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STM32F479ZGT6

STMicroelectronics

STM32F479ZGT6 by STMicroelectronics

STM32F479ZGT6 by STMicroelectronics is a 32-bit microcontroller with Cortex-M4 CPU family, featuring 144 terminals and 16 external interrupts. It offers 2-Ch 12-Bit DAC channels, 20-Ch 12-Bit ADC channels, and operates at a max clock frequency of 26 MHz. Ideal for industrial applications requiring high-speed processing and extensive peripheral connectivity via CAN(2), I2C(3), SPI(4), UART(3), USART(4).

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,030 parts In-Stock

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7,030

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Anansix

USA . 2,603 parts In-Stock

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2,603

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Digiode

USA . 571 parts In-Stock

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571

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Nova Conductors

Japan . 19 parts In-Stock

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Semicontronic

India . 1,048 parts In-Stock

1+ parts

$7.000

100+ parts

$6.825

1k+ parts

$6.790

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-

1,048

$7.000

$6.825

$6.790

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Ampacity Inc.

Singapore . 1,138 parts In-Stock

1+ parts

$10.000

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-

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1,138

$10.000

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Vigor

Singapore . 1,220 parts In-Stock

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$12.590

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1,220

$12.590

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AZTECH Wire

Italy . 431 parts In-Stock

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$13.959

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431

$13.959

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Microchip USA

USA . 1,516 parts In-Stock

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$43.257

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1,516

$43.257

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Aztec Data Supply Inc.

USA . 154 parts In-Stock

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$45.260

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154

$45.260

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Corohmni

South Africa . 27 parts In-Stock

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$60.659

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27

$60.659

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IDEA Electronic Components Group

UK . 2,196 parts In-Stock

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$78.006

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$70.205

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$78.006

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$70.205

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

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$87.413

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$83.042

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$83.042

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$87.413

$83.042

$83.042

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MKK Technologies

India . 225 parts In-Stock

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$146.685

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225

$146.685

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DigiPath Technology Company

USA . 225 parts In-Stock

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$146.685

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225

$146.685

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Corphita

USA . 2,652 parts In-Stock

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Argo Parts USA

USA . 1,909 parts In-Stock

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Bastille Electronics

Australia . 1,000 parts In-Stock

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1,000

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Parana Technologies

USA . 372 parts In-Stock

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$93.268

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372

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$93.268

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Continental Prestige Electronics

USA . 235 parts In-Stock

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Overview

Unleash the power of innovation with the STM32F479ZGT6 by STMicroelectronics, a top-tier microcontroller that promises unmatched quality and reliability. With cutting-edge technology and advanced features, this versatile device is perfect for a wide range of applications. From industrial automation to consumer electronics, the STM32F479ZGT6 delivers exceptional performance, seamless connectivity, and low power consumption. Trust in STMicroelectronics, a renowned manufacturer known for pushing boundaries and exceeding expectations. Upgrade your projects with the STM32F479ZGT6 and experience the value, benefits, and advantages it brings to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microcontroller, ensuring long-lasting performance in various environments.

Integrated Cache: YES

The integrated cache helps in speeding up data access, which can improve the overall performance of the microcontroller.

Maximum Supply Voltage: 3.6 V

Having a high maximum supply voltage allows for flexibility in power supply options, making it suitable for a wide range of applications.

On Chip Data RAM Width: 32

The wide data RAM width enhances the data processing capabilities of the microcontroller, enabling it to handle complex tasks efficiently.

Address Bus Width: 32

A wide address bus width allows for efficient memory addressing, which is essential for accessing large amounts of data in memory.

Package Shape: SQUARE

The square package shape offers a compact design, making the microcontroller easy to integrate into smaller devices or tight spaces.

Bit Size: 32

A 32-bit architecture allows for higher computational power and better performance compared to lower bit sizes, making it suitable for demanding applications.

No. of Terminals: 144

Having a large number of terminals provides flexibility in connectivity options, allowing the microcontroller to interface with a variety of external devices.

Minimum Supply Voltage: 1.7 V

The low minimum supply voltage ensures energy efficiency and extends the battery life of devices powered by this microcontroller.

CPU Family: CORTEX-M4

The use of the Cortex-M4 architecture ensures high performance and efficient operation, making it an ideal choice for embedded systems and IoT devices.

No. of External Interrupts: 16

Having multiple external interrupts allows the microcontroller to respond quickly to external events, enhancing real-time responsiveness in applications.

ADC Channels: YES

The presence of Analog-to-Digital Converter channels enables the microcontroller to interface with analog sensors and signals, expanding its range of applications.

DMA Channels: YES

Direct Memory Access channels help in offloading data transfer tasks from the CPU, improving overall system efficiency and performance.

ROM Words: 1048576

With a large ROM capacity, the microcontroller can store a significant amount of program data, enabling the implementation of complex algorithms and functions.

RAM Words: 98304

A substantial RAM capacity allows for efficient data storage and manipulation during program execution, enhancing the microcontroller's multitasking capabilities.

Maximum Clock Frequency: 26 MHz

A high clock frequency enables fast execution of instructions, resulting in quicker response times and improved overall performance.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology offers low power consumption and high noise immunity, making the microcontroller efficient and reliable.

Analog To Digital Convertors: 20-Ch 12-Bit

Having multiple high-resolution ADC channels allows for accurate analog signal conversion, suitable for applications that require precise measurements.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller ensures efficient instruction execution and high performance, making it a reliable choice for embedded systems.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh environments with varying temperatures, making it suitable for industrial applications.

No. of Timers: 14

Having multiple timers allows for precise timing control in various functions and processes, enhancing the microcontroller's versatility.

Connectivity: CAN(2), I2C(3), I2S(2), SAI, SPI(4), UART(3), USART(4)

Support for multiple communication protocols enables seamless integration with various devices and systems, expanding the microcontroller's connectivity capabilities.

Speed: 180 rpm

The high speed of 180 revolutions per minute facilitates fast data processing and execution, improving the overall performance of the microcontroller.

Low Power Mode: YES

The low power mode feature allows the microcontroller to operate efficiently while conserving energy, making it suitable for battery-powered devices and energy-conscious applications.

Technical Specifications

Microcontrollers STM32F479ZGT6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

32

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

26 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

26

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G144

Length:

20 mm

Low Power Mode:

YES

No. of DMA Channels:

16

No. of External Interrupts:

16

No. of I/O Lines:

131

No. of Terminals:

144

No. of Timers:

14

On Chip Data RAM Width:

32

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

393216

RAM Words:

98304

ROM Words:

1048576

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

180 rpm

Maximum Supply Current:

142 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), I2C(3), I2S(2), SAI, SPI(4), UART(3), USART(4)

Peripherals:

BOR, POR, TIMER(14), WDT

Analog To Digital Convertors:

20-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32F479ZGT6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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