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STM32F429NIH6TR

STMicroelectronics

STM32F429NIH6TR by STMicroelectronics

STM32F429NIH6TR by STMicroelectronics is a 32-bit microcontroller with Cortex-M4 CPU, 26-bit address bus, and 8-bit on-chip data RAM. It features 2 DAC channels, 24 ADC channels, and connectivity options like CAN, I2C, SPI, UART, USB. Ideal for industrial applications requiring high-speed processing and low power consumption.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Chip Stock

USA . 17,537 parts In-Stock

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Vyrian

USA . 10,951 parts In-Stock

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Component Sense

UK . 8,805 parts In-Stock

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Digiode

USA . 2,693 parts In-Stock

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2,693

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Anansix

USA . 2,026 parts In-Stock

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2,026

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Nova Conductors

Japan . 870 parts In-Stock

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870

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Distributors (Availability)

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Vigor

Singapore . 5,465 parts In-Stock

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$13.160

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5,465

$13.160

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AZTECH Wire

Italy . 551 parts In-Stock

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$16.733

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551

$16.733

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Semicontronic

India . 196 parts In-Stock

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$18.000

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$17.550

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$17.460

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196

$18.000

$17.550

$17.460

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Ampacity Inc.

Singapore . 961 parts In-Stock

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$20.000

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961

$20.000

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IDEA Electronic Components Group

UK . 894 parts In-Stock

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$26.779

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$24.101

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894

$26.779

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Microchip USA

USA . 2,843 parts In-Stock

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$42.155

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MKK Technologies

India . 2,274 parts In-Stock

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$50.357

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DigiPath Technology Company

USA . 2,274 parts In-Stock

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$50.357

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Aztec Data Supply Inc.

USA . 123 parts In-Stock

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$52.130

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$52.130

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Advanced Electronics

New Zealand . 100 parts In-Stock

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$55.509

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$52.733

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$52.733

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100

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$52.733

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Corohmni

South Africa . 237 parts In-Stock

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$65.364

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QUARKTWIN TECHNOLOGY LTD

USA . 9,324 parts In-Stock

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Corphita

USA . 1,695 parts In-Stock

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Robosynatics

Brazil . 1,505 parts In-Stock

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Lucentia Tech

USA . 1,505 parts In-Stock

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$14.531

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$14.531

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$14.531

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Parana Technologies

USA . 1,317 parts In-Stock

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$32.019

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Argo Parts USA

USA . 578 parts In-Stock

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Bastille Electronics

Australia . 500 parts In-Stock

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Continental Prestige Electronics

USA . 254 parts In-Stock

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Overview

Unlock the potential of your projects with the STM32F429NIH6TR microcontroller by STMicroelectronics. Known for their high-quality products, STMicroelectronics delivers reliable performance and innovative features in all their offerings. The STM32F429NIH6TR is perfect for a wide range of applications, from industrial automation to consumer electronics. With advanced functionalities like DAC and ADC channels, DMA support, and a variety of connectivity options, this microcontroller offers unmatched value, flexibility, and efficiency to meet all your design needs. Choose the STM32F429NIH6TR and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protects the internals of the microcontroller, making it suitable for various environmental conditions.

Maximum Supply Voltage: 3.6 V

A higher maximum supply voltage allows the microcontroller to handle a wider range of power inputs, increasing its versatility.

CPU Family: CORTEX-M4

CORTEX-M4 architecture offers high performance and efficiency, making this microcontroller suitable for complex applications requiring processing power.

ADC Channels: YES

Having ADC channels enables the microcontroller to convert analog signals to digital, making it suitable for sensor interfacing and data acquisition applications.

DMA Channels: YES

DMA channels improve data transfer efficiency by allowing peripherals to access memory directly, reducing CPU load and enhancing overall system performance.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture provides efficient processing capabilities, allowing the microcontroller to execute instructions quickly and handle various tasks simultaneously.

Connectivity: CAN(2), I2C(3), I2S(2), SAI, SPI(6), UART(4), USART(4), USB(2)

Multiple connectivity options enable the microcontroller to communicate with a wide range of external devices, making it suitable for diverse embedded system designs.

Speed: 180 rpm

A high clock frequency of 180 rpm allows the microcontroller to execute instructions quickly, making it suitable for real-time applications that require fast response times.

Low Power Mode: YES

Low power mode capability helps reduce power consumption during idle or low activity periods, prolonging battery life and making the microcontroller energy-efficient.

Technical Specifications

Microcontrollers STM32F429NIH6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

26

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

26 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B216

Length:

13 mm

Low Power Mode:

YES

No. of DMA Channels:

2

No. of External Interrupts:

16

No. of I/O Lines:

168

No. of Serial I/Os:

6

No. of Terminals:

216

No. of Timers:

15

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA216,15X15,32

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

RAM Bytes:

266240

ROM Words:

2097152

ROM Programmability:

FLASH

Maximum Seated Height:

1.1 mm

Speed:

180 rpm

Maximum Supply Current:

100 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

13 mm

Peripheral IC Type:

Connectivity:

CAN(2), I2C(3), I2S(2), SAI, SPI(6), UART(4), USART(4), USB(2)

Peripherals:

BOR, DMA(16), POR, RTC, TIMER(15), WDT(2)

Analog To Digital Convertors:

24-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32F429NIH6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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