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STM32F372CBT6

STMicroelectronics

STM32F372CBT6 by STMicroelectronics

STM32F372CBT6 by STMicroelectronics is a 32-bit microcontroller with 131072 ROM words and 24576 RAM bytes. Operating at -40 to 85 °C, it has a CPU family of CORTEX-M4F and max supply current of 75.7 mA. Ideal for industrial applications requiring high-speed processing in a compact package.

Median Price

$1.080

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 180 parts In-Stock

1+ parts

$1.080

100+ parts

$1.080

1k+ parts

$1.080

10k+ parts

-

180

$1.080

$1.080

$1.080

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 1,000 parts In-Stock

1+ parts

$2.239

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

$2.239

-

-

-

Vyrian

USA . 10,799 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,799

-

-

-

-

Anansix

USA . 1,830 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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1,830

-

-

-

-

Digiode

USA . 1,631 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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1,631

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-

-

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R&J Components

USA . 1,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,500

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 433 parts In-Stock

1+ parts

$1.000

100+ parts

-

1k+ parts

-

10k+ parts

-

433

$1.000

-

-

-

Argo Parts USA

USA . 4,683 parts In-Stock

1+ parts

$2.239

100+ parts

-

1k+ parts

-

10k+ parts

-

4,683

$2.239

-

-

-

Continental Prestige Electronics

USA . 2,652 parts In-Stock

1+ parts

$2.239

100+ parts

-

1k+ parts

-

10k+ parts

$2.194

2,652

$2.239

-

-

$2.194

Vigor

Singapore . 6,018 parts In-Stock

1+ parts

$6.020

100+ parts

-

1k+ parts

-

10k+ parts

-

6,018

$6.020

-

-

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AZTECH Wire

Italy . 231 parts In-Stock

1+ parts

$6.433

100+ parts

-

1k+ parts

-

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231

$6.433

-

-

-

Microchip USA

USA . 371 parts In-Stock

1+ parts

$25.351

100+ parts

-

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-

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371

$25.351

-

-

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IDEA Electronic Components Group

UK . 2,171 parts In-Stock

1+ parts

$30.964

100+ parts

-

1k+ parts

$27.867

10k+ parts

-

2,171

$30.964

-

$27.867

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MKK Technologies

India . 350 parts In-Stock

1+ parts

$58.225

100+ parts

-

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350

$58.225

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-

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DigiPath Technology Company

USA . 350 parts In-Stock

1+ parts

$58.225

100+ parts

-

1k+ parts

-

10k+ parts

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350

$58.225

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-

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Aztec Data Supply Inc.

USA . 65 parts In-Stock

1+ parts

$68.137

100+ parts

-

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-

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65

$68.137

-

-

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Corohmni

South Africa . 226 parts In-Stock

1+ parts

$80.406

100+ parts

-

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226

$80.406

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-

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QUARKTWIN TECHNOLOGY LTD

USA . 9,832 parts In-Stock

1+ parts

-

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9,832

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-

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Lixinc

USA . 2,477 parts In-Stock

1+ parts

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2,477

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-

-

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

$2.194

1k+ parts

$2.127

10k+ parts

$2.082

2,000

-

$2.194

$2.127

$2.082

Perfect Parts

USA . 1,650 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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1,650

-

-

-

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Corphita

USA . 1,263 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,263

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-

-

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Parana Technologies

USA . 754 parts In-Stock

1+ parts

-

100+ parts

$37.022

1k+ parts

-

10k+ parts

-

754

-

$37.022

-

-

Overview

Unlock endless possibilities with the STM32F372CBT6 microcontroller from STMicroelectronics. Known for their superior quality and reliability, STMicroelectronics offers cutting-edge technology that exceeds industry standards. This versatile microcontroller is perfect for a wide range of applications, providing customers with unmatched value and performance. Whether you're designing smart devices, industrial automation systems, or IoT solutions, the STM32F372CBT6 delivers on all fronts. Experience seamless integration, enhanced functionality, and unparalleled efficiency with this innovative product.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

With surface mount capability, the microcontroller can be easily integrated onto PCBs, saving space and reducing assembly time.

Package Shape: SQUARE

The square package shape provides a more efficient use of space on the PCB, allowing for more components to be placed closer together.

Bit Size: 32

The 32-bit size allows for faster processing speeds and the ability to handle complex computations, making it suitable for high-performance applications.

Power Supplies (V): 2.5/3.3

Compatible with common power supplies, providing flexibility and ease of integration into existing systems.

No. of Terminals: 48

The ample number of terminals allows for versatile connectivity options, enabling the microcontroller to interface with various external devices.

Package Style (Meter): FLATPACK

The flatpack package style offers a low profile and efficient thermal dissipation, making it suitable for space-constrained designs.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures the microcontroller can withstand harsh environmental conditions, increasing its reliability.

CPU Family: CORTEX-M4F

The Cortex-M4F CPU family offers advanced processing capabilities and power efficiency, making it suitable for a wide range of applications.

Minimum Operating Temperature: -40 °C

The wide operating temperature range allows the microcontroller to be used in extreme cold environments without compromising performance.

Terminal Position: QUAD

The quad terminal position provides a secure and reliable connection, ensuring stable communication between the microcontroller and external components.

ROM Words: 131072

The large ROM capacity allows for storing extensive program data and firmware, accommodating complex applications with ease.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, the microcontroller meets stringent temperature and reliability requirements, ensuring long-term operation in challenging environments.

RAM Bytes: 24576

The ample RAM capacity enables efficient data storage and processing, supporting multitasking and advanced algorithms.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable.

Terminal Form: GULL WING

The gull wing terminal form simplifies the soldering process and enhances mechanical strength, ensuring a secure connection and easy assembly.

Maximum Supply Current: 75.7 mA

With a maximum supply current of 75.7 mA, the microcontroller operates efficiently without drawing excessive power, prolonging battery life in battery-powered applications.

ROM Programmability: FLASH

The programmable FLASH ROM allows for easy firmware updates and customization, enabling the microcontroller to adapt to evolving requirements.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5 mm facilitates high-density PCB designs and miniaturization, making the microcontroller suitable for compact devices.

Speed: 72 rpm

The high processing speed of 72 rpm enables rapid data processing and real-time responsiveness, making the microcontroller ideal for time-critical applications.

Technical Specifications

Microcontrollers STM32F372CBT6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

Bit Size:

32

CPU Family:

CORTEX-M4F

JESD-30 Code:

S-PQFP-G48

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

24576

ROM Words:

131072

ROM Programmability:

FLASH

Speed:

72 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

75.7 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

STM32F372CBT6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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