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STM32F205ZGT7

STMicroelectronics

STM32F205ZGT7 by STMicroelectronics

STM32F205ZGT7 by STMicroelectronics is a 32-bit microcontroller with Cortex-M3 CPU, 24-bit address bus, and 144 terminals. It features 2 DAC channels, 2 ADC channels, and 17 timers for applications like industrial automation, robotics, and IoT devices. Operating at up to 26 MHz with a supply voltage range of 1.8-3.6 V, it offers versatile connectivity options including CAN, I2C, SPI, UART, USB.

Median Price

$18.610

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 167 parts In-Stock

1+ parts

$17.090

100+ parts

$11.725

1k+ parts

$10.861

10k+ parts

-

167

$17.090

$11.725

$10.861

-

Mouser Electronics

USA . 5 parts In-Stock

1+ parts

$20.130

100+ parts

$13.740

1k+ parts

$13.070

10k+ parts

-

5

$20.130

$13.740

$13.070

-

Avnet

USA . 60 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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60

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Distributors (In-Stock)

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Digiode

USA . 336 parts In-Stock

1+ parts

$16.017

100+ parts

-

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-

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336

$16.017

-

-

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Vyrian

USA . 6,305 parts In-Stock

1+ parts

-

100+ parts

-

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6,305

-

-

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Anansix

USA . 2,669 parts In-Stock

1+ parts

-

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2,669

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ComSIT Distribution GmbH

Germany . 17 parts In-Stock

1+ parts

-

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17

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Distributors (Availability)

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Vigor

Singapore . 2,831 parts In-Stock

1+ parts

$10.820

100+ parts

-

1k+ parts

-

10k+ parts

-

2,831

$10.820

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-

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Advanced Electronics

New Zealand . 800 parts In-Stock

1+ parts

$12.656

100+ parts

$12.529

1k+ parts

$12.023

10k+ parts

-

800

$12.656

$12.529

$12.023

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Corphita

USA . 904 parts In-Stock

1+ parts

$15.174

100+ parts

-

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-

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904

$15.174

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Component Stockers USA

USA . 588 parts In-Stock

1+ parts

$16.530

100+ parts

$12.830

1k+ parts

-

10k+ parts

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588

$16.530

$12.830

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IDEA Electronic Components Group

UK . 1,712 parts In-Stock

1+ parts

$38.616

100+ parts

-

1k+ parts

$34.754

10k+ parts

-

1,712

$38.616

-

$34.754

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MKK Technologies

India . 1,761 parts In-Stock

1+ parts

$72.615

100+ parts

-

1k+ parts

-

10k+ parts

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1,761

$72.615

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-

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DigiPath Technology Company

USA . 1,761 parts In-Stock

1+ parts

$72.615

100+ parts

-

1k+ parts

-

10k+ parts

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1,761

$72.615

-

-

-

Parana Technologies

USA . 779 parts In-Stock

1+ parts

-

100+ parts

$46.171

1k+ parts

-

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779

-

$46.171

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GreenTree Electronics

Israel . 120 parts In-Stock

1+ parts

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120

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Eastek

USA . 60 parts In-Stock

1+ parts

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60

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Overview

Unleash the power of innovation with the STM32F205ZGT7 by STMicroelectronics. As a leader in microcontrollers, STMicroelectronics delivers quality and reliability in every product. This versatile microcontroller offers a wide range of applications, from industrial automation to consumer electronics. With advanced features like DAC channels, ADC channels, DMA channels, and more, this product provides unmatched value and benefits to customers. Experience seamless connectivity and high performance with the STM32F205ZGT7, setting new standards in the industry.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection to the microcontroller, ensuring long-term reliability.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation onto PCBs, saving space and reducing assembly time.

Maximum Supply Voltage: 3.6 V

A high maximum supply voltage of 3.6V allows for compatibility with a wide range of power sources, providing flexibility in usage.

Address Bus Width: 24

A wide 24-bit address bus allows for access to a large memory space, enabling the microcontroller to handle complex tasks and data processing efficiently.

Package Shape: SQUARE

A square package shape facilitates easy integration into PCB layouts, optimizing space utilization.

Bit Size: 32

A 32-bit architecture offers high performance and processing capabilities, making the microcontroller suitable for demanding applications.

DAC Channels: YES

Digital-to-Analog Converter (DAC) channels enable the microcontroller to convert digital signals into analog voltages, allowing for precise control of analog peripherals.

Power Supplies (V): 2/3.3

Support for multiple power supply voltages (2V and 3.3V) offers versatility in design and compatibility with various external components.

No. of Terminals: 144

A high number of terminals provide extensive connectivity options, facilitating interfacing with various external devices and peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low-profile, fine-pitch package style enhances thermal performance, reduces signal interference, and improves overall reliability.

Minimum Supply Voltage: 1.8 V

A low minimum supply voltage of 1.8V allows for efficient power consumption and operation in low-power applications.

Maximum Operating Temperature: 105 °C

A high maximum operating temperature of 105 °C ensures the microcontroller remains stable and reliable even in harsh environmental conditions.

CPU Family: CORTEX-M3

Being part of the Cortex-M3 CPU family signifies high performance, energy efficiency, and advanced features for demanding applications.

