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STM32F303VEH6TR

STMicroelectronics

STM32F303VEH6TR by STMicroelectronics

STM32F303VEH6TR by STMicroelectronics is a 32-bit microcontroller with Cortex-M4F CPU, 524288 ROM words, and 65536 RAM bytes. It operates at a max clock frequency of 32 MHz and has 86 I/O lines for industrial applications requiring high-speed processing and control capabilities.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,970 parts In-Stock

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4,970

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Vyrian

USA . 3,052 parts In-Stock

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3,052

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Anansix

USA . 2,839 parts In-Stock

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2,839

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Nova Conductors

Japan . 15 parts In-Stock

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Vigor

Singapore . 2,038 parts In-Stock

1+ parts

$6.230

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2,038

$6.230

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Ampacity Inc.

Singapore . 886 parts In-Stock

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$9.000

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886

$9.000

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AZTECH Wire

Italy . 448 parts In-Stock

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$13.111

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448

$13.111

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Microchip USA

USA . 5,689 parts In-Stock

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$20.428

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5,689

$20.428

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Corohmni

South Africa . 63 parts In-Stock

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$33.703

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63

$33.703

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IDEA Electronic Components Group

UK . 681 parts In-Stock

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$36.078

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$32.470

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681

$36.078

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$32.470

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Aztec Data Supply Inc.

USA . 4,857 parts In-Stock

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$59.410

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$59.410

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MKK Technologies

India . 937 parts In-Stock

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$67.842

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937

$67.842

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DigiPath Technology Company

USA . 937 parts In-Stock

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$67.842

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Continental Prestige Electronics

USA . 6,879 parts In-Stock

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Argo Parts USA

USA . 2,201 parts In-Stock

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Parana Technologies

USA . 2,071 parts In-Stock

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$43.136

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Aranea Global

USA . 2,000 parts In-Stock

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Corphita

USA . 173 parts In-Stock

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Overview

Unleash the power of innovation with the STM32F303VEH6TR microcontroller by STMicroelectronics. Designed with precision and expertise, this cutting-edge device offers unparalleled performance and reliability for a wide range of applications. From industrial automation to consumer electronics, this versatile microcontroller provides seamless integration and enhanced functionality. Experience the value and benefits of superior quality with the STM32F303VEH6TR, where innovation meets excellence. Trust STMicroelectronics to deliver top-of-the-line solutions for all your technological needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, making it suitable for various environments.

Surface Mount: YES

Allows for easy installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 3.6 V

Supports a wide range of applications that require higher voltage levels.

Address Bus Width: 24

Allows for efficient memory addressing and data transfer within the microcontroller.

Bit Size: 32

Offers enhanced processing capabilities and performance for complex tasks.

Power Supplies (V): 2.5/3.3

Compatibility with multiple power supply voltages for flexibility in system design.

No. of Terminals: 100

Sufficient connectivity options for interfacing with external devices and components.

Minimum Supply Voltage: 2 V

Works with lower supply voltages to conserve power and reduce heat generation.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, suitable for industrial applications.

CPU Family: CORTEX-M4F

Utilizes a powerful and efficient processor architecture for optimal performance.

Minimum Operating Temperature: -40 °C

Operates reliably in cold environments without any issues.

ADC Channels: YES

Enables analog-to-digital conversion for sensor interfacing and data acquisition.

DMA Channels: YES

Facilitates efficient data transfer between peripherals and memory without CPU intervention.

ROM Words: 524288

Offers ample storage capacity for program storage and data handling.

Width: 7 mm

Compact size for space-constrained applications and PCB designs.

External Data Bus Width: 32

Provides high-speed data transfer capabilities for improved system performance.

Length: 7 mm

Square package shape with equal dimensions for uniform mounting and layout design.

Temperature Grade: INDUSTRIAL

Designed to meet industrial temperature requirements for robust and reliable operation.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes RISC architecture for efficient instruction execution and reduced power consumption.

RAM Bytes: 65536

Sufficient random-access memory for data storage and manipulation during operation.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity.

Terminal Form: BALL

Ball terminal form for reliable and secure connections on the PCB.

Maximum Supply Current: 76.9 mA

Low supply current consumption for energy-efficient operation.

Nominal Supply Voltage: 3.3 V

Standard supply voltage for compatibility with a wide range of components and systems.

PWM Channels: YES

Supports pulse-width modulation for precise control of output signals.

ROM Programmability: FLASH

Allows for easy reprogramming and updating of firmware without the need for external programming tools.

Terminal Pitch: 0.5 mm

Fine pitch terminal spacing for high-density PCB layout and space-saving designs.

Speed: 72 rpm

Offers fast processing speed and response time for real-time applications.

No. of I/O Lines: 86

Sufficient input/output lines for connecting to peripherals and external devices.

Technical Specifications

Microcontrollers STM32F303VEH6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

32

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

32 MHz

DMA Channels:

YES

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B100

Length:

7 mm

No. of I/O Lines:

86

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA100,12X12,20

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

524288

ROM Programmability:

FLASH

Speed:

72 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

76.9 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Trade Compliance

STM32F303VEH6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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