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STM32F301K6U7TR

STMicroelectronics

STM32F301K6U7TR by STMicroelectronics

STM32F301K6U7TR by STMicroelectronics is a 32-bit microcontroller with 3.6V max supply voltage, 32MHz clock frequency, and 16384 bytes of RAM. Ideal for industrial applications, it features 8-Ch 12-Bit ADCs, 1-Ch 12-bit DACs, and various peripherals like PWM(16) and USART(2).

Median Price

$2.615

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 1,000 parts In-Stock

1+ parts

$2.615

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-

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1,000

$2.615

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Vyrian

USA . 4,641 parts In-Stock

1+ parts

-

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4,641

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Anansix

USA . 2,626 parts In-Stock

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2,626

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Digiode

USA . 2,249 parts In-Stock

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2,249

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 1,550 parts In-Stock

1+ parts

$2.170

100+ parts

-

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1,550

$2.170

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-

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Aranea Global

USA . 50 parts In-Stock

1+ parts

$2.562

100+ parts

-

1k+ parts

$2.460

10k+ parts

-

50

$2.562

-

$2.460

-

Continental Prestige Electronics

USA . 6,655 parts In-Stock

1+ parts

$2.615

100+ parts

-

1k+ parts

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10k+ parts

$2.562

6,655

$2.615

-

-

$2.562

Argo Parts USA

USA . 1,067 parts In-Stock

1+ parts

$2.615

100+ parts

-

1k+ parts

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-

1,067

$2.615

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AZTECH Wire

Italy . 623 parts In-Stock

1+ parts

$5.627

100+ parts

-

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623

$5.627

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Microchip USA

USA . 7,790 parts In-Stock

1+ parts

$16.512

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7,790

$16.512

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Aztec Data Supply Inc.

USA . 2,262 parts In-Stock

1+ parts

$18.870

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2,262

$18.870

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Semicontronic

India . 1,315 parts In-Stock

1+ parts

$20.000

100+ parts

$19.500

1k+ parts

$19.400

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1,315

$20.000

$19.500

$19.400

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Ampacity Inc.

Singapore . 725 parts In-Stock

1+ parts

$35.000

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725

$35.000

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Corohmni

South Africa . 864 parts In-Stock

1+ parts

$45.222

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864

$45.222

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IDEA Electronic Components Group

UK . 426 parts In-Stock

1+ parts

$76.565

100+ parts

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$68.909

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426

$76.565

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$68.909

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MKK Technologies

India . 541 parts In-Stock

1+ parts

$143.976

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541

$143.976

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DigiPath Technology Company

USA . 541 parts In-Stock

1+ parts

$143.976

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541

$143.976

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QUARKTWIN TECHNOLOGY LTD

USA . 22,778 parts In-Stock

1+ parts

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22,778

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Corphita

USA . 4,360 parts In-Stock

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4,360

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Parana Technologies

USA . 1,697 parts In-Stock

1+ parts

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$91.545

1k+ parts

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1,697

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$91.545

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Overview

Unlock new possibilities with the STM32F301K6U7TR microcontroller by STMicroelectronics. Designed with precision and reliability in mind, this powerful chip offers a wide range of applications for your projects. From industrial automation to consumer electronics, the STM32F301K6U7TR delivers high performance and efficiency. With features like multiple ADC and DAC channels, DMA support, and a wide temperature range, this microcontroller is a versatile solution for any design challenge. Trust STMicroelectronics for cutting-edge technology that brings value and innovation to your products.

Feature Benefit Bullets

Surface Mount: YES

Easy to mount on PCBs, saving space and facilitating automated assembly.

Maximum Supply Voltage: 3.6 V

Support for higher voltage requirements ensures compatibility with various power sources.

Package Shape: SQUARE

Square shape allows for efficient placement on the PCB, optimizing space utilization.

Bit Size: 32

Higher bit size enables processing of larger data sets and more complex algorithms.

DAC Channels: YES

Digital to Analog Converters enable the microcontroller to interface with analog components.

No. of Terminals: 32

Sufficient terminals for connecting to various external components and peripherals.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Diverse package styles offer flexibility in design and thermal management.

Minimum Supply Voltage: 2 V

Support for lower voltage operation enhances energy efficiency and battery-powered applications.

Maximum Operating Temperature: 105 °C

Wide operating temperature range suitable for industrial environments and harsh conditions.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme low-temperature environments.

ADC Channels: YES

Analog to Digital Converters enable the microcontroller to read analog sensor data.

DMA Channels: YES

Direct Memory Access improves data transfer efficiency and offloads the CPU for other tasks.

Terminal Position: QUAD

Quad terminal layout simplifies PCB routing and enhances signal integrity.

ROM Words: 32768

Ample ROM size for storing program instructions and data.

Maximum Seated Height: 0.6 mm

Low profile design suitable for compact electronic devices.

Digital To Analog Convertors: 1-Ch 12-bit

High-resolution DAC enables accurate analog output signals for precise control.

Width: 5 mm

Compact width ideal for space-constrained applications.

Peripherals: COMPARATOR(2), CRC, DMA(7), POR, PVD, PWM(16), RTC, TEMPERATURE SENSOR, TIMER(7), WDT(2)

Rich set of peripherals for versatile connectivity and functionality.

Maximum Clock Frequency: 32 MHz

High clock frequency allows for fast execution of instructions and real-time processing.

Length: 5 mm

Compact length for space-saving design considerations.

Temperature Grade: INDUSTRIAL

Built to withstand industrial temperature ranges and operational conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture provides efficient processing power for embedded applications.

RAM Bytes: 16384

Adequate RAM size for storing and manipulating data during program execution.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and ensures reliability.

Analog To Digital Convertors: 8-Ch 12-Bit

Multiple high-resolution ADCs enable precise measurement of analog signals from different sources.

Nominal Supply Voltage: 3.3 V

Standard supply voltage for compatibility with common power sources.

PWM Channels: YES

Pulse Width Modulation channels for accurate control of analog components like motors and LEDs.

Connectivity: I2C(3), I2S(2), IRDA, LIN, SPI(2), USART(2)

Diverse communication interfaces for interfacing with a wide range of external devices.

ROM Programmability: FLASH

Flash programmable ROM allows for easy firmware updates and flexibility in program storage.

Terminal Pitch: 0.5 mm

Fine pitch terminals enable high-density PCB layout and miniaturization.

Speed: 72 rpm

Operates at a high speed for responsive and real-time control applications.

On Chip Program ROM Width: 8

Sufficient ROM width for storing program instructions and data.

No. of I/O Lines: 24

Adequate I/O lines for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers STM32F301K6U7TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N32

Length:

5 mm

No. of I/O Lines:

24

No. of Terminals:

32

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

16384

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

72 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(3), I2S(2), IRDA, LIN, SPI(2), USART(2)

Peripherals:

COMPARATOR(2), CRC, DMA(7), POR, PVD, PWM(16), RTC, TEMPERATURE SENSOR, TIMER(7), WDT(2)

Analog To Digital Convertors:

8-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 12-bit

Trade Compliance

STM32F301K6U7TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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