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STM32F411CEY3TR

STMicroelectronics

STM32F411CEY3TR by STMicroelectronics

STM32F411CEY3TR microcontroller by STMicroelectronics features a 32-bit architecture, operates at a nominal voltage of 3.3V, and supports up to 26 MHz clock frequency. With ADC and PWM channels, it's ideal for embedded applications in automation and control systems. Its compact design ensures efficient integration into various devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,501 parts In-Stock

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7,501

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Digiode

USA . 4,753 parts In-Stock

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Anansix

USA . 1,109 parts In-Stock

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Vigor

Singapore . 5,684 parts In-Stock

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$5.360

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5,684

$5.360

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AZTECH Wire

Italy . 883 parts In-Stock

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$12.320

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883

$12.320

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Microchip USA

USA . 7,595 parts In-Stock

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$17.173

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$17.173

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IDEA Electronic Components Group

UK . 2,230 parts In-Stock

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$34.161

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$30.745

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$34.161

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$30.745

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MKK Technologies

India . 187 parts In-Stock

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$64.238

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DigiPath Technology Company

USA . 187 parts In-Stock

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$64.238

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QUARKTWIN TECHNOLOGY LTD

USA . 27,331 parts In-Stock

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Corphita

USA . 2,160 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Parana Technologies

USA . 786 parts In-Stock

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$40.845

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786

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$40.845

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Overview

Unlock endless possibilities with the STM32F411CEY3TR microcontroller by STMicroelectronics, a leader in innovation and quality. Designed for versatility, this powerhouse is perfect for applications ranging from IoT devices to automation systems. Enjoy enhanced performance, energy efficiency, and seamless integration in your projects. Trust in ST's legacy of excellence to elevate your designs, ensuring reliability and superior functionality every step of the way!

Feature Benefit Bullets

Surface Mount: YES

Surface mount design allows for compact assembly and efficient use of PCB space, making it ideal for modern electronic devices.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V ensures compatibility with a wide range of power sources, enhancing its versatility in various applications.

Package Shape: RECTANGULAR

The rectangular package shape optimizes layout and space on PCBs, facilitating more efficient designs.

Bit Size: 32

A 32-bit architecture provides enhanced processing power and performance for complex applications.

No. of Terminals: 49

With 49 terminals, this microcontroller supports a rich set of functions and flexibility for multiple I/O needs.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array with a very thin profile and fine pitch allows for high-density mounting, suitable for space-constrained designs.

Minimum Supply Voltage: 1.7 V

A minimum supply voltage of 1.7 V allows for operation in low-power applications, enhancing battery lifespan for portable devices.

ADC Channels: YES

Onboard ADC channels facilitate analog signal processing, making the microcontroller suitable for sensor integration.

DMA Channels: YES

Direct Memory Access (DMA) channels improve data transfer efficiency, freeing up CPU resources for other tasks.

Terminal Position: BOTTOM

Bottom terminal position offers efficient heat dissipation and improved electrical performance on PCBs.

Width: 2.999 mm

Compact width allows for integration into slim applications, contributing to overall product miniaturization.

Maximum Clock Frequency: 26 MHz

A maximum clock frequency of 26 MHz enables efficient processing, supporting high-speed applications.

Peak Reflow Temperature °C: 260

The peak reflow temperature compatible with surface mount technology ensures reliable soldering without damaging the chip.

Length: 3.185 mm

Its short length maximizes PCB space utilization, allowing for more compact electronic designs.

Peripheral IC Type: MICROCONTROLLER, RISC

As a RISC microcontroller, it utilizes a reduced instruction set, leading to efficient processing and performance.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, making it ideal for battery-powered devices.

Terminal Form: BALL

Ball terminal form enhances thermal performance and provides reliable electrical connections in compact arrangements.

Nominal Supply Voltage: 3.3 V

A nominal supply voltage of 3.3 V is widely used, ensuring compatibility with industry standards and components.

PWM Channels: YES

PWMs enable precise control of motors and other devices, making this microcontroller ideal for embedded control applications.

Terminal Pitch: 0.4 mm

The fine terminal pitch of 0.4 mm allows for high-density interconnections, optimizing space on the PCB.

Speed: 100 rpm

A speed specification of 100 rpm indicates capabilities suitable for low-speed motion control and automation applications.

No. of I/O Lines: 36

Providing 36 I/O lines delivers robust input/output capabilities for interfacing with multiple peripherals and devices.

Technical Specifications

Microcontrollers STM32F411CEY3TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

26 MHz

DMA Channels:

YES

External Data Bus Width:

0

Length:

3.185 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

36

No. of Terminals:

49

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Speed:

100 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Width:

2.999 mm

Peripheral IC Type:

Trade Compliance

STM32F411CEY3TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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