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STM32F410TBY7TR

STMicroelectronics

STM32F410TBY7TR by STMicroelectronics

STM32F410TBY7TR microcontroller from STMicroelectronics features a 32-bit architecture, operates at a max voltage of 3.6V, and includes 4 ADC channels. With industrial-grade temp range (-40 °C to 105 °C), it's ideal for automation and IoT applications. Its compact design supports various connectivity options like I2C and SPI.

Median Price

$2.070

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rutronik

Germany . 5,000 parts In-Stock

1+ parts

-

100+ parts

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$2.070

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5,000

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$2.070

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ComSIT Distribution GmbH

Germany . 5,000 parts In-Stock

1+ parts

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5,000

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ComSIT USA

USA . 5,000 parts In-Stock

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5,000

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Vyrian

USA . 3,114 parts In-Stock

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3,114

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Anansix

USA . 2,798 parts In-Stock

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2,798

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Digiode

USA . 1,405 parts In-Stock

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1,405

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 7,500 parts In-Stock

1+ parts

$2.620

100+ parts

-

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7,500

$2.620

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Microchip USA

USA . 7,178 parts In-Stock

1+ parts

$19.462

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7,178

$19.462

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AZTECH Wire

Italy . 74 parts In-Stock

1+ parts

$20.720

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74

$20.720

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IDEA Electronic Components Group

UK . 1,442 parts In-Stock

1+ parts

$72.321

100+ parts

-

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$65.089

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1,442

$72.321

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$65.089

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MKK Technologies

India . 491 parts In-Stock

1+ parts

$135.995

100+ parts

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491

$135.995

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DigiPath Technology Company

USA . 491 parts In-Stock

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$135.995

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491

$135.995

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Perfect Parts

USA . 16,800 parts In-Stock

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16,800

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QUARKTWIN TECHNOLOGY LTD

USA . 11,546 parts In-Stock

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11,546

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Eastek

USA . 10,000 parts In-Stock

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$3.660

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10,000

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$3.660

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Authorized Procurement Solutions

USA . 6,000 parts In-Stock

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6,000

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Parana Technologies

USA . 649 parts In-Stock

1+ parts

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$86.471

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649

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$86.471

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Corphita

USA . 404 parts In-Stock

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404

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Overview

Unlock the potential of your next project with the STM32F410TBY7TR microcontroller from STMicroelectronics, a leader in innovation and quality. Featuring robust performance and versatility, this 32-bit powerhouse excels in industrial applications, automotive systems, and IoT devices. Experience seamless integration with advanced peripherals and superior efficiency that enhance your product's value, ensuring reliability and longevity while streamlining development for a competitive edge.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable and lightweight material ensures longevity and reliability in various applications.

Surface Mount: YES

Surface mount capability allows for compact design and efficient assembly in modern electronic devices.

Maximum Supply Voltage: 3.6 V

Supports a wide range of power supply options, enhancing compatibility with different power sources.

Package Shape: RECTANGULAR

The rectangular shape facilitates easy integration into various circuit layouts.

Bit Size: 32

32-bit architecture allows for improved processing power and efficiency, making it suitable for complex applications.

DAC Channels: YES

Presence of DAC channels allows for high-quality analog output, beneficial for audio and control applications.

No. of Terminals: 36

A higher number of terminals provides flexibility for connecting various peripherals, enabling extensive functionality.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The fine pitch and thin profile contribute to miniaturization, making it ideal for space-constrained designs.

Minimum Supply Voltage: 1.7 V

Lower minimum supply voltage supports battery-efficient designs, prolonging device operation in portable applications.

Maximum Operating Temperature: 105 °C

A high operating temperature range ensures reliable performance in harsh industrial environments.

Minimum Operating Temperature: -40 °C

Ability to operate in extreme cold conditions makes it suitable for outdoor and rugged applications.

ADC Channels: YES

The inclusion of ADC channels allows for digital data acquisition from analog sources, enhancing versatility.

DMA Channels: YES

DMA support improves data transfer efficiency, allowing the CPU to focus on other tasks for better performance.

Terminal Position: BOTTOM

Bottom-terminated design facilitates effective heat dissipation and simplifies PCB layout.

ROM Words: 131072

A substantial ROM capacity enables the storage of sophisticated programs, making it suitable for complex applications.

Maximum Seated Height: 0.585 mm

Low profile height promotes compact designs and is ideal for applications with spatial limitations.

Digital To Analog Converters: 1-Ch 12-Bit

Having a 12-bit DAC improves resolution and accuracy in analog outputs, critical for precision applications.

Width: 2.553 mm

Compact width allows for efficient use of space in densely packed circuit boards.

Peripherals: BOR, CRC, DMA(16), PDR, POR, PVD, PWM(4), RTC, TEMPERATURE SENSOR, TIMER(7), WDT(2)

A rich set of peripherals enhances functionality and allows for diverse applications across various industries.

Maximum Clock Frequency: 26 MHz

A clock frequency of 26 MHz enables fast processing speeds for real-time applications.

Length: 2.579 mm

The compact length supports more versatile designs without compromising on performance.

Temperature Grade: INDUSTRIAL

Industrial temperature grading indicates reliability in adverse conditions, making it suitable for demanding environments.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC microcontroller enhances performance and efficiency for applications requiring rapid processing.

RAM Bytes: 32768

Adequate RAM capacity supports more complex calculations and data processing tasks.

Technology: CMOS

CMOS technology ensures low power consumption while maintaining high-speed operation, essential for battery-driven devices.

Terminal Form: BALL

Ball terminal form ensures reliable and robust connections in surface mount applications.

Analog To Digital Converters: 4-Ch 12-Bit

4-channel 12-bit ADCs improve versatility in data acquisition for various sensing applications.

Nominal Supply Voltage: 3.3 V

Optimized for common supply voltage in modern electronics, facilitating compatibility with other components.

PWM Channels: YES

PWM channel availability enhances control capabilities for motors and other devices requiring precise speed or brightness adjustments.

Connectivity: I2C(2), I2S, IRDA, LIN, SPI, USART(2)

Multi-protocol connectivity options make it versatile for a wide range of communication scenarios.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications to the program without needing to replace components.

Terminal Pitch: 0.4 mm

A finer terminal pitch supports denser layouts, enabling more components on a single PCB.

Speed: 100 rpm

Suitable speed capabilities ensure responsive performance in applications requiring real-time feedback.

On Chip Program ROM Width: 8

An 8-bit program ROM width facilitates efficient data handling suitable for various embedded applications.

No. of I/O Lines: 23

With a sufficient number of I/O lines, the microcontroller can interface with multiple sensors and devices simultaneously, enhancing its utility.

Technical Specifications

Microcontrollers STM32F410TBY7TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

26 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

R-PBGA-B36

Length:

2.579 mm

No. of I/O Lines:

23

No. of Terminals:

36

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

32768

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

.585 mm

Speed:

100 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

2.553 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), I2S, IRDA, LIN, SPI, USART(2)

Peripherals:

BOR, CRC, DMA(16), PDR, POR, PVD, PWM(4), RTC, TEMPERATURE SENSOR, TIMER(7), WDT(2)

Analog To Digital Convertors:

4-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 12-Bit

Trade Compliance

STM32F410TBY7TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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