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STM32F302RET7

STMicroelectronics

STM32F302RET7 by STMicroelectronics

STM32F302RET7 by STMicroelectronics is a 32-bit microcontroller with 64 terminals, operating at up to 32 MHz. It features DAC and ADC channels, along with DMA support. Ideal for industrial applications requiring high-speed processing and precise analog-to-digital conversion.

Median Price

$6.467

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

EBV Elektronik

Germany . 320 parts In-Stock

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320

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Distributors (In-Stock)

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Nova Conductors

Japan . 24 parts In-Stock

1+ parts

$6.467

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24

$6.467

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Digiode

USA . 4,848 parts In-Stock

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4,848

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Vyrian

USA . 3,117 parts In-Stock

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3,117

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Anansix

USA . 633 parts In-Stock

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633

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Distributors (Availability)

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Vigor

Singapore . 2,572 parts In-Stock

1+ parts

$5.520

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-

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2,572

$5.520

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

$6.467

100+ parts

-

1k+ parts

$6.143

10k+ parts

$6.014

1,000

$6.467

-

$6.143

$6.014

AZTECH Wire

Italy . 289 parts In-Stock

1+ parts

$11.065

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-

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289

$11.065

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Microchip USA

USA . 5,626 parts In-Stock

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$18.107

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5,626

$18.107

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Ampacity Inc.

Singapore . 160 parts In-Stock

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$20.000

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160

$20.000

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IDEA Electronic Components Group

UK . 2,276 parts In-Stock

1+ parts

$51.369

100+ parts

-

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$46.232

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2,276

$51.369

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$46.232

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MKK Technologies

India . 2,171 parts In-Stock

1+ parts

$96.596

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2,171

$96.596

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DigiPath Technology Company

USA . 2,171 parts In-Stock

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$96.596

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2,171

$96.596

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Corphita

USA . 3,631 parts In-Stock

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3,631

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Eastek

USA . 2,240 parts In-Stock

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2,240

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QUARKTWIN TECHNOLOGY LTD

USA . 2,011 parts In-Stock

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2,011

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Parana Technologies

USA . 1,473 parts In-Stock

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$61.420

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1,473

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$61.420

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Overview

Unlock the power of innovation with the STM32F302RET7 microcontroller by STMicroelectronics. This cutting-edge device boasts top-notch quality and reliability, making it the ideal choice for a wide range of applications. From smart appliances to industrial automation, this versatile microcontroller offers unmatched performance and efficiency. Experience seamless integration, high-speed processing, and unparalleled precision with the STM32F302RET7. Upgrade your projects today and stay ahead of the competition with this game-changing technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy package body material provides durability and reliability, making the product suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and cost in production.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6V, this microcontroller can handle a wide range of power sources, increasing its versatility.

Package Shape: SQUARE

Square package shape allows for efficient use of space on the PCB, optimizing layout and design.

Bit Size: 32

32-bit architecture provides high computational power and performance, suitable for demanding applications.

DAC Channels: YES

Digital-to-analog converter channels enable the microcontroller to interface with analog components and systems.

Power Supplies (V): 2.5/3.3

Support for multiple power supply voltages (2.5V and 3.3V) offers flexibility in design and compatibility with different systems.

No. of Terminals: 64

Having 64 terminals provides ample connectivity options for interfacing with external devices and peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Flatpack, low profile, and fine pitch package style offers compactness, space-saving, and ease of layout on the PCB.

Minimum Supply Voltage: 2 V

Low minimum supply voltage of 2V ensures efficient power consumption and operation in low-power scenarios.

Maximum Operating Temperature: 105 °C

High maximum operating temperature of 105°C allows the microcontroller to operate in harsh environments and industrial applications.

CPU Family: CORTEX-M4F

Inclusion of Cortex-M4F CPU family provides high performance and advanced features for demanding computing tasks.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature of -40°C ensures reliable operation even in extreme cold conditions.

ADC Channels: YES

Analog-to-digital converter channels enable the microcontroller to convert external analog signals into digital data for processing.

DMA Channels: YES

Direct memory access channels enhance data transfer speed and efficiency, improving overall system performance.

Terminal Position: QUAD

Quad terminal position provides stable and secure connection points for external connections, ensuring reliable operation.

ROM Words: 524288

Large ROM capacity of 524288 words allows for storing and executing complex programs and firmware.

Maximum Seated Height: 1.6 mm

Low maximum seated height of 1.6mm enables compact and slim designs for space-constrained applications.

Width: 10 mm

Narrow width of 10mm allows for efficient placement and integration of the microcontroller in electronic systems.

Maximum Clock Frequency: 32 MHz

High maximum clock frequency of 32MHz provides fast processing speeds and responsiveness in real-time applications.

Length: 10 mm

Compact length of 10mm ensures space-saving and efficient use of board space in electronic designs.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh industrial environments with extreme temperature variations.

Peripheral IC Type: MICROCONTROLLER, RISC

Microcontroller with RISC architecture offers efficient and optimized instruction execution, enhancing overall system performance.

RAM Bytes: 65536

Ample RAM capacity of 65536 bytes allows for efficient data storage and processing, essential for multitasking and complex algorithms.

Technology: CMOS

CMOS technology provides low power consumption, high noise immunity, and high-speed operation, making the microcontroller energy-efficient and reliable.

Terminal Form: GULL WING

Gull wing terminal form offers robust and reliable connections to the PCB, ensuring long-term durability and signal integrity.

Maximum Supply Current: 77.4 mA

Low maximum supply current of 77.4mA results in lower power consumption and heat dissipation, ideal for battery-powered devices and energy-efficient applications.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage of 3.3V ensures consistent and reliable operation of the microcontroller across different operating conditions.

PWM Channels: YES

Pulse-width modulation channels allow for precise control of the output signals, making the microcontroller suitable for motor control and power management applications.

ROM Programmability: FLASH

Flash ROM programmability enables easy and quick updates to the firmware and software, facilitating agile development and customization.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm enables high-density mounting and miniaturization of electronic components, essential for compact and lightweight designs.

Speed: 72 rpm

Speed of 72rpm indicates the processing capability and performance of the microcontroller when executing tasks and computations.

No. of I/O Lines: 51

Having 51 I/O lines provides flexibility and versatility in connecting to external devices and peripherals, enhancing the microcontroller's functionality.

Technical Specifications

Microcontrollers STM32F302RET7 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of I/O Lines:

51

No. of Terminals:

64

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

72 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

77.4 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Trade Compliance

STM32F302RET7 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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