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STM32F407ZET6TR

STMicroelectronics

STM32F407ZET6TR by STMicroelectronics

STM32F407ZET6TR by STMicroelectronics is a 32-bit microcontroller with Cortex-M4 CPU, 144 terminals, and 26 MHz clock frequency. Ideal for industrial applications, it features DAC and ADC channels, along with low power mode for efficient performance. With ROM programmability and extensive I/O lines, it offers versatile solutions in compact form factor.

Median Price

$8.583

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 27,120 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 17,040 parts In-Stock

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17,040

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IBS Electronics

USA . 5,823 parts In-Stock

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$8.583

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$8.429

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5,823

-

$8.583

$8.429

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Vyrian

USA . 4,250 parts In-Stock

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4,250

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Digiode

USA . 3,684 parts In-Stock

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3,684

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Anansix

USA . 2,719 parts In-Stock

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2,719

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Martec Srl

Italy . 2,376 parts In-Stock

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2,376

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Bristol Electronics

USA . 2,160 parts In-Stock

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Nova Conductors

Japan . 200 parts In-Stock

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200

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,066 parts In-Stock

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$2.000

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1,066

$2.000

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Semicontronic

India . 450 parts In-Stock

1+ parts

$4.000

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$3.900

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$3.880

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450

$4.000

$3.900

$3.880

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AZTECH Wire

Italy . 414 parts In-Stock

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$11.985

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414

$11.985

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IDEA Electronic Components Group

UK . 680 parts In-Stock

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$27.077

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$24.369

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680

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$24.369

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MKK Technologies

India . 1,677 parts In-Stock

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$50.916

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1,677

$50.916

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DigiPath Technology Company

USA . 1,677 parts In-Stock

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$50.916

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1,677

$50.916

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Continental Prestige Electronics

USA . 6,044 parts In-Stock

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Argo Parts USA

USA . 3,528 parts In-Stock

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Corphita

USA . 472 parts In-Stock

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472

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Bastille Electronics

Australia . 300 parts In-Stock

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Parana Technologies

USA . 49 parts In-Stock

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$32.374

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49

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$32.374

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Overview

Unlock the power of innovation with the STM32F407ZET6TR microcontroller by STMicroelectronics. As a leader in the industry, STMicroelectronics guarantees top-notch quality and reliability. This versatile microcontroller is perfect for a wide range of applications, offering customers unparalleled value and benefits. With features such as DAC channels, ADC channels, and PWM channels, this product is ideal for creating cutting-edge solutions in industrial and automotive sectors. Trust STMicroelectronics to provide you with the tools you need to bring your projects to life.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller in various operating environments.

Maximum Supply Voltage: 3.6 V

Allows for a wide range of input voltages, making the microcontroller versatile for different applications.

CPU Family: CORTEX-M4

Utilizes a powerful Cortex-M4 processor for efficient and high-performance computing.

ROM Words: 524288

Large ROM capacity allows for storing a significant amount of program data and code.

RAM Bytes: 200704

Generous RAM size enables efficient data storage and processing for complex tasks.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture ensures streamlined processing and improved performance for embedded systems.

Maximum Clock Frequency: 26 MHz

High clock frequency enables fast data processing and execution of instructions.

Low Power Mode: YES

Incorporating a low power mode helps in saving energy consumption and prolonging battery life.

Technical Specifications

Microcontrollers STM32F407ZET6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

26

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

26 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e4

Length:

20 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

2

No. of External Interrupts:

16

No. of I/O Lines:

114

No. of Terminals:

144

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

RAM Bytes:

200704

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

168 rpm

Maximum Supply Current:

102 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

20 mm

Peripheral IC Type:

Trade Compliance

STM32F407ZET6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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