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STM32F746ZEY6TR

STMicroelectronics

STM32F746ZEY6TR by STMicroelectronics

STM32F746ZEY6TR by STMicroelectronics is a 32-bit microcontroller with 143 terminals, operating at up to 50 MHz. It features 24-Ch 12-Bit ADCs and 2-Ch 12-Bit DACs, suitable for industrial applications requiring high-speed connectivity and extensive peripheral support like CAN, ETHERNET, I2C, SPI, UART.

Median Price

$5.936

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 4,171 parts In-Stock

1+ parts

$5.936

100+ parts

-

1k+ parts

-

10k+ parts

-

4,171

$5.936

-

-

-

Verical

USA . 4,171 parts In-Stock

1+ parts

$5.936

100+ parts

-

1k+ parts

-

10k+ parts

-

4,171

$5.936

-

-

-

Chip1Stop

Japan . 4,239 parts In-Stock

1+ parts

$8.518

100+ parts

$8.129

1k+ parts

$7.830

10k+ parts

-

4,239

$8.518

$8.129

$7.830

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 175 parts In-Stock

1+ parts

$8.092

100+ parts

-

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-

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175

$8.092

-

-

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Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$10.896

100+ parts

-

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-

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50

$10.896

-

-

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Vyrian

USA . 6,500 parts In-Stock

1+ parts

-

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6,500

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-

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Anansix

USA . 1,513 parts In-Stock

1+ parts

-

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1,513

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-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 3,838 parts In-Stock

1+ parts

$7.240

100+ parts

-

1k+ parts

-

10k+ parts

-

3,838

$7.240

-

-

-

Semicontronic

India . 3,759 parts In-Stock

1+ parts

$7.240

100+ parts

$7.059

1k+ parts

$7.023

10k+ parts

-

3,759

$7.240

$7.059

$7.023

-

Corphita

USA . 2,704 parts In-Stock

1+ parts

$7.666

100+ parts

-

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-

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2,704

$7.666

-

-

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AZTECH Wire

Italy . 1,198 parts In-Stock

1+ parts

$9.350

100+ parts

-

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10k+ parts

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1,198

$9.350

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-

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Continental Prestige Electronics

USA . 4,365 parts In-Stock

1+ parts

$10.896

100+ parts

-

1k+ parts

-

10k+ parts

$10.678

4,365

$10.896

-

-

$10.678

Vigor

Singapore . 4,995 parts In-Stock

1+ parts

$12.130

100+ parts

-

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4,995

$12.130

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Microchip USA

USA . 6,758 parts In-Stock

1+ parts

$24.930

100+ parts

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10k+ parts

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6,758

$24.930

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-

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Advanced Electronics

New Zealand . 39 parts In-Stock

1+ parts

$41.624

100+ parts

$39.543

1k+ parts

$39.543

10k+ parts

-

39

$41.624

$39.543

$39.543

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IDEA Electronic Components Group

UK . 74 parts In-Stock

1+ parts

$55.344

100+ parts

-

1k+ parts

$49.810

10k+ parts

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74

$55.344

-

$49.810

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Aztec Data Supply Inc.

USA . 3,397 parts In-Stock

1+ parts

$70.430

100+ parts

-

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3,397

$70.430

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Corohmni

South Africa . 242 parts In-Stock

1+ parts

$76.889

100+ parts

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242

$76.889

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MKK Technologies

India . 342 parts In-Stock

1+ parts

$104.072

100+ parts

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342

$104.072

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DigiPath Technology Company

USA . 342 parts In-Stock

1+ parts

$104.072

100+ parts

-

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342

$104.072

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Lixinc

USA . 11,094 parts In-Stock

1+ parts

-

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11,094

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Argo Parts USA

USA . 4,631 parts In-Stock

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4,631

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iodParts Technologies Inc.

India . 3,000 parts In-Stock

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3,000

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Robosynatics

Brazil . 1,343 parts In-Stock

1+ parts

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1,343

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Lucentia Tech

USA . 1,343 parts In-Stock

1+ parts

-

100+ parts

$79.856

1k+ parts

$78.227

10k+ parts

$78.227

1,343

-

$79.856

$78.227

$78.227

Netroflash

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$10.678

1k+ parts

$10.351

10k+ parts

$10.133

1,000

-

$10.678

$10.351

$10.133

Parana Technologies

USA . 669 parts In-Stock

1+ parts

-

100+ parts

$66.173

1k+ parts

-

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669

-

$66.173

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Perfect Parts

USA . 558 parts In-Stock

1+ parts

-

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558

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Authorized Procurement Solutions

USA . 300 parts In-Stock

1+ parts

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300

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GreenTree Electronics

Israel . 243 parts In-Stock

1+ parts

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243

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Overview

Unlock endless possibilities with the STM32F746ZEY6TR microcontroller by STMicroelectronics. Crafted with precision and innovation, this powerful device offers exceptional performance and reliability for a wide range of applications. From industrial automation to consumer electronics, this versatile microcontroller is designed to meet your needs with ease. Experience seamless connectivity, advanced peripherals, and cutting-edge technology in a compact package. Elevate your projects and unleash your creativity with the STM32F746ZEY6TR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring reliable performance in various environments.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 3.6 V

Supports a higher voltage range, making it suitable for a wide range of applications.