Minimum Operating Temperature: -40 °C

A low minimum operating temperature of -40 °C allows the microcontroller to operate in extreme cold environments without compromising functionality.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold terminal finish provides corrosion resistance, excellent conductivity, and robust solderability for long-term reliability.

ADC Channels: YES

Analog-to-Digital Converter (ADC) channels enable the microcontroller to convert analog signals into digital data, facilitating sensor interfacing and signal processing.

DMA Channels: YES

Direct Memory Access (DMA) channels enhance data transfer speed and efficiency by allowing peripheral devices to access memory directly without CPU intervention.

Terminal Position: QUAD

Quad terminal positioning simplifies PCB layout and routing, optimizing signal integrity and reducing electromagnetic interference.

ROM Words: 1048576

A large ROM size of 1048576 words provides ample storage capacity for firmware, data, and program code, supporting complex applications.

Maximum Seated Height: 1.6 mm

A low maximum seated height of 1.6mm allows for compact design integration and minimal space requirements in electronic assemblies.

Digital To Analog Convertors: 2-Ch 12-Bit

Two-channel, 12-bit Digital-to-Analog Converters enable accurate and precise control of analog output signals for voltage regulation and signal generation.

Width: 20 mm

A compact width of 20mm allows for space-efficient PCB layout and integration, ideal for applications with size constraints.

External Data Bus Width: 32

A wide 32-bit external data bus provides high-speed data transfer and efficient communication with external memory and peripherals.

Peripherals: BOD, DMA(2), LCD, POR, RTC, TIMER(17)

An array of peripherals including Brownout Detection (BOD), Direct Memory Access (DMA), Liquid Crystal Display (LCD), Power-On Reset (POR), Real-Time Clock (RTC), and 17 Timers enhance functionality and versatility for diverse applications.

Maximum Clock Frequency: 26 MHz

A high maximum clock frequency of 26MHz enables fast execution of instructions and real-time responsiveness for time-critical operations.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C ensures robust soldering performance during assembly and rework processes, enhancing reliability and connection strength.

Length: 20 mm

A compact length of 20mm facilitates space-saving design implementation and compatibility with small form factor applications.

Temperature Grade: INDUSTRIAL

Industrial temperature grade certification indicates reliability, ruggedness, and stable performance in challenging industrial environments with wide temperature fluctuations.

Peripheral IC Type: MICROCONTROLLER, RISC

The microcontroller featuring Reduced Instruction Set Computing (RISC) architecture offers high efficiency, performance, and power optimization for embedded systems.

No. of Timers: 17

Seventeen timers provide precise timekeeping, event counting, and interval measurement capabilities, supporting a wide range of timing and control functions.

RAM Bytes: 131072

A generous 131072 bytes of Random Access Memory (RAM) offer sufficient space for data storage, stack operations, and temporary variable storage, enhancing multitasking capabilities.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology enables low power consumption, high speed, and noise immunity, ensuring efficient and reliable operation.

Terminal Form: GULL WING

Gull wing terminal form simplifies soldering, inspection, and rework processes, enhancing manufacturing efficiency and ensuring reliable electrical connections.

Analog To Digital Convertors: 24-Ch 12-Bit

Twenty-four-channel, 12-bit Analog-to-Digital Converters allow for high-resolution analog signal acquisition and processing, supporting sophisticated sensor interfacing and data acquisition applications.

Maximum Supply Current: 93 mA

A maximum supply current of 93mA indicates low power consumption, making the microcontroller suitable for battery-powered and energy-efficient devices.

Nominal Supply Voltage: 3.3 V

A stable nominal supply voltage of 3.3V ensures consistent and reliable operation of the microcontroller, supporting consistent performance in various operating conditions.

PWM Channels: YES

Pulse-Width Modulation (PWM) channels enable precise control of output signals, such as motor speed, LED brightness, and analog voltage levels, offering flexibility in system control.

Connectivity: CAN(2), I2C(3), I2S(2), IRDA, LIN, SPI(3), UART(2), USART(4), USB

A diverse range of connectivity options including Controller Area Network (CAN), Inter-Integrated Circuit (I2C), Integrated Interchip Sound (I2S), Infrared Data Association (IRDA), Local Interconnect Network (LIN), Serial Peripheral Interface (SPI), Universal Asynchronous Receiver-Transmitter (UART), Universal Synchronous Asynchronous Receiver Transmitter (USART), and Universal Serial Bus (USB) facilitate seamless communication and interface with external devices and networks.

ROM Programmability: FLASH

Flash programmability allows for easy reprogramming and updating of firmware and software, enabling flexibility, scalability, and future-proofing of the microcontroller-based systems.

Terminal Pitch: 0.5 mm

A fine terminal pitch of 0.5mm enables high-density mounting, precise signal routing, and efficient PCB layout, contributing to compact system design.

Technical Specifications

Microcontrollers STM32F205ZGT7 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

26 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

32

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of I/O Lines:

114

No. of Terminals:

144

No. of Timers:

17

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

131072

ROM Words:

1048576

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

120 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

93 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), I2C(3), I2S(2), IRDA, LIN, SPI(3), UART(2), USART(4), USB

Peripherals:

BOD, DMA(2), LCD, POR, RTC, TIMER(17)

Analog To Digital Convertors:

24-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32F205ZGT7 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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