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STM32F413CHU3TR

STMicroelectronics

STM32F413CHU3TR by STMicroelectronics

STM32F413CHU3TR by STMicroelectronics is a 32-bit microcontroller with 10-Ch 12-bit ADC, 2-Ch 12-Bit DAC, and 327680 bytes of RAM. Ideal for automotive applications, it offers connectivity options like CAN(3), I2C(3), SPI(5), and USB along with a max clock frequency of 26 MHz. Operating temperature ranges from -40 to 125 °C.

Median Price

$7.990

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

EBV Elektronik

Germany . 7,500 parts In-Stock

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-

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7,500

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TME

Poland . 12,500 parts In-Stock

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$7.990

12,500

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$7.990

Vyrian

USA . 7,377 parts In-Stock

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7,377

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Digiode

USA . 4,732 parts In-Stock

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4,732

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Anansix

USA . 2,262 parts In-Stock

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2,262

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Nova Conductors

Japan . 150 parts In-Stock

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Distributors (Availability)

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Vigor

Singapore . 9,000 parts In-Stock

1+ parts

$9.480

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9,000

$9.480

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AZTECH Wire

Italy . 464 parts In-Stock

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$12.190

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464

$12.190

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Semicontronic

India . 7,481 parts In-Stock

1+ parts

$14.000

100+ parts

$13.650

1k+ parts

$13.580

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7,481

$14.000

$13.650

$13.580

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Aztec Data Supply Inc.

USA . 11,091 parts In-Stock

1+ parts

$28.710

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$28.710

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Ampacity Inc.

Singapore . 7,078 parts In-Stock

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$29.000

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$29.000

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Microchip USA

USA . 5,229 parts In-Stock

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$30.368

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5,229

$30.368

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IDEA Electronic Components Group

UK . 1,331 parts In-Stock

1+ parts

$35.867

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$32.280

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1,331

$35.867

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$32.280

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Corohmni

South Africa . 13 parts In-Stock

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$55.285

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13

$55.285

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MKK Technologies

India . 1,789 parts In-Stock

1+ parts

$67.446

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1,789

$67.446

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DigiPath Technology Company

USA . 1,789 parts In-Stock

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$67.446

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1,789

$67.446

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Continental Prestige Electronics

USA . 2,833 parts In-Stock

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2,833

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Parana Technologies

USA . 1,857 parts In-Stock

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$42.885

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1,857

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$42.885

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Argo Parts USA

USA . 1,582 parts In-Stock

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1,582

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Corphita

USA . 590 parts In-Stock

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590

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Bastille Electronics

Australia . 500 parts In-Stock

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500

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Overview

Experience the next level of performance and innovation with the STM32F413CHU3TR microcontroller by STMicroelectronics. Designed with precision and reliability, this chip offers unparalleled advantages in a wide range of applications. From automotive to industrial automation, this microcontroller delivers exceptional value and benefits to customers seeking cutting-edge technology. With a maximum clock frequency of 26 MHz and a temperature grade suitable for automotive use, the STM32F413CHU3TR ensures superior performance and reliability in every project. Elevate your designs with the STM32F413CHU3TR and experience the quality that only STMicroelectronics can provide.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, making this product suitable for high volume production.

Maximum Supply Voltage: 3.6 V

Support for a high maximum supply voltage allows for flexibility in power supply options and compatibility with a wide range of applications.

Address Bus Width: 26

A wider address bus provides the capability to address a larger memory space, enabling the handling of more complex data and programs.

Package Shape: SQUARE

Square package shape offers good balance between space efficiency and handling during assembly and installation.

Bit Size: 32

With a 32-bit architecture, this microcontroller can process larger chunks of data at a time, enhancing performance in computation-intensive tasks.

DAC Channels: YES

Integrated DAC channels support analog output functionalities, enabling precise control over analog signals in various applications.

No. of Terminals: 48

Having a high number of terminals allows for more connectivity options and peripherals to be interfaced with the microcontroller, expanding its capabilities.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The variety of package styles offered ensures compatibility with different mounting and cooling requirements, making it versatile in various deployment scenarios.

Minimum Supply Voltage: 1.7 V

Support for a low minimum supply voltage allows for energy-efficient operation and compatibility with battery-powered applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature rating ensures reliable performance even in harsh environmental conditions or high-temperature environments.

Minimum Operating Temperature: -40 °C

Wide operating temperature range enables the microcontroller to function in extreme cold conditions, increasing its versatility for various industrial or automotive applications.

ADC Channels: YES

Built-in ADC channels facilitate analog input capabilities, enabling the microcontroller to interface with various sensors and measure external analog signals accurately.