Package Shape: RECTANGULAR

Standard shape that fits well on circuit boards and can be easily integrated into different electronic devices.

Bit Size: 32

Offers high processing power and capability for handling complex tasks and calculations efficiently.

DAC Channels: YES

Allows for analog outputs, enabling the microcontroller to interface with various sensors and devices that require analog signals.

No. of Terminals: 143

Provides multiple connection points for interfacing with other components, peripherals, and external devices.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Enables a compact design and efficient use of space on the circuit board, ideal for compact electronic devices.

Minimum Supply Voltage: 1.7 V

Supports low voltage operation, conserving energy and minimizing power consumption for battery-powered applications.

Maximum Operating Temperature: 85 °C

Ensures reliable operation even in high-temperature environments, making the microcontroller suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Capable of operating in extreme cold conditions, providing versatility for use in various climate settings.

ADC Channels: YES

Enables the microcontroller to convert analog signals into digital data for processing, essential for many sensing and control applications.

DMA Channels: YES

Supports Direct Memory Access for efficient data transfer between memory and peripherals, improving overall system performance.

Terminal Position: BOTTOM

Simplifies the routing of connections on the PCB and facilitates efficient board layout and design.

ROM Words: 524288

Provides ample memory capacity for storing program instructions and data, accommodating complex applications and algorithms.

Maximum Seated Height: 0.585 mm

Low-profile design saves space and allows for compact electronic device designs.

Digital To Analog Convertors: 2-Ch 12-Bit

Enables the microcontroller to generate precise analog signals for interfacing with external components such as actuators and sensors.

Width: 4.539 mm

Compact dimensions for fitting into small electronic devices or densely populated circuit boards.

Peripherals: BOR, DMA(2), LCD, POR, PWM, RTC, TIMER(16), WDT(2)

Offers a wide range of peripheral interfaces and features for diverse application requirements and system integration.

Maximum Clock Frequency: 50 MHz

Supports high-speed operation for quick and efficient processing of instructions, enhancing overall system performance.

Peak Reflow Temperature °C: 260

Can withstand high-temperature reflow soldering processes during manufacturing, ensuring reliable assembly quality.

Length: 5.849 mm

Compact form factor for space-constrained designs and applications.

Temperature Grade: INDUSTRIAL

Suitable for use in industrial environments with demanding temperature and reliability requirements.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes a Reduced Instruction Set Computing (RISC) architecture for efficient and optimized operation, ideal for embedded systems.

RAM Bytes: 327680

Provides ample random access memory for data storage and processing, essential for multitasking and complex algorithms.

Technology: CMOS

Utilizes CMOS technology for low power consumption, enabling energy-efficient operation and extended battery life.

Terminal Form: BALL

Ball grid array terminals ensure reliable connections and facilitate soldering during manufacturing.

Analog To Digital Convertors: 24-Ch 12-Bit

Enables the microcontroller to convert multiple analog signals into digital data simultaneously, suitable for sensor interfacing and data acquisition applications.

Nominal Supply Voltage: 3.3 V

Standard voltage level for compatibility with a wide range of electronic components and power sources.

PWM Channels: YES

Supports Pulse-Width Modulation outputs for precise control of analog circuits and devices, such as motors and LEDs.

Connectivity: CAN(2), ETHERNET, I2C(4), I2S(3), IRDA, LIN, SAI(2), SPI(6), UART(4), USART(4)

Offers extensive connectivity options for interfacing with various communication protocols and devices, increasing system flexibility and compatibility.

ROM Programmability: FLASH

Flash memory allows for easy reprogramming of the microcontroller, facilitating firmware updates and customization.

Terminal Pitch: 0.4 mm

Fine pitch terminals enable high-density mounting on circuit boards, optimizing space utilization and layout design.

Speed: 216 rpm

High processing speed for rapid execution of instructions and real-time control of applications.

On Chip Program ROM Width: 8

Integrated program memory width of 8 bits for efficient storage and retrieval of instructions.

No. of I/O Lines: 114

Abundant input/output lines for connecting external devices and peripherals, enhancing system flexibility and scalability.

Technical Specifications

Microcontrollers STM32F746ZEY6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

IT IS ALSO HAVING DCMI, SDMMC, SPDIFRX(4) CONNECTIVITY

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

50 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

R-PBGA-B143

Length:

5.849 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

114

No. of Terminals:

143

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

327680

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

.585 mm

Speed:

216 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Width:

4.539 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), ETHERNET, I2C(4), I2S(3), IRDA, LIN, SAI(2), SPI(6), UART(4), USART(4)

Peripherals:

BOR, DMA(2), LCD, POR, PWM, RTC, TIMER(16), WDT(2)

Analog To Digital Convertors:

24-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32F746ZEY6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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