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STM32F372VCH6

STMicroelectronics

STM32F372VCH6 by STMicroelectronics

STM32F372VCH6 by STMicroelectronics is a 32-bit microcontroller with 262144 ROM words and 32768 RAM bytes. Operating at speeds up to 72 rpm, it is ideal for industrial applications requiring a temperature range of -40 to 85 °C. The package style is grid array, fine pitch with a square shape and plastic/epoxy material.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 11,392 parts In-Stock

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11,392

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Digiode

USA . 2,217 parts In-Stock

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2,217

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Anansix

USA . 623 parts In-Stock

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623

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Flip Electronics

USA . 450 parts In-Stock

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450

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Distributors (Availability)

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Vigor

Singapore . 6,952 parts In-Stock

1+ parts

$7.480

100+ parts

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6,952

$7.480

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AZTECH Wire

Italy . 59 parts In-Stock

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$9.650

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59

$9.650

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Microchip USA

USA . 222 parts In-Stock

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$24.179

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222

$24.179

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Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$33.722

100+ parts

$30.687

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$27.652

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500

$33.722

$30.687

$27.652

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IDEA Electronic Components Group

UK . 524 parts In-Stock

1+ parts

$44.557

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$40.102

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524

$44.557

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$40.102

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MKK Technologies

India . 492 parts In-Stock

1+ parts

$83.787

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492

$83.787

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DigiPath Technology Company

USA . 492 parts In-Stock

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$83.787

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492

$83.787

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Corphita

USA . 1,400 parts In-Stock

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Perfect Parts

USA . 928 parts In-Stock

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928

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Parana Technologies

USA . 896 parts In-Stock

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$53.275

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896

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$53.275

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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GreenTree Electronics

Israel . 416 parts In-Stock

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416

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Overview

Discover the power of the STM32F372VCH6 microcontroller by STMicroelectronics, a top-quality device designed for a wide range of applications. With its advanced technology and industrial-grade temperature tolerance, this Cortex-M4F CPU family member offers unparalleled performance and reliability. Whether you're working on IoT projects, robotics, or automation systems, this microcontroller provides the perfect balance of speed, efficiency, and versatility. Trust STMicroelectronics to deliver cutting-edge solutions that drive innovation and success in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the microcontroller, ensuring long-term reliability.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, making the product suitable for mass production.

Bit Size: 32

A 32-bit architecture enables the microcontroller to handle complex tasks and calculations with speed and efficiency.

Power Supplies (V): 2.5/3.3

Support for multiple power supplies allows for flexibility in design and compatibility with various voltage requirements.

No. of Terminals: 100

Having a high number of terminals provides ample connectivity options for interfacing with external components and peripherals.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array and fine pitch package style offer high-density mounting capabilities, saving space on the PCB and allowing for more compact designs.

Maximum Operating Temperature: 85 °C

The ability to operate at high temperatures makes this microcontroller suitable for industrial applications where heat resistance is crucial.

CPU Family: CORTEX-M4F

The Cortex-M4F CPU family provides high performance and energy efficiency, making it well-suited for a wide range of applications.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature, this microcontroller can withstand harsh environmental conditions and operate reliably in cold temperatures.

ROM Words: 262144

A large ROM capacity enables the storage of a significant amount of program code and data, allowing for complex software applications to be run on the microcontroller.

Temperature Grade: INDUSTRIAL

Designed for industrial environments, this microcontroller is able to operate reliably in challenging conditions, making it a suitable choice for industrial automation and control systems.

RAM Bytes: 32768

A generous amount of RAM enables the microcontroller to efficiently store and retrieve data during program execution, enhancing performance and multitasking capabilities.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable in noisy environments.

Terminal Form: BALL

Ball terminal form provides secure and reliable connections, ensuring stable electrical contact with the PCB and external components.

Maximum Supply Current: 75.7 mA

The maximum supply current rating indicates the power efficiency of the microcontroller, helping to optimize energy consumption in the overall system design.

ROM Programmability: FLASH

Flash programmability allows for easy and quick updates to the program code in the microcontroller, facilitating firmware upgrades and customization.

Terminal Pitch: 0.5 mm

A small terminal pitch enables high-density mounting and close spacing of terminals on the package, contributing to a compact and space-efficient PCB layout.

Speed: 72 rpm

With a processing speed of 72 rpm, this microcontroller can handle computationally intensive tasks with efficiency, making it suitable for real-time applications and high-performance computing.

Technical Specifications

Microcontrollers STM32F372VCH6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

Bit Size:

32

CPU Family:

CORTEX-M4F

JESD-30 Code:

S-PBGA-B100

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA100,12X12,20

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

262144

ROM Programmability:

FLASH

Speed:

72 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

75.7 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Trade Compliance

STM32F372VCH6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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