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STM32F302VDT6TR

STMicroelectronics

STM32F302VDT6TR by STMicroelectronics

STM32F302VDT6TR by STMicroelectronics is a 32-bit microcontroller featuring a Cortex-M4F CPU, ideal for industrial applications. It operates at 2-3.6V with a max clock frequency of 32 MHz and includes ADC and PWM channels. Its robust design supports -40 °C to 85 °C temp range.

Median Price

$5.208

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$5.208

10k+ parts

$5.134

1,000

-

-

$5.208

$5.134

Verical

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$5.208

10k+ parts

$5.134

1,000

-

-

$5.208

$5.134

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,938 parts In-Stock

1+ parts

-

100+ parts

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4,938

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Digiode

USA . 945 parts In-Stock

1+ parts

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945

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Anansix

USA . 123 parts In-Stock

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123

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Distributors (Availability)

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Vigor

Singapore . 1,234 parts In-Stock

1+ parts

$5.220

100+ parts

-

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-

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-

1,234

$5.220

-

-

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Microchip USA

USA . 5,932 parts In-Stock

1+ parts

$16.801

100+ parts

-

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5,932

$16.801

-

-

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AZTECH Wire

Italy . 157 parts In-Stock

1+ parts

$18.990

100+ parts

-

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157

$18.990

-

-

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IDEA Electronic Components Group

UK . 178 parts In-Stock

1+ parts

$25.274

100+ parts

-

1k+ parts

$22.747

10k+ parts

-

178

$25.274

-

$22.747

-

MKK Technologies

India . 1,304 parts In-Stock

1+ parts

$47.527

100+ parts

-

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1,304

$47.527

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DigiPath Technology Company

USA . 1,304 parts In-Stock

1+ parts

$47.527

100+ parts

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1,304

$47.527

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Glotronic Ltd.

UK . 9,600 parts In-Stock

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9,600

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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Lixinc

USA . 5,741 parts In-Stock

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5,741

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Parana Technologies

USA . 2,156 parts In-Stock

1+ parts

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100+ parts

$30.219

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2,156

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$30.219

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Futuretech Components

Singapore . 1,980 parts In-Stock

1+ parts

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1,980

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Corphita

USA . 926 parts In-Stock

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926

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Overview

Unlock the full potential of your projects with the STM32F302VDT6TR microcontroller by STMicroelectronics. Renowned for its exceptional quality and reliability, this advanced Cortex-M4F based solution offers unmatched performance in a compact design. Ideal for industrial automation, IoT devices, and consumer electronics, it ensures efficient power management and versatile connectivity, empowering you to innovate with confidence while reducing time-to-market!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material enhances product reliability and ease of handling.

Surface Mount: YES

Surface mount technology allows for a smaller footprint, enabling compact designs in various applications.

Maximum Supply Voltage: 3.6 V

The voltage range is suitable for low-power applications, reducing energy consumption.

Address Bus Width: 24

A wider address bus allows for more memory addressing, providing greater flexibility in system design.

Package Shape: SQUARE

Square package shape aids in uniform thermal performance and efficient PCB layout.

Bit Size: 32

32-bit architecture supports advanced computing capabilities and complex applications.

Power Supplies (V): 2.5/3.3

Dual voltage supply options support versatile applications with varying power requirements.

No. of Terminals: 100

A higher number of terminals supports a wide range of peripherals and I/O options.

Package Style (Meter): FLATPACK

Flatpack design aids in easier heat dissipation and mounting on PCBs.

Minimum Supply Voltage: 2 V

Lower supply voltage options enhance compatibility with battery-powered devices.

Maximum Operating Temperature: 85 °C

High operating temperature makes the product suitable for industrial environments.

CPU Family: CORTEX-M4F

Based on the efficient Cortex-M4F architecture, this microcontroller offers powerful processing capabilities.

Minimum Operating Temperature: -40 °C

Wide temperature range ensures reliable operation in extreme conditions.

ADC Channels: YES

Inclusion of ADC channels allows for effective data acquisition from analog signals.

DMA Channels: YES

Dedicated DMA channels improve data transfer efficiency and reduce CPU load.

Terminal Position: QUAD

Quad terminal positioning allows for better soldering and mechanical stability.

ROM Words: 393216

Ample ROM space for user programs and firmware increases the versatility of applications.

Width: 14 mm

Compact width makes this microcontroller suitable for space-constrained designs.

External Data Bus Width: 32

32-bit data bus width enables fast data operations and improved performance.

Maximum Clock Frequency: 32 MHz

Sufficient clock frequency allows quick processing and responsive applications.

Length: 14 mm

Compact length further contributes to minimized PCB space requirements.

Temperature Grade: INDUSTRIAL

Industrial-grade rating ensures the microcontroller can withstand harsh environments.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture provides efficient instruction execution, leading to lower power consumption.

RAM Bytes: 65536

Adequate RAM supports complex processing tasks and enhances application performance.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminals provide excellent soldering characteristics and mechanical stability.

Maximum Supply Current: 76.9 mA

Efficient current specifications help in designing low-power applications.

Nominal Supply Voltage: 3.3 V

Standard nominal voltage simplifies integration with many designs and power systems.

PWM Channels: YES

Availability of PWM channels facilitates precise control of motors and other actuators.

ROM Programmability: FLASH

Flash memory allows easy updates and modifications of firmware, enhancing flexibility.

Terminal Pitch: 0.5 mm

Tighter terminal pitch enables high-density PCB designs, accommodating more functionality.

Speed: 72 rpm

This speed rating indicates effective performance for applications requiring moderate processing speed.

No. of I/O Lines: 86

A high number of I/O lines supports extensive interfacing capabilities, enhancing versatility.

Technical Specifications

Microcontrollers STM32F302VDT6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

32

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

32 MHz

DMA Channels:

YES

External Data Bus Width:

32

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

86

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

393216

ROM Programmability:

FLASH

Speed:

72 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

76.9 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

STM32F302VDT6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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