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STM32F372R8T6

STMicroelectronics

STM32F372R8T6 by STMicroelectronics

STM32F372R8T6 by STMicroelectronics is a 32-bit microcontroller with Cortex-M4F CPU, 64 terminals, and 16384 bytes of RAM. Operating at -40 to 85 °C, it features a max supply current of 75.7mA. Ideal for industrial applications requiring high-speed processing in a compact square package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,688 parts In-Stock

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4,688

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Anansix

USA . 1,693 parts In-Stock

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1,693

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Digiode

USA . 829 parts In-Stock

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829

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Distributors (Availability)

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Vigor

Singapore . 5,000 parts In-Stock

1+ parts

$5.990

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5,000

$5.990

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Microchip USA

USA . 153 parts In-Stock

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$13.410

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153

$13.410

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AZTECH Wire

Italy . 654 parts In-Stock

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$17.090

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654

$17.090

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IDEA Electronic Components Group

UK . 78 parts In-Stock

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$61.396

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$55.257

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78

$61.396

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$55.257

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MKK Technologies

India . 2,181 parts In-Stock

1+ parts

$115.452

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2,181

$115.452

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DigiPath Technology Company

USA . 2,181 parts In-Stock

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$115.452

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2,181

$115.452

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Corphita

USA . 1,309 parts In-Stock

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1,309

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Parana Technologies

USA . 1,029 parts In-Stock

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$73.408

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1,029

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$73.408

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Perfect Parts

USA . 644 parts In-Stock

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644

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Overview

Unleash the power of innovation with the STM32F372R8T6 by STMicroelectronics. This cutting-edge microcontroller offers unmatched quality and reliability, backed by the trusted name of its manufacturer. Ideal for a wide range of applications, this product provides customers with unrivaled value, benefits, and advantages. Upgrade your projects with the STM32F372R8T6 and experience the difference in performance and efficiency today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/Epoxy material provides good protection for the microcontroller, making it durable and long-lasting.

Surface Mount: YES

Surface mountability allows for easy integration onto circuit boards, saving space and reducing assembly time.

Bit Size: 32

32-bit architecture enables the microcontroller to handle complex calculations and processes efficiently.

Power Supplies (V): 2.5/3.3

Support for multiple power supply voltages provides flexibility in design and compatibility with different systems.

No. of Terminals: 64

Having 64 terminals allows for a wide range of input and output connections, enhancing the microcontroller's versatility.

Package Style (Meter): FLATPACK

Flatpack package style makes the microcontroller easy to handle and install.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance even in challenging environments.

CPU Family: CORTEX-M4F

Cortex-M4F CPU family offers high performance and efficiency for demanding applications.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows the microcontroller to function in extreme cold conditions.

Terminal Position: QUAD

Quad terminal position enables efficient routing and connectivity with other components.

ROM Words: 65536

Large ROM capacity allows for storing complex program codes and data.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliability and stability in harsh industrial environments.

RAM Bytes: 16384

Sufficient RAM capacity for running multiple tasks simultaneously and storing temporary data.

Technology: CMOS

CMOS technology offers low power consumption and high-speed performance.

Terminal Form: GULL WING

Gull wing terminal form provides secure and reliable connections.

Maximum Supply Current: 75.7 mA

Low maximum supply current requirement helps in reducing power consumption.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and quick updates of the microcontroller's firmware.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm enables compact design and efficient use of PCB space.

Speed: 72 rpm

High speed of 72 rpm ensures rapid processing and response times for connected devices.

Technical Specifications

Microcontrollers STM32F372R8T6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

Bit Size:

32

CPU Family:

CORTEX-M4F

JESD-30 Code:

S-PQFP-G64

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

65536

ROM Programmability:

FLASH

Speed:

72 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

75.7 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

STM32F372R8T6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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