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STM32F303VEH7TR

STMicroelectronics

STM32F303VEH7TR by STMicroelectronics

STM32F303VEH7TR microcontroller from STMicroelectronics features a 32-bit Cortex-M4F CPU, operates at up to 3.6V, and supports industrial temperatures (-40 °C to 105 °C). With 86 I/O lines and integrated ADC/DMA channels, it's ideal for embedded applications. Its compact design ensures efficient performance in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,818 parts In-Stock

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4,818

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Digiode

USA . 2,324 parts In-Stock

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2,324

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Anansix

USA . 1,316 parts In-Stock

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1,316

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Distributors (Availability)

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Vigor

Singapore . 1,658 parts In-Stock

1+ parts

$6.670

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-

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1,658

$6.670

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AZTECH Wire

Italy . 662 parts In-Stock

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$15.350

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662

$15.350

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Microchip USA

USA . 4,735 parts In-Stock

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$21.857

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4,735

$21.857

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IDEA Electronic Components Group

UK . 1,864 parts In-Stock

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$57.668

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$51.902

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1,864

$57.668

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$51.902

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Component Stockers USA

USA . 282 parts In-Stock

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$97.650

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282

$97.650

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MKK Technologies

India . 1,003 parts In-Stock

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$108.442

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$108.442

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DigiPath Technology Company

USA . 1,003 parts In-Stock

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$108.442

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1,003

$108.442

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Parana Technologies

USA . 892 parts In-Stock

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$68.951

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$68.951

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Corphita

USA . 336 parts In-Stock

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Overview

Unlock the potential of your projects with the STM32F303VEH7TR microcontroller from STMicroelectronics, a leader in innovation and quality. Designed for versatility, this robust chip excels in industrial applications, offering unparalleled performance in demanding environments. Benefit from its efficient power management, enhanced processing capabilities, and rich peripheral integration, ensuring seamless connectivity and responsiveness. Elevate your designs with reliability and cutting-edge technology!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material offers durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and easier integration into modern electronics.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V ensures compatibility with many low-power systems and enhances battery life.

Address Bus Width: 24

A 24-bit address bus width facilitates addressing a larger memory space, allowing the microcontroller to handle more extensive applications.

Package Shape: SQUARE

The square package shape optimizes space usage on PCBs, making it an ideal choice for compact designs.

Bit Size: 32

A 32-bit architecture allows for more extensive data handling and processing capabilities, providing better performance overall.

Power Supplies (V): 2.5/3.3

This dual supply voltage range enhances flexibility in design, allowing for adaptation in various applications.

No. of Terminals: 100

With 100 terminals, this microcontroller supports a wide range of peripherals and enhances connectivity options.

Package Style (Meter): GRID ARRAY, FINE PITCH

The fine pitch grid array design reduces space and allows for more compact PCB layouts, benefiting high-density applications.

Minimum Supply Voltage: 2 V

The low minimum supply voltage extends the battery life and allows operation in low-power environments.

Maximum Operating Temperature: 105 °C

A maximum operating temperature of 105 °C enables operation in harsh environments, making it suitable for industrial applications.

CPU Family: CORTEX-M4F

The Cortex-M4F CPU family provides excellent performance with DSP capabilities, ideal for complex computations.

Minimum Operating Temperature: -40 °C

Operating in extreme temperatures from -40 °C increases reliability for industrial and outdoor applications.

ADC Channels: YES

Having ADC channels allows for the conversion of analog signals to digital, essential for many sensor applications.

DMA Channels: YES

DMA channels help in efficient data transfers, reducing CPU load and improving overall system performance.

Terminal Position: BOTTOM

Bottom terminal positioning facilitates better thermal management and compact designs on PCBs.

ROM Words: 524288

A substantial ROM capacity allows for complex software applications and enhances the storage of program data.

Width: 7 mm

A compact width of 7 mm allows for space-saving designs, fitting into smaller devices and products.

External Data Bus Width: 32

A 32-bit external data bus width supports high-speed data transfer, improving performance in data-intensive applications.

Maximum Clock Frequency: 32 MHz

A maximum clock frequency of 32 MHz enables faster processing capabilities, benefiting real-time applications.

Length: 7 mm

With a compact length of 7 mm, the micrcontroller maintains a small form factor suitable for portable devices.

Temperature Grade: INDUSTRIAL

Rated for industrial temperatures, this microcontroller is poised for reliable performance in challenging environments.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture enhances processing efficiency and performance while lowering power consumption.

RAM Bytes: 65536

Having 64 KB of RAM allows for efficient task handling and supports complex applications.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, making the microcontroller reliable for various applications.

Terminal Form: BALL

Ball grid array terminal form provides better interconnections and improved thermal performance.

Maximum Supply Current: 77.4 mA

A maximum supply current of 77.4 mA allows for substantial performance in demanding applications.

Nominal Supply Voltage: 3.3 V

The nominal 3.3 V supply voltage is standard in many systems, simplifying integration.

PWM Channels: YES

PWM channels are essential for motor control and other applications requiring precise power management.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications of software, enhancing flexibility.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch enables efficient use of PCB space, making it suitable for high-density designs.

Speed: 72 rpm

The operational speed of 72 rpm is ideal for applications requiring consistent performance and reliability.

No. of I/O Lines: 86

With 86 I/O lines, flexibility for connecting various peripherals and sensors is significantly increased, making it versatile for different applications.

Technical Specifications

Microcontrollers STM32F303VEH7TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

32

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

32 MHz

DMA Channels:

YES

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B100

Length:

7 mm

No. of I/O Lines:

86

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA100,12X12,20

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

524288

ROM Programmability:

FLASH

Speed:

72 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

77.4 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Trade Compliance

STM32F303VEH7TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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