact devices.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V indicates compatibility with a variety of power sources, allowing flexibility in design.

On Chip Data RAM Width: 8

An 8-bit data RAM width supports efficient data manipulation for applications requiring simpler processing.

Package Shape: SQUARE

The square package shape facilitates better thermal management and space efficiency in design layouts.

Bit Size: 32

A 32-bit architecture allows for higher processing power and better performance in handling complex computations.

No. of Terminals: 48

With 48 terminals, this microcontroller provides ample connectivity options for various peripherals and sensors.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This packaging style promotes efficient heat dissipation and enables thin-profile designs, suitable for modern compact electronics.

Minimum Supply Voltage: 1.7 V

A low minimum supply voltage enhances energy efficiency, making this microcontroller suitable for battery-powered applications.

Maximum Operating Temperature: 85 °C

An operating temperature up to 85 °C allows for reliable performance in a wide range of environmental conditions.

CPU Family: CORTEX-M0

The ARM Cortex-M0 core optimizes power efficiency and performance, making it a suitable choice for cost-sensitive applications.

Minimum Operating Temperature: -40 °C

Performance in temperatures as low as -40 °C ensures reliability in extreme conditions, ideal for industrial applications.

ADC Channels: YES

Integrated ADC channels facilitate the easy conversion of analog signals to digital data, essential for sensor applications.

DMA Channels: YES

Direct Memory Access (DMA) support minimizes CPU load and enhances data throughput, making the microcontroller efficient for high-performance tasks.

Terminal Position: QUAD

Quad terminal positioning allows for better routing and signal integrity on PCB designs.

ROM Words: 16384

The availability of 16,384 ROM words provides sufficient storage for code, supporting complex functionalities.

Maximum Seated Height: 0.6 mm

The thin seated height aids in creating slimmer electronic designs, appealing for modern portable devices.

Width: 7 mm

A compact width of 7 mm is advantageous for designs with spatial constraints, ensuring versatility in various applications.

Peripherals: BOR, DMA(5), POR, RTC, TIMER(9), WDT(2)

Rich peripheral support enhances functionality and integration capabilities, allowing for advanced control in applications.

Maximum Clock Frequency: 48 MHz

A 48 MHz clock frequency supports fast processing speeds, making it suitable for real-time applications.

Length: 7 mm

The small length allows for space-saving designs, ideal for constrained environments like wearable technology.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC microcontroller enhances performance efficiency by employing a simplified instruction set architecture.

No. of Timers: 9

Multiple timers provide versatility for time-sensitive operations, crucial in automation and control applications.

RAM Bytes: 8192

With 8 KB of RAM, the microcontroller has adequate memory to manage active tasks efficiently.

Technology: CMOS

CMOS technology ensures low power consumption while maintaining high performance, perfect for battery-operated devices.

Terminal Form: NO LEAD

No lead terminals offer a reliable connection with low parasitic inductance, promoting better signal integrity.

Analog To Digital Converters: 16-Ch 12-Bit

Having 16 channels and 12-bit resolution ADC facilitates high-precision signal conversions for various applications.

Maximum Supply Current: 6.9 mA

Low maximum supply current ensures energy efficiency, extending battery life in portable applications.

Nominal Supply Voltage: 1.8 V

A nominal supply voltage of 1.8 V aligns with low-power designs, ensuring versatility in energy management.

No. of DMA Channels: 5

Five DMA channels enable efficient data handling without burdening the CPU, enhancing overall system performance.

No. of Serial I/Os: 3

Three serial I/O lines allow for effective communication with a range of peripherals, supporting diverse applications.

PWM Channels: YES

PWM capabilities enable control of connected devices like motors and LEDs, adding to the microcontroller's versatility.

Connectivity: I2C(2), LPUART, SPI(2), USART(2)

Multi-protocol connectivity enhances communication options for integration with various devices and systems.

ROM Programmability: FLASH

Flash programmability ensures easy updates and reprogramming, accommodating changes in application needs.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch allows for higher density designs, essential for modern compact electronic circuits.

Format: FIXED POINT

Fixed-point format provides sufficient precision for various computational applications, particularly in control systems.

Speed: 64 rpm

A speed specification of 64 rpm is indicative of performance efficiency, suited for applications requiring moderate processing speed.

Low Power Mode: YES

The inclusion of a low power mode bolsters energy efficiency, enhancing battery life during idle times.

On Chip Program ROM Width: 8

An 8-bit program ROM width is sufficient for applications requiring moderate complexity and efficiency.

No. of I/O Lines: 44

With 44 I/O lines, this microcontroller offers extensive interfacing capabilities for various sensors, actuators, and peripherals.

Technical Specifications

Microcontrollers STM32G031C4U6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

NO

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

48 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-XQCC-N48

Length:

7 mm

Low Power Mode:

YES

No. of DMA Channels:

5

No. of I/O Lines:

44

No. of Serial I/Os:

3

No. of Terminals:

48

No. of Timers:

9

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

RAM Bytes:

8192

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

64 rpm

Maximum Supply Current:

6.9 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), LPUART, SPI(2), USART(2)

Peripherals:

BOR, DMA(5), POR, RTC, TIMER(9), WDT(2)

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

STM32G031C4U6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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