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STM32F378VCT6

STMicroelectronics

STM32F378VCT6 by STMicroelectronics

STM32F378VCT6 microcontroller by STMicroelectronics features a 32-bit architecture, operates at 1.8V nominal supply, and supports up to 83 I/O lines. With a max clock frequency of 32 MHz and integrated ADC/DMA channels, it's ideal for embedded applications. Its compact flatpack design ensures efficient space utilization in various devices.

Median Price

$5.591

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 1,080 parts In-Stock

1+ parts

$5.108

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$5.108

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Chip1Stop

Japan . 1,080 parts In-Stock

1+ parts

$6.074

100+ parts

-

1k+ parts

$5.927

10k+ parts

$5.674

1,080

$6.074

-

$5.927

$5.674

Verical

USA . 1,080 parts In-Stock

1+ parts

-

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1,080

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Digiode

USA . 738 parts In-Stock

1+ parts

$5.129

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738

$5.129

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Vyrian

USA . 5,775 parts In-Stock

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5,775

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Anansix

USA . 2,188 parts In-Stock

1+ parts

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2,188

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Pegasus Components GmbH

Germany . 540 parts In-Stock

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540

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Distributors (Availability)

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Corphita

USA . 2,208 parts In-Stock

1+ parts

$4.859

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2,208

$4.859

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Vigor

Singapore . 1,728 parts In-Stock

1+ parts

$5.465

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1,728

$5.465

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IDEA Electronic Components Group

UK . 516 parts In-Stock

1+ parts

$15.642

100+ parts

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$14.078

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516

$15.642

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$14.078

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Microchip USA

USA . 5,005 parts In-Stock

1+ parts

$19.169

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$19.169

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AZTECH Wire

Italy . 953 parts In-Stock

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$21.770

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953

$21.770

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MKK Technologies

India . 527 parts In-Stock

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$29.413

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527

$29.413

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DigiPath Technology Company

USA . 527 parts In-Stock

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$29.413

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527

$29.413

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Component Stockers USA

USA . 1,241 parts In-Stock

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$81.000

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Perfect Parts

USA . 806 parts In-Stock

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Parana Technologies

USA . 24 parts In-Stock

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$18.702

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24

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$18.702

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Overview

Elevate your projects with the STM32F378VCT6 microcontroller from STMicroelectronics, a leader in cutting-edge technology. Designed for exceptional performance and efficiency, this 32-bit powerhouse excels in demanding applications like industrial automation, IoT devices, and consumer electronics. With its robust features, including multiple ADC and PWM channels, it ensures seamless integration and reliability. Trust in STMicroelectronics for unmatched quality and innovation that drives your success!

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for efficient use of PCB space and simplifies integration into compact electronic systems.

Maximum Supply Voltage: 1.95 V

A high maximum supply voltage supports a wider range of operational options, allowing the microcontroller to interface with various other components.

Package Shape: SQUARE

The square package shape promotes optimal thermal performance and aids in symmetrical layout during manufacturing.

Bit Size: 32

With a 32-bit architecture, this microcontroller can handle more data simultaneously, enhancing performance for complex applications.

No. of Terminals: 100

A higher number of terminals allow more peripherals and I/O operations, making it suitable for advanced applications.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style provides a low profile that fits well in space-constrained designs and facilitates high-density mounting.

Minimum Supply Voltage: 1.65 V

A low minimum supply voltage minimizes power consumption, making it ideal for battery-operated devices.

ADC Channels: YES

Integrated ADC channels allow for direct interaction with analog sensors, enhancing the versatility of applications.

DMA Channels: YES

DMA channels enable efficient data transfers between peripherals without CPU intervention, improving overall processing efficiency.

Terminal Position: QUAD

The quad terminal position facilitates easier soldering and enhances the electrical performance of the connections.

Width: 14 mm

A compact width ensures compatibility with various PCB designs and aids in thermal management.

Maximum Clock Frequency: 32 MHz

Support for a maximum clock frequency of 32 MHz ensures fast processing speeds for time-sensitive applications.

Length: 14 mm

Having the same length as width contributes to a balanced and efficient design footprint on the PCB.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture optimizes performance while minimizing power consumption, ideal for embedded applications.

Terminal Form: GULL WING

Gull wing terminals provide reliable mechanical and electrical connections suited for automatic assembly processes.

Nominal Supply Voltage: 1.8 V

A nominal supply voltage of 1.8 V reflects low power operation, ideal for energy-sensitive applications.

PWM Channels: YES

Offers PWM channels to facilitate motor control and other applications that require precise signal modulation.

Terminal Pitch: 0.5 mm

A fine terminal pitch enables higher density connections on the PCB, making it possible to include more functionality in a smaller area.

Speed: 72 rpm

Defined speed capabilities allow for effective control in applications requiring precise timing and performance.

No. of I/O Lines: 83

A large number of I/O lines enhances the flexibility of interfacing with input/output devices, expanding the scope of project possibilities.

Technical Specifications

Microcontrollers STM32F378VCT6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

32 MHz

DMA Channels:

YES

External Data Bus Width:

0

Length:

14 mm

No. of I/O Lines:

83

No. of Terminals:

100

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Speed:

72 rpm

Maximum Supply Voltage:

1.95 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

STM32F378VCT6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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