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STM32F401VEH7

STMicroelectronics

STM32F401VEH7 by STMicroelectronics

STM32F401VEH7 microcontroller by STMicroelectronics features a 32-bit architecture, operates at a max clock frequency of 26 MHz, and supports ADC and PWM channels. With a compact 7x7 mm package, it's ideal for embedded applications requiring efficient processing. Its supply voltage ranges from 1.7V to 3.6V, making it versatile for various projects.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,349 parts In-Stock

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5,349

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Anansix

USA . 1,363 parts In-Stock

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1,363

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Digiode

USA . 146 parts In-Stock

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146

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 556 parts In-Stock

1+ parts

$9.420

100+ parts

-

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556

$9.420

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Microchip USA

USA . 4,628 parts In-Stock

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$18.003

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4,628

$18.003

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IDEA Electronic Components Group

UK . 60 parts In-Stock

1+ parts

$18.180

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$16.362

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60

$18.180

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$16.362

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MKK Technologies

India . 94 parts In-Stock

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$34.187

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94

$34.187

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DigiPath Technology Company

USA . 94 parts In-Stock

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$34.187

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94

$34.187

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Corphita

USA . 4,007 parts In-Stock

1+ parts

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4,007

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Vigor

Singapore . 3,000 parts In-Stock

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3,000

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Parana Technologies

USA . 1,252 parts In-Stock

1+ parts

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$21.737

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1,252

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$21.737

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Overview

Unlock innovation with the STM32F401VEH7 microcontroller from STMicroelectronics, a leader in quality and reliability. This powerful 32-bit MCU offers exceptional performance for a wide range of applications, from IoT devices to consumer electronics. Its compact design ensures easy integration while delivering high efficiency and versatility. Elevate your projects with unmatched support and advanced features that drive success and inspire creativity!

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for easier integration with modern PCB layouts, making it a good choice for compact and efficient applications.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6V makes this microcontroller suitable for low-power applications and helps in reducing energy consumption.

Package Shape: SQUARE

The square package shape facilitates easier placement on PCBs and better thermal management, resulting in improved performance.

Bit Size: 32

The 32-bit architecture allows for handling complex computations and larger memory addressing, making it ideal for sophisticated applications.

No. of Terminals: 100

With 100 terminals, this microcontroller offers extensive connectivity options, accommodating various peripherals and interfaces.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The fine pitch and thin profile of the grid array package enables high-density designs, making this product suitable for space-constrained applications.

Minimum Supply Voltage: 1.7 V

A low minimum supply voltage of 1.7V allows the microcontroller to operate efficiently in battery-powered devices, extending battery life.

ADC Channels: YES

Inclusion of ADC channels enhances the microcontroller's capability to interface with analog sensors, thus expanding its application range.

DMA Channels: YES

Presence of DMA channels allows for efficient data transfer without CPU interference, improving overall system performance.

Terminal Position: BOTTOM

With terminals positioned at the bottom, installation on PCBs is optimized, enabling better space utilization.

Width: 7 mm

The compact width of 7 mm is advantageous for applications where space is a limitation, helping designers create smaller electronic assemblies.

Maximum Clock Frequency: 26 MHz

A maximum clock frequency of 26 MHz ensures responsive performance, catering well to applications that require fast processing speeds.

Length: 7 mm

Similar to its width, a length of 7 mm allows for a compact design, further contributing to space efficiency in electronic products.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture enhances processing efficiency and speed, making it suitable for real-time applications that require quick response.

Terminal Form: BALL

The ball terminal form provides reliable electrical connections and simplifies the soldering process during assembly.

Nominal Supply Voltage: 3 V

Operating at a nominal supply voltage of 3V optimizes power efficiency, making this microcontroller ideal for energy-sensitive applications.

PWM Channels: YES

The inclusion of PWM channels facilitates motor control and precise signal generation, broadening the range of control applications.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm supports high-density layouts, allowing for more functionality in smaller spaces.

Speed: 84 rpm

The capability of 84 rpm provides adequate speed for specific control applications, aligning with performance expectations in dynamic systems.

No. of I/O Lines: 81

With 81 I/O lines, this microcontroller allows for versatile interfacing with multiple devices, enhancing its suitability for complex systems.

Technical Specifications

Microcontrollers STM32F401VEH7 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

26 MHz

DMA Channels:

YES

External Data Bus Width:

0

Length:

7 mm

No. of I/O Lines:

81

No. of Terminals:

100

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Speed:

84 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Trade Compliance

STM32F401VEH7 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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