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STM32F745VGH7TR

STMicroelectronics

STM32F745VGH7TR by STMicroelectronics

STM32F745VGH7TR by STMicroelectronics is a 32-bit microcontroller with a max clock frequency of 50 MHz. It features 16-Ch 12-Bit ADC channels and 2-Ch 12-Bit DAC channels. This microcontroller is commonly used in industrial applications that require high-speed processing and analog-to-digital conversion capabilities.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Vyrian

USA . 5,561 parts In-Stock

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Digiode

USA . 1,933 parts In-Stock

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Anansix

USA . 964 parts In-Stock

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964

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Nova Conductors

Japan . 500 parts In-Stock

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500

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Distributors (Availability)

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AZTECH Wire

Italy . 315 parts In-Stock

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$16.192

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315

$16.192

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Ampacity Inc.

Singapore . 333 parts In-Stock

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$29.000

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333

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Microchip USA

USA . 4,317 parts In-Stock

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$34.094

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$34.094

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IDEA Electronic Components Group

UK . 1,303 parts In-Stock

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$72.434

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$65.191

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1,303

$72.434

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$65.191

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MKK Technologies

India . 1,000 parts In-Stock

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$136.208

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DigiPath Technology Company

USA . 1,000 parts In-Stock

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$136.208

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$136.208

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Corphita

USA . 4,801 parts In-Stock

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4,801

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Parana Technologies

USA . 2,353 parts In-Stock

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$86.606

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$86.606

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Bastille Electronics

Australia . 1,000 parts In-Stock

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Overview

Discover the STM32F745VGH7TR, a high-quality microcontroller by STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics delivers exceptional products with unmatched reliability. With its extensive range of applications, this microcontroller offers incredible value to customers. Experience the benefits of advanced connectivity options, powerful performance, and precise analog-to-digital conversion. Whether you're working on industrial automation, IoT devices, or consumer electronics, the STM32F745VGH7TR is your go-to solution. Upgrade your projects with this versatile microcontroller and unlock endless possibilities. Trust in STMicroelectronics for innovation, quality, and customer satisfaction.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material ensures durability and cost-effectiveness, making it a reliable choice for various applications.

Surface Mount: YES

With surface mount capability, this microcontroller can be easily integrated into compact and space-saving designs.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for versatile power input options, accommodating a wide range of power sources.

Package Shape: SQUARE

The square package shape provides a convenient form factor for efficient PCB layout and space optimization.

Bit Size: 32

The 32-bit architecture enhances computational capabilities, enabling faster processing and efficient multitasking.

DAC Channels: YES

With multiple DAC channels, this microcontroller can accurately convert digital signals into analog voltages, essential for various audio and sensing applications.

No. of Terminals: 100

The abundance of terminals allows for extensive connectivity options, enabling seamless integration with peripheral devices.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

The grid array, thin profile, and fine pitch package style ensures reliable electrical connections, excellent signal integrity, and compatibility with advanced PCB manufacturing processes.

Minimum Supply Voltage: 1.7 V

The low minimum supply voltage facilitates energy-efficient operation and extends battery life in portable applications.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature range makes it suitable for demanding industrial environments, ensuring reliable performance under extreme conditions.

Minimum Operating Temperature: -40 °C

The wide minimum operating temperature range allows for reliable operation in harsh cold environments, expanding the application possibilities.

ADC Channels: YES

The microcontroller's multiple ADC channels enable precise and accurate conversion of analog signals into digital data, ideal for measurement and sensing applications.

DMA Channels: YES

With DMA channels, the microcontroller can efficiently perform data transfers between peripherals and memory, minimizing CPU workload and enhancing overall system performance.

Terminal Position: BOTTOM

The bottom terminal position offers ease of PCB mounting and soldering, simplifying the manufacturing and assembly process.

ROM Words: 1048576

The large ROM size provides ample storage capacity for program code, facilitating complex application development.

Maximum Seated Height: 1.1 mm

The low maximum seated height allows for compact and slim device designs, especially crucial for space-constrained applications.