DMA Channels: YES

Integrated DMA channels enable efficient data transfer between peripherals and memory without CPU intervention, improving overall system performance and reducing latency.

Terminal Position: QUAD

Quad terminal positioning offers a compact and efficient layout for easy board routing and signal integrity, optimizing PCB design and minimizing size constraints.

ROM Words: 1572864

Large ROM capacity allows for storage of extensive program code and data, accommodating complex algorithms and applications with significant memory requirements.

Maximum Seated Height: 0.65 mm

Low seated height enables the microcontroller to be used in thin-profile applications where space is limited, providing flexibility in product design and integration.

Digital To Analog Convertors: 2-Ch 12-Bit

Multiple DAC channels with high resolution provide accurate analog output for various control and signal processing tasks, enhancing overall system performance.

Width: 7 mm

Compact width dimension allows for space-saving placement on the PCB, enabling dense and efficient board layouts in constrained enclosure designs.

External Data Bus Width: 16

Wider external data bus allows for faster data transfer between the microcontroller and external memory or peripherals, improving overall system throughput and efficiency.

Peripherals: BOR, DMA, LCD, PDM, POR, PWM, RTC, TIMER(16), WDT(2)

Rich set of integrated peripherals offers diverse capabilities for handling various tasks such as data transfer, display control, power management, and timing functions, enhancing the versatility of the microcontroller.

Maximum Clock Frequency: 26 MHz

High maximum clock frequency enables fast execution of instructions and operations, supporting real-time processing requirements in time-critical applications.

Length: 7 mm

Compact length dimension allows for flexible placement on the PCB, facilitating efficient board layouts and saving space in small form-factor designs.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive-grade standards, ensuring reliable operation in automotive applications with stringent requirements for temperature, vibration, and reliability.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC-based microcontroller architecture offers high performance, low power consumption, and efficient code execution, making it ideal for embedded applications with real-time processing needs.

RAM Bytes: 327680

Generous RAM capacity provides ample space for temporary data storage and processing, supporting multitasking and data-intensive applications with efficient memory management.

Technology: CMOS

CMOS technology offers a good balance of performance, power efficiency, and integration capabilities, making the microcontroller suitable for a wide range of applications with diverse requirements.

Terminal Form: NO LEAD

No-lead terminal form enhances solder joint reliability, signal integrity, and thermal performance, ensuring robust connectivity and long-term stability in demanding operating conditions.

Analog To Digital Convertors: 10-Ch 12-bit

Multiple ADC channels with high resolution provide accurate analog input for sensor data acquisition and signal processing, enabling precise measurement and control in various applications.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage simplifies power supply design and compatibility considerations, ensuring consistent and reliable operation in a wide range of voltage conditions.

PWM Channels: YES

Integrated PWM channels enable precise control over analog outputs and motor speed regulation, facilitating tasks such as LED dimming, power management, and motor control in various applications.

Connectivity: CAN(3), I2C(3), I2S(5), IRDA, LIN, PMBUS, SAI, SD, SMBUS, SPI(5), UART(3), USART(3), USB

Diverse connectivity options support a wide range of communication protocols for interfacing with sensors, displays, memory devices, and peripherals, enhancing system integration and compatibility.

ROM Programmability: FLASH

Flash programmability allows for easy and quick updates of firmware and software configurations, enabling agile development and field upgrades without the need for external programming hardware.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density packaging and efficient board layout, maximizing PCB real estate usage and enabling compact and miniaturized product designs.

Speed: 100 rpm

High-speed processing capabilities support rapid data throughput and responsive system operation, making the microcontroller suitable for real-time control and high-performance computing applications.

On Chip Program ROM Width: 8

The presence of on-chip program ROM provides built-in memory for storing firmware and boot code, reducing the need for external memory components and simplifying system design.

No. of I/O Lines: 36

Abundance of I/O lines facilitates versatile connectivity options for interfacing with external devices, sensors, and peripherals, enabling flexible system configurations and integration possibilities.

Technical Specifications

Microcontrollers STM32F413CHU3TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

26

Bit Size:

32

Maximum Clock Frequency:

26 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

16

JESD-30 Code:

S-XQCC-N48

Length:

7 mm

No. of I/O Lines:

36

No. of Terminals:

48

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

327680

ROM Words:

1572864

ROM Programmability:

FLASH

Maximum Seated Height:

.65 mm

Speed:

100 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(3), I2C(3), I2S(5), IRDA, LIN, PMBUS, SAI, SD, SMBUS, SPI(5), UART(3), USART(3), USB

Peripherals:

BOR, DMA, LCD, PDM, POR, PWM, RTC, TIMER(16), WDT(2)

Analog To Digital Convertors:

10-Ch 12-bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32F413CHU3TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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