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STM32F103ZFH6TR

STMicroelectronics

STM32F103ZFH6TR by STMicroelectronics

STM32F103ZFH6TR by STMicroelectronics is a 32-bit microcontroller with Cortex-M3 CPU, offering 112 I/O lines and 21 ADC channels. With a max clock frequency of 16 MHz, it supports various peripherals like CAN, USB, and USART for industrial applications requiring high-speed data processing within the temperature range of -40 to 85°C.

Median Price

$15.600

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 62 parts In-Stock

1+ parts

$15.600

100+ parts

$10.010

1k+ parts

$8.310

10k+ parts

$8.310

62

$15.600

$10.010

$8.310

$8.310

EBV Elektronik

Germany . 1,500 parts In-Stock

1+ parts

-

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-

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1,500

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-

-

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Distributors (In-Stock)

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Nova Conductors

Japan . 85 parts In-Stock

1+ parts

$10.014

100+ parts

-

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-

85

$10.014

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Digiode

USA . 1,661 parts In-Stock

1+ parts

$13.348

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-

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1,661

$13.348

-

-

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Vyrian

USA . 6,627 parts In-Stock

1+ parts

-

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6,627

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Rutronik

Germany . 3,000 parts In-Stock

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$5.980

3,000

-

-

-

$5.980

Anansix

USA . 2,793 parts In-Stock

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2,793

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Bristol Electronics

USA . 81 parts In-Stock

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81

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EPE Components Inc.

USA . 44 parts In-Stock

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44

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Sea View Technologies

USA . 37 parts In-Stock

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37

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Distributors (Availability)

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Continental Prestige Electronics

USA . 5,627 parts In-Stock

1+ parts

$10.014

100+ parts

-

1k+ parts

-

10k+ parts

$9.814

5,627

$10.014

-

-

$9.814

Netroflash

USA . 100 parts In-Stock

1+ parts

$10.014

100+ parts

-

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100

$10.014

-

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Ampacity Inc.

Singapore . 585 parts In-Stock

1+ parts

$11.940

100+ parts

-

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585

$11.940

-

-

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Corphita

USA . 2,836 parts In-Stock

1+ parts

$12.645

100+ parts

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2,836

$12.645

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Vigor

Singapore . 5,400 parts In-Stock

1+ parts

$13.120

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5,400

$13.120

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Corohmni

South Africa . 787 parts In-Stock

1+ parts

$41.917

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-

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787

$41.917

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Aztec Data Supply Inc.

USA . 300 parts In-Stock

1+ parts

$45.410

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300

$45.410

-

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IDEA Electronic Components Group

UK . 631 parts In-Stock

1+ parts

$75.974

100+ parts

-

1k+ parts

$68.376

10k+ parts

-

631

$75.974

-

$68.376

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MKK Technologies

India . 542 parts In-Stock

1+ parts

$142.863

100+ parts

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542

$142.863

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DigiPath Technology Company

USA . 542 parts In-Stock

1+ parts

$142.863

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542

$142.863

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iodParts Technologies Inc.

India . 5,323,240 parts In-Stock

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Perfect Parts

USA . 13,440 parts In-Stock

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13,440

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Lixinc

USA . 12,902 parts In-Stock

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12,902

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Parana Technologies

USA . 1,943 parts In-Stock

1+ parts

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100+ parts

$90.838

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1,943

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$90.838

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Futuretech Components

Singapore . 1,500 parts In-Stock

1+ parts

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1,500

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XScomponents

USA . 942 parts In-Stock

1+ parts

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$15.790

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942

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$15.790

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Argo Parts USA

USA . 352 parts In-Stock

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352

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Overview

Unlock endless possibilities with the STM32F103ZFH6TR by STMicroelectronics. Crafted with precision and innovation, this microcontroller offers unparalleled performance and reliability. Ideal for a wide range of applications, from industrial automation to consumer electronics, this product guarantees seamless integration and high-speed processing. Experience the perfect balance of power and efficiency with the STM32F103ZFH6TR - your gateway to limitless creativity and success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material ensures durability and protection for the microcontroller, making it suitable for long-term use in various environments.

Maximum Supply Voltage: 3.6 V

Higher maximum supply voltage allows for flexibility in power supply options and compatibility with a wide range of systems.

Bit Size: 32

32-bit architecture provides increased processing power and capability, allowing for more complex tasks to be performed efficiently.

DAC Channels: YES

DAC channels enable the microcontroller to convert digital signals into analog signals, expanding its versatility in interfacing with external devices.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable in noisy environments.

Connectivity: CAN, I2C(2), I2S(2), IRDA, LIN, SDMMC, SPI(3), USART(5), USB

Multiple connectivity options provide flexibility in communication interfaces, allowing the microcontroller to easily connect with a variety of devices and systems.

RAM Bytes: 98304

Large RAM capacity enables the microcontroller to efficiently handle data processing tasks and store temporary information, enhancing its performance in demanding applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture offers efficient instruction execution and streamlined operation, making the microcontroller well-suited for high-speed and real-time processing tasks.

Technical Specifications

Microcontrollers STM32F103ZFH6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

26

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

16 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

16

JESD-30 Code:

S-PBGA-B144

Length:

10 mm

No. of I/O Lines:

112

No. of Terminals:

144

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA144,12X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

98304

ROM Words:

786432

ROM Programmability:

FLASH

Maximum Seated Height:

1.7 mm

Speed:

72 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

68 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C(2), I2S(2), IRDA, LIN, SDMMC, SPI(3), USART(5), USB

Peripherals:

DMA(12), POR, RTC, TIMER(17)

Analog To Digital Convertors:

21-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32F103ZFH6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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