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STM32F215ZGT7

STMicroelectronics

STM32F215ZGT7 by STMicroelectronics

STM32F215ZGT7 by STMicroelectronics is a 32-bit microcontroller with Cortex-M3 CPU, 26 MHz clock frequency, and 131072 bytes of RAM. It is used in industrial applications for its 144 terminals, 93 mA max supply current, and -40 to 105 °C operating temperature range.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,117 parts In-Stock

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8,117

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Digiode

USA . 3,525 parts In-Stock

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3,525

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Anansix

USA . 2,115 parts In-Stock

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2,115

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Distributors (Availability)

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Vigor

Singapore . 1,273 parts In-Stock

1+ parts

$11.450

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1,273

$11.450

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AZTECH Wire

Italy . 553 parts In-Stock

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$12.660

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553

$12.660

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Microchip USA

USA . 2,686 parts In-Stock

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$40.149

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2,686

$40.149

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IDEA Electronic Components Group

UK . 1,762 parts In-Stock

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$60.286

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$54.257

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1,762

$60.286

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$54.257

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MKK Technologies

India . 2,065 parts In-Stock

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$113.363

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2,065

$113.363

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DigiPath Technology Company

USA . 2,065 parts In-Stock

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$113.363

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$113.363

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Component Stockers USA

USA . 636 parts In-Stock

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$187.670

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636

$187.670

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Parana Technologies

USA . 2,019 parts In-Stock

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$72.081

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$72.081

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Corphita

USA . 1,497 parts In-Stock

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Overview

Unlock the power of innovation with the STM32F215ZGT7 microcontroller by STMicroelectronics. Designed with cutting-edge technology and superior quality in mind, this device offers unparalleled performance and reliability. Whether you're working on robotics, IoT devices, or industrial automation, this microcontroller provides the perfect solution for your project. With its advanced features and flexible applications, the STM32F215ZGT7 delivers exceptional value and benefits to customers looking to take their designs to the next level. Trust STMicroelectronics for all your microcontroller needs and experience the difference in quality and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for its durability and cost-effectiveness, making the product sturdy and affordable.

Surface Mount: YES

Surface mount technology allows for easier assembly and integration into circuit boards, saving time and effort during production.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this microcontroller can be used in a variety of applications without the risk of damage from overvoltage.

Address Bus Width: 26

A wider address bus allows for larger memory capacity, enabling more complex programs and data storage.

Bit Size: 32

A 32-bit architecture provides faster processing and higher computational power compared to smaller bit sizes.

Power Supplies (V): 2/3.3

Support for multiple power supply voltages offers flexibility in design and compatibility with different power sources.

No. of Terminals: 144

Having a larger number of terminals allows for more connectivity options and I/O capabilities in the system.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature makes this microcontroller suitable for industrial applications where heat resistance is essential.

Minimum Operating Temperature: -40 °C

The wide temperature range ensures reliable operation even in harsh environments with extreme cold temperatures.

CPU Family: CORTEX-M3

The Cortex-M3 architecture offers high performance and energy efficiency, making it ideal for embedded systems and IoT devices.

ADC Channels: YES

Built-in ADC channels enable analog sensor interfacing, allowing the microcontroller to process real-world signals with precision.

DMA Channels: YES

Support for DMA channels enhances data transfer efficiency and reduces the workload on the CPU, improving overall system performance.

ROM Words: 1048576

The large ROM capacity accommodates extensive program code storage, enabling the microcontroller to run complex applications without external memory.

RAM Bytes: 131072

A generous amount of RAM enables efficient temporary data storage and multitasking capabilities, enhancing system responsiveness.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture provides high processing speed and lower power consumption, making the microcontroller suitable for battery-powered applications.

Technical Specifications

Microcontrollers STM32F215ZGT7 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

26

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

26 MHz

DMA Channels:

YES

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G144

Length:

20 mm

No. of I/O Lines:

114

No. of Terminals:

144

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

131072

ROM Words:

1048576

ROM Programmability:

FLASH

Speed:

120 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

93 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.7 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

20 mm

Peripheral IC Type:

Trade Compliance

STM32F215ZGT7 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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