Digital To Analog Convertors: 2-Ch 12-Bit

With two 12-bit DACs, this microcontroller offers accurate and reliable generation of analog signals, supporting various audio and control applications.

Width: 8 mm

The compact width dimension allows for efficient space utilization on PCBs, enabling designs with smaller form factors.

Peripherals: BOR, DMA(2), POR, PWM, RTC, TIMER(16), WDT(2)

The microcontroller's wide range of peripherals, including Brown-Out Reset (BOR), DMA channels, Power-On Reset (POR), PWM, Real-Time Clock (RTC), timers, and watchdog timers, enhance its versatility and functionality, making it suitable for diverse applications.

Maximum Clock Frequency: 50 MHz

The high maximum clock frequency ensures fast and efficient data processing, enabling rapid execution of instructions and real-time operations.

Length: 8 mm

The compact length dimension contributes to space-efficient PCB designs and enables versatile placement in various electronic devices.

Temperature Grade: INDUSTRIAL

The microcontroller's industrial-grade temperature rating ensures it can withstand and operate reliably in challenging industrial settings.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a microcontroller with a RISC (Reduced Instruction Set Computing) architecture, it offers efficient execution of instructions, optimized power consumption, and reliable performance.

RAM Bytes: 327680

The generous RAM size provides ample memory for data storage, enabling efficient data processing and multitasking.

Technology: CMOS

Utilizing complementary metal-oxide-semiconductor (CMOS) technology, this microcontroller offers low power consumption, high noise immunity, and compatibility with various digital integrated circuits.

Terminal Form: BALL

The ball terminal form simplifies the soldering and connection process, ensuring stable and reliable electrical and mechanical connections.

Analog To Digital Convertors: 16-Ch 12-Bit

With sixteen 12-bit ADCs, the microcontroller supports precise and accurate conversion of multiple analog signals into digital data, suitable for various sensor-based applications.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage provides a standardized and widely available power source, facilitating ease of integration and compatibility with other electronic components.

PWM Channels: YES

The microcontroller's support for PWM (Pulse-Width Modulation) channels allows for precise control of analog outputs, enabling applications such as motor speed control and LED dimming.

Connectivity: CAN(2), ETHERNET, I2C(4), I2S(3), IRDA, LIN, SAI(2), SPI(4), UART(4), USART(4)

With a wide range of connectivity options, including CAN, Ethernet, I2C, I2S, IRDA, LIN, SAI, SPI, UART, and USART interfaces, this microcontroller enables seamless integration and communication with various peripheral devices and networks.

ROM Programmability: FLASH

The microcontroller's programmable ROM (Read-Only Memory) using flash technology allows for easy and flexible firmware updates, facilitating iterative development and customization.

Terminal Pitch: 0.8 mm

The tight terminal pitch provides efficient utilization of PCB space, allowing for high-density designs and compatibility with advanced PCB manufacturing technologies.

Speed: 200 rpm

The microcontroller's high speed of 200 revolutions per minute (rpm) enables rapid data processing and responsive control in motor-driven applications.

On Chip Program ROM Width: 8

With an on-chip program ROM width of 8 bits, the microcontroller offers versatility in program storage and execution, supporting a wide range of software applications.

No. of I/O Lines: 82

The abundance of I/O lines allows for extensive interfacing with external devices, sensors, and actuators, facilitating diverse functionality and system integration.

Technical Specifications

Microcontrollers STM32F745VGH7TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

IT IS ALSO HAVING DCMI, SDMMC, SPDIFRX(4) CONNECTIVITY

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

50 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B100

Length:

8 mm

No. of I/O Lines:

82

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

RAM Bytes:

327680

ROM Words:

1048576

ROM Programmability:

FLASH

Maximum Seated Height:

1.1 mm

Speed:

200 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

8 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), ETHERNET, I2C(4), I2S(3), IRDA, LIN, SAI(2), SPI(4), UART(4), USART(4)

Peripherals:

BOR, DMA(2), POR, PWM, RTC, TIMER(16), WDT(2)

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32F745VGH7TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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