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STM32F777NIH7

STMicroelectronics

STM32F777NIH7 by STMicroelectronics

STM32F777NIH7 by STMicroelectronics is a 32-bit microcontroller with Cortex-M7 CPU, 16 DMA channels, and 24-Ch 12-Bit ADC. It operates at up to 50 MHz, has 159 I/O lines, and supports various connectivity options like CAN, I2C, SPI. Ideal for industrial applications requiring high-speed processing and multiple peripherals.

Median Price

$21.620

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

EBV Elektronik

Germany . 1,760 parts In-Stock

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-

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1,760

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Avnet

USA . 320 parts In-Stock

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320

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Nova Conductors

Japan . 98 parts In-Stock

1+ parts

$21.620

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98

$21.620

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Vyrian

USA . 13,357 parts In-Stock

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13,357

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Chip Stock

USA . 3,900 parts In-Stock

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3,900

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Digiode

USA . 2,251 parts In-Stock

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2,251

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Anansix

USA . 491 parts In-Stock

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491

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J2 Sourcing AB

Sweden . 320 parts In-Stock

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320

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 532 parts In-Stock

1+ parts

$9.330

100+ parts

-

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532

$9.330

-

-

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Ampacity Inc.

Singapore . 370 parts In-Stock

1+ parts

$13.000

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-

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370

$13.000

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Vigor

Singapore . 1,485 parts In-Stock

1+ parts

$15.560

100+ parts

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1,485

$15.560

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Continental Prestige Electronics

USA . 6,725 parts In-Stock

1+ parts

$21.620

100+ parts

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$21.188

6,725

$21.620

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-

$21.188

Netroflash

USA . 100 parts In-Stock

1+ parts

$21.620

100+ parts

$21.188

1k+ parts

-

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100

$21.620

$21.188

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Semicontronic

India . 639 parts In-Stock

1+ parts

$29.000

100+ parts

$28.275

1k+ parts

$28.130

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639

$29.000

$28.275

$28.130

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Corohmni

South Africa . 2 parts In-Stock

1+ parts

$38.028

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2

$38.028

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Microchip USA

USA . 2,974 parts In-Stock

1+ parts

$52.188

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2,974

$52.188

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$56.403

100+ parts

$51.327

1k+ parts

$46.250

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3,000

$56.403

$51.327

$46.250

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Aztec Data Supply Inc.

USA . 100 parts In-Stock

1+ parts

$56.630

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100

$56.630

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IDEA Electronic Components Group

UK . 1,412 parts In-Stock

1+ parts

$71.877

100+ parts

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$64.689

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1,412

$71.877

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$64.689

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MKK Technologies

India . 981 parts In-Stock

1+ parts

$135.160

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981

$135.160

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DigiPath Technology Company

USA . 981 parts In-Stock

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$135.160

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981

$135.160

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Lixinc

USA . 9,052 parts In-Stock

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9,052

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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Argo Parts USA

USA . 4,558 parts In-Stock

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4,558

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Corphita

USA . 3,508 parts In-Stock

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3,508

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Robosynatics

Brazil . 2,000 parts In-Stock

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2,000

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Lucentia Tech

USA . 2,000 parts In-Stock

1+ parts

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100+ parts

$0.443

1k+ parts

$0.443

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$0.443

2,000

-

$0.443

$0.443

$0.443

Perfect Parts

USA . 1,434 parts In-Stock

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1,434

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Futuretech Components

Singapore . 942 parts In-Stock

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942

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Parana Technologies

USA . 471 parts In-Stock

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$85.940

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471

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$85.940

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Overview

Discover the powerful STM32F777NIH7 microcontroller by STMicroelectronics, a leading manufacturer known for top-notch quality and reliability. This versatile device offers a wide range of applications in various industries, providing customers with exceptional value and benefits. With integrated cache, multiple DAC and ADC channels, and a maximum clock frequency of 50 MHz, this product delivers high performance and efficiency. Whether you need advanced control capabilities or low power mode options, the STM32F777NIH7 is the perfect choice for your next project. Unlock endless possibilities with this cutting-edge microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the microcontroller, ensuring it can withstand various environmental conditions.

Integrated Cache: YES

Integrated cache improves the processing speed and efficiency of the microcontroller, making it suitable for high-performance applications.

Maximum Supply Voltage: 3.6 V

Having a maximum supply voltage of 3.6V allows for flexibility in power supply options and compatibility with different systems.

Address Bus Width: 26

A wide address bus width of 26 allows for the microcontroller to access a large memory space, enabling it to handle complex tasks and data efficiently.

Bit Size: 32

Having a 32-bit architecture provides high processing capability and performance for the microcontroller, suitable for demanding applications.

ADC Channels: YES

Analog to Digital Converter channels enable the microcontroller to interface with analog sensors and signals, expanding its application possibilities.

DMA Channels: YES

Direct Memory Access channels allow for efficient data transfer between peripherals and memory without CPU intervention, improving system performance.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making the microcontroller energy efficient and reliable in noisy environments.

Connectivity: CAN(3), I2C(4), I2S(3), SAI(2), SDMMC(2), SPI(6), UART(4), USART(4), USB(2)

Having a variety of connectivity options such as CAN, I2C, SPI, and USB enables the microcontroller to easily communicate with other devices and systems, increasing its versatility.

Technical Specifications

Microcontrollers STM32F777NIH7 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

26

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M7

Maximum Clock Frequency:

50 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B216

Length:

13 mm

Low Power Mode:

YES

No. of DMA Channels:

16

No. of External Interrupts:

16

No. of I/O Lines:

159

No. of Serial I/Os:

8

No. of Terminals:

216

No. of Timers:

16

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA216,15X15,32

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

544768

ROM Words:

2097152

ROM Programmability:

FLASH

Maximum Seated Height:

1.1 mm

Speed:

200 rpm

Maximum Supply Current:

100 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

13 mm

Peripheral IC Type:

Connectivity:

CAN(3), I2C(4), I2S(3), SAI(2), SDMMC(2), SPI(6), UART(4), USART(4), USB(2)

Peripherals:

BOR, DMA(16), POR, RTC, TIMER(16), WDT(2)

Analog To Digital Convertors:

24-Ch 12-Bit

Digital To Analog Convertors:

2 Ch 12-Bit

Trade Compliance

STM32F777NIH7 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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