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STM32F372VCT6

STMicroelectronics

STM32F372VCT6 by STMicroelectronics

STM32F372VCT6 by STMicroelectronics is a 32-bit microcontroller with 262144 ROM words and 32768 RAM bytes. Operating at speeds up to 72 rpm, it is ideal for industrial applications requiring a CPU family of CORTEX-M4F and power supplies of 2.5/3.3 V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,939 parts In-Stock

1+ parts

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8,939

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Anansix

USA . 2,361 parts In-Stock

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2,361

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Digiode

USA . 1,142 parts In-Stock

1+ parts

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1,142

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R&J Components

USA . 270 parts In-Stock

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270

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Flip Electronics

USA . 160 parts In-Stock

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160

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 8,069 parts In-Stock

1+ parts

$7.480

100+ parts

-

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8,069

$7.480

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AZTECH Wire

Italy . 1,004 parts In-Stock

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$14.830

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1,004

$14.830

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IDEA Electronic Components Group

UK . 2,260 parts In-Stock

1+ parts

$17.123

100+ parts

-

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$15.411

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-

2,260

$17.123

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$15.411

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MKK Technologies

India . 1,766 parts In-Stock

1+ parts

$32.199

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1,766

$32.199

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DigiPath Technology Company

USA . 1,766 parts In-Stock

1+ parts

$32.199

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1,766

$32.199

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Microchip USA

USA . 241 parts In-Stock

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$37.122

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241

$37.122

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Component Stockers USA

USA . 238 parts In-Stock

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$99.990

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238

$99.990

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Corphita

USA . 1,805 parts In-Stock

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1,805

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Parana Technologies

USA . 626 parts In-Stock

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$20.473

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626

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$20.473

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Perfect Parts

USA . 605 parts In-Stock

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605

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Authorized Procurement Solutions

USA . 200 parts In-Stock

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200

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GreenTree Electronics

Israel . 150 parts In-Stock

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150

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Overview

Unlock the power of innovation with the STM32F372VCT6 microcontroller by STMicroelectronics. Known for its superior quality and reliability, STMicroelectronics delivers cutting-edge technology that meets the demands of various applications. From industrial automation to consumer electronics, this versatile microcontroller offers unparalleled performance and efficiency. With a 32-bit architecture and advanced features, customers can expect seamless integration and optimized functionality. Elevate your projects with the STM32F372VCT6 and experience the value and benefits it brings to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/Epoxy material provides good durability and protection for the microcontroller, making it suitable for a variety of environments.

Surface Mount: YES

Surface mount packaging allows for easy installation and space-saving on PCBs, making the product more convenient to use in compact designs.

Bit Size: 32

32-bit architecture allows for higher computational power and faster processing speed, enabling efficient performance in various applications.

Power Supplies (V): 2.5/3.3

Support for multiple power supply voltages gives flexibility in system design and compatibility with different power sources.

No. of Terminals: 100

Having 100 terminals provides ample connectivity options for interfacing with external components, expanding the functionality of the microcontroller.

Package Style (Meter): FLATPACK

Flatpack packaging offers a low profile and space-efficient form factor, making it suitable for applications where size constraints are a concern.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, the microcontroller can withstand elevated temperatures without compromising performance, ideal for industrial applications.

CPU Family: CORTEX-M4F

The Cortex-M4F CPU family provides advanced processing capabilities, enabling efficient execution of complex tasks and algorithms in real-time applications.

Minimum Operating Temperature: -40 °C

The microcontroller's ability to operate at temperatures as low as -40 °C ensures reliable performance in harsh environmental conditions or cold storage applications.

Terminal Position: QUAD

Quad terminal positioning allows for efficient routing of signals and connections, simplifying PCB layout and enhancing overall system reliability.

ROM Words: 262144

With a large ROM capacity of 262144 words, the microcontroller can store a significant amount of program code and data, supporting complex software applications.

Temperature Grade: INDUSTRIAL

Industrial temperature-grade certification ensures reliable operation in harsh industrial environments, making the microcontroller suitable for rugged applications.

RAM Bytes: 32768

The generous RAM size of 32768 bytes allows for efficient data storage and manipulation, facilitating multitasking and data processing capabilities of the microcontroller.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the energy efficiency and reliability of the microcontroller in various operating conditions.

Terminal Form: GULL WING

Gull wing terminal form provides secure solder connections and mechanical strength, ensuring reliable electrical contacts and long-term performance of the microcontroller.

Maximum Supply Current: 75.7 mA

A maximum supply current of 75.7 mA indicates low power consumption, making the microcontroller energy-efficient and suitable for battery-operated devices.

ROM Programmability: FLASH

Flash programmability allows for convenient and fast reprogramming of the microcontroller's memory, enabling flexibility in software updates and customization.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm provides precise and compact terminal spacing, facilitating high-density PCB designs and efficient signal routing.

Speed: 72 rpm

A operating speed of 72 rpm ensures fast data processing and response times, making the microcontroller suitable for real-time control and high-speed applications.

Technical Specifications

Microcontrollers STM32F372VCT6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

Bit Size:

32

CPU Family:

CORTEX-M4F

JESD-30 Code:

S-PQFP-G100

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

262144

ROM Programmability:

FLASH

Speed:

72 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

75.7 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

STM32F372VCT6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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