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STM32F412ZET7

STMicroelectronics

STM32F412ZET7 by STMicroelectronics

STM32F412ZET7 by STMicroelectronics is a 32-bit microcontroller with Cortex-M4 CPU, 262144 bytes of RAM, and 524288 ROM words. It features 16 ADC channels, 16 DMA channels, and operates at a max clock frequency of 26 MHz. Ideal for applications requiring low power mode, such as IoT devices and industrial automation systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,734 parts In-Stock

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3,734

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Vyrian

USA . 2,831 parts In-Stock

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2,831

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Anansix

USA . 1,571 parts In-Stock

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1,571

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Nova Conductors

Japan . 500 parts In-Stock

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500

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Vigor

Singapore . 2,351 parts In-Stock

1+ parts

$8.520

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-

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2,351

$8.520

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Ampacity Inc.

Singapore . 641 parts In-Stock

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$11.000

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-

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641

$11.000

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AZTECH Wire

Italy . 420 parts In-Stock

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$18.867

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420

$18.867

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Microchip USA

USA . 2,660 parts In-Stock

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$26.608

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2,660

$26.608

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Semicontronic

India . 1,019 parts In-Stock

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$28.000

100+ parts

$27.300

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$27.160

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1,019

$28.000

$27.300

$27.160

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Aztec Data Supply Inc.

USA . 2,873 parts In-Stock

1+ parts

$31.390

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2,873

$31.390

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Corohmni

South Africa . 78 parts In-Stock

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$33.407

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78

$33.407

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IDEA Electronic Components Group

UK . 857 parts In-Stock

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$46.746

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$42.072

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857

$46.746

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$42.072

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

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$87.458

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$83.085

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$83.085

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$87.458

$83.085

$83.085

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MKK Technologies

India . 809 parts In-Stock

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$87.903

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809

$87.903

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DigiPath Technology Company

USA . 809 parts In-Stock

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$87.903

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809

$87.903

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Continental Prestige Electronics

USA . 4,219 parts In-Stock

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Corphita

USA . 2,945 parts In-Stock

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Argo Parts USA

USA . 1,012 parts In-Stock

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1,012

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Parana Technologies

USA . 760 parts In-Stock

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$55.892

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$55.892

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Bastille Electronics

Australia . 450 parts In-Stock

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450

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Overview

Experience the cutting-edge technology of the STM32F412ZET7 microcontroller by STMicroelectronics, a trusted manufacturer known for delivering top-quality products. Ideal for a wide range of applications, this microcontroller offers unparalleled performance and versatility. With features like low power mode, high-speed connectivity options, and a wide range of peripherals, this product provides exceptional value and benefits to customers looking for reliable and efficient solutions. Upgrade your projects with the STM32F412ZET7 and unlock endless possibilities in the world of microcontrollers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material helps in reducing overall weight of the product.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in powering the device within safe limits.

No. of External Interrupts: 16

Provides more options for handling external events and improving responsiveness.

ADC Channels: YES

Allows for analog to digital conversion, enabling the device to interface with sensors and other analog devices.

Peripheral IC Type: MICROCONTROLLER, RISC

Uses Reduced Instruction Set Computing architecture for efficient processing and execution of instructions.

Connectivity: CAN(2), I2C(3), I2S(5), MMC, SPI(5), USART(4), USB

Offers a wide range of communication options for connecting with external devices and peripherals.

No. of I/O Lines: 114

Provides ample input/output options for interfacing with external components and circuits.

Technical Specifications

Microcontrollers STM32F412ZET7 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

26 MHz

DAC Channels:

NO

DMA Channels:

YES

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G144

Length:

20 mm

Low Power Mode:

YES

No. of DMA Channels:

16

No. of External Interrupts:

16

No. of I/O Lines:

114

No. of Serial I/Os:

4

No. of Terminals:

144

No. of Timers:

15

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

262144

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

100 rpm

Maximum Supply Current:

44.28 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), I2C(3), I2S(5), MMC, SPI(5), USART(4), USB

Peripherals:

BOR, DMA(16), LCD, PDR, POR, PVD, RTC, TIMER(14), WDT

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

STM32F412ZET7 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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