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STM32F417IGH6TR

STMicroelectronics

STM32F417IGH6TR by STMicroelectronics

STM32F417IGH6TR by STMicroelectronics is a 32-bit microcontroller with 176 terminals, operating at a max frequency of 26 MHz. It features 24 ADC channels, 2 DAC channels, and peripherals like PWM, RTC, and DMA. Ideal for industrial applications requiring high-speed processing and connectivity via CAN, Ethernet, I2C, SPI, UART, USB interfaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 9,553 parts In-Stock

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9,553

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Chip Stock

USA . 3,320 parts In-Stock

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3,320

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Digiode

USA . 2,861 parts In-Stock

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2,861

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Anansix

USA . 947 parts In-Stock

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947

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

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AZTECH Wire

Italy . 1,183 parts In-Stock

1+ parts

$10.930

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1,183

$10.930

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Vigor

Singapore . 8,995 parts In-Stock

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$11.080

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8,995

$11.080

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Ampacity Inc.

Singapore . 1,067 parts In-Stock

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$17.000

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1,067

$17.000

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Semicontronic

India . 1,493 parts In-Stock

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$26.000

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$25.350

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$25.220

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$26.000

$25.350

$25.220

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Microchip USA

USA . 4,195 parts In-Stock

1+ parts

$35.500

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$34.990

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$34.740

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$34.480

4,195

$35.500

$34.990

$34.740

$34.480

IDEA Electronic Components Group

UK . 43 parts In-Stock

1+ parts

$64.837

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$58.353

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43

$64.837

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$58.353

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Corohmni

South Africa . 772 parts In-Stock

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$67.724

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772

$67.724

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Aztec Data Supply Inc.

USA . 178 parts In-Stock

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$76.970

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178

$76.970

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Advanced Electronics

New Zealand . 450 parts In-Stock

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$79.127

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$75.170

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$75.170

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450

$79.127

$75.170

$75.170

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MKK Technologies

India . 1,184 parts In-Stock

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$121.922

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$121.922

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DigiPath Technology Company

USA . 1,184 parts In-Stock

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$121.922

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$121.922

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Perfect Parts

USA . 6,720 parts In-Stock

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Lixinc

USA . 5,273 parts In-Stock

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Corphita

USA . 4,570 parts In-Stock

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Continental Prestige Electronics

USA . 2,881 parts In-Stock

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Argo Parts USA

USA . 1,923 parts In-Stock

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Parana Technologies

USA . 1,544 parts In-Stock

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$77.522

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$77.522

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Bastille Electronics

Australia . 800 parts In-Stock

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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Robosynatics

Brazil . 150 parts In-Stock

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150

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Lucentia Tech

USA . 150 parts In-Stock

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150

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Overview

Unleash the power of innovation with the STM32F417IGH6TR microcontroller by STMicroelectronics. Crafted with precision and reliability, this product offers unparalleled performance in a wide range of applications. From industrial automation to consumer electronics, this Cortex-M4 CPU family device delivers seamless connectivity, advanced peripherals, and efficient power management. Experience the future of technology with the STM32F417IGH6TR and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, making it suitable for various applications.

Surface Mount: YES

Allows for easy and efficient mounting on PCBs, saving assembly time and space.

Maximum Supply Voltage: 3.6 V

Supports a wide range of supply voltages, providing flexibility in power requirements.

Package Shape: SQUARE

Square shape allows for efficient use of space on the PCB.

Bit Size: 32

32-bit processing capability enables handling of complex tasks and data processing efficiently.

DAC Channels: YES

Digital-to-Analog Converters enable the microcontroller to interface with analog components or sensors.

Power Supplies (V): 2/3.3

Support for multiple power supply options allows for compatibility with different power sources.

No. of Terminals: 176

Ample terminals provide numerous connection points for interfacing with external components.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

This package style offers a compact form factor, making it suitable for space-constrained applications.

Minimum Supply Voltage: 1.8 V

Allows operation at low supply voltages, ideal for energy-efficient designs.

Maximum Operating Temperature: 85 °C

Wide operating temperature range enables reliable operation in various environments.

CPU Family: CORTEX-M4

Uses a powerful Cortex-M4 processor core for efficient and high-performance operation.

Minimum Operating Temperature: -40 °C

Capable of operating in extreme cold temperatures, suitable for harsh environments.

ADC Channels: YES

Analog-to-Digital Converters enable the microcontroller to read analog signals from sensors or other external devices.

DMA Channels: YES

Direct Memory Access channels offload data transfer tasks from the CPU, enhancing system performance.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and routing of connections.

ROM Words: 1048576

Large ROM capacity allows for storing program instructions and data.

Maximum Seated Height: 0.6 mm

Low seated height saves space and allows for compact designs.

Digital To Analog Convertors: 2-CH 12-BIT

High-resolution DACs provide accurate analog output for precise control or signal generation.

Width: 10 mm

Compact width enables placement in tight spaces on the PCB.

Peripherals: BOR, CRC, DMA(2), LCD, PWM, RTC, TEMPERATURE SENSOR, TIMER(14), WDT(2)

A wide range of peripherals enhances the microcontroller's capabilities for diverse applications.

Maximum Clock Frequency: 26 MHz

High clock frequency allows for fast processing of data and real-time control.

Length: 10 mm

Compact length complements the width, providing a small footprint on the PCB.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable operation in harsh industrial environments.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture and microcontroller integration offer efficient and streamlined operation.

RAM Bytes: 200704

Generous RAM capacity for storing data and variables during program execution.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity for reliable operation.

Terminal Form: BALL

Ball terminal form simplifies soldering and ensures secure connections on the PCB.

Analog To Digital Convertors: 24-Ch 12-bit (3)

Multiple high-resolution ADC channels enable precise analog signal acquisition from various sources.

Maximum Supply Current: 109 mA

Moderate supply current consumption for efficient power usage.

Nominal Supply Voltage: 3.3 V

Stable and common supply voltage for consistent performance.

PWM Channels: YES

Pulse Width Modulation channels allow for precise control of analog outputs.

Connectivity: CAN(2), ETHERNET, I2C(3), I2S(2), IRDA, LIN, MMC, PMBUS, SMBUS, SPI(3), UART(2), USART(4), USB(2)

Diverse connectivity options for communication with external devices and networks.

ROM Programmability: FLASH

Flash programmability enables easy and flexible updating of the microcontroller's firmware.

Terminal Pitch: 0.65 mm

Fine terminal pitch allows for high-density mounting on the PCB.

Speed: 168 rpm

High operational speed for responsive performance in real-time applications.

On Chip Program ROM Width: 8

On-chip ROM width of 8 bits facilitates efficient program execution and storage.

No. of I/O Lines: 140

Abundance of I/O lines for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers STM32F417IGH6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

26 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B176

Length:

10 mm

No. of I/O Lines:

140

No. of Terminals:

176

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA176,15X15,25

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

200704

ROM Words:

1048576

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

168 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

109 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), ETHERNET, I2C(3), I2S(2), IRDA, LIN, MMC, PMBUS, SMBUS, SPI(3), UART(2), USART(4), USB(2)

Peripherals:

BOR, CRC, DMA(2), LCD, PWM, RTC, TEMPERATURE SENSOR, TIMER(14), WDT(2)

Analog To Digital Convertors:

24-Ch 12-bit (3)

Digital To Analog Convertors:

2-CH 12-BIT

Trade Compliance

STM32F417IGH6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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