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STM32F103ZEH6TR

STMicroelectronics

STM32F103ZEH6TR by STMicroelectronics

STM32F103ZEH6TR by STMicroelectronics is a 32-bit microcontroller with 24-bit address bus width, 144 terminals, and 16 external interrupts. It features two DAC channels and 21-channel 12-bit ADCs, suitable for industrial applications requiring high-speed processing and low power consumption. With a max clock frequency of 16 MHz, it offers connectivity options like CAN, I2C, SPI, USART, and USB for versatile integration in various systems.

Median Price

$9.136

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 450 parts In-Stock

1+ parts

$9.136

100+ parts

-

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450

$9.136

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Chip Stock

USA . 11,300 parts In-Stock

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-

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11,300

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Vyrian

USA . 7,593 parts In-Stock

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7,593

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Anansix

USA . 1,564 parts In-Stock

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1,564

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Digiode

USA . 296 parts In-Stock

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296

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 752 parts In-Stock

1+ parts

$1.000

100+ parts

-

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752

$1.000

-

-

-

Continental Prestige Electronics

USA . 865 parts In-Stock

1+ parts

$9.136

100+ parts

-

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$8.954

865

$9.136

-

-

$8.954

Vigor

Singapore . 2,076 parts In-Stock

1+ parts

$12.000

100+ parts

-

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-

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-

2,076

$12.000

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AZTECH Wire

Italy . 647 parts In-Stock

1+ parts

$14.623

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-

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-

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647

$14.623

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Aztec Data Supply Inc.

USA . 3,589 parts In-Stock

1+ parts

$36.919

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-

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3,589

$36.919

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Microchip USA

USA . 3,510 parts In-Stock

1+ parts

$36.988

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3,510

$36.988

-

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IDEA Electronic Components Group

UK . 744 parts In-Stock

1+ parts

$45.362

100+ parts

-

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$40.825

10k+ parts

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744

$45.362

-

$40.825

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Corohmni

South Africa . 734 parts In-Stock

1+ parts

$46.660

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734

$46.660

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MKK Technologies

India . 176 parts In-Stock

1+ parts

$85.299

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176

$85.299

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DigiPath Technology Company

USA . 176 parts In-Stock

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$85.299

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176

$85.299

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iodParts Technologies Inc.

India . 3,781,500 parts In-Stock

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3,781,500

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Lixinc

USA . 12,934 parts In-Stock

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12,934

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Futuretech Components

Singapore . 9,000 parts In-Stock

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9,000

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Kepictronics

USA . 4,449 parts In-Stock

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Corphita

USA . 2,257 parts In-Stock

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2,257

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Parana Technologies

USA . 2,251 parts In-Stock

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$54.237

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2,251

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$54.237

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XScomponents

USA . 851 parts In-Stock

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$14.410

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851

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$14.410

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Argo Parts USA

USA . 191 parts In-Stock

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191

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Speed Components Ltd (Excess)

Israel . 140 parts In-Stock

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140

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Netroflash

USA . 100 parts In-Stock

1+ parts

-

100+ parts

$8.954

1k+ parts

$8.680

10k+ parts

$8.497

100

-

$8.954

$8.680

$8.497

Overview

Unleash the power of innovation with the STM32F103ZEH6TR by STMicroelectronics, a top-tier manufacturer of cutting-edge microcontrollers. This sleek and efficient device offers a wide range of applications in various industries, providing unmatched quality and reliability. With advanced technology and a robust design, this product delivers superior performance and functionality, ensuring optimal results for your projects. Experience the value and benefits of the STM32F103ZEH6TR and stay ahead of the curve in today's fast-paced world of technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the microcontroller, ensuring a longer lifespan.

Surface Mount: YES

The surface mount feature allows for easy installation and soldering, making it convenient for assembly.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6 V, this microcontroller can handle a wide range of power inputs, increasing its versatility.

Address Bus Width: 24

A wider address bus width allows for more memory addressability, enhancing the microcontroller's capability to handle larger data sets.

Package Shape: SQUARE

The square package shape saves space and allows for more efficient PCB layout, making it suitable for compact designs.

Bit Size: 32

A 32-bit architecture enables the microcontroller to process data and instructions faster and more efficiently.

DAC Channels: YES

Having Digital-to-Analog Converter channels allows the microcontroller to convert digital signals into analog voltages, making it suitable for applications involving analog outputs.

No. of Terminals: 144

The high number of terminals provides ample connectivity options for interfacing with external devices and components.

Minimum Supply Voltage: 2 V

The low minimum supply voltage makes this microcontroller energy-efficient and suitable for low-power applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this microcontroller can withstand harsh environmental conditions and extreme temperatures.

Technical Specifications

Microcontrollers STM32F103ZEH6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

16 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B144

JESD-609 Code:

e3

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

12

No. of External Interrupts:

16

No. of I/O Lines:

112

No. of Terminals:

144

No. of Timers:

11

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA144,12X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

225

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.7 mm

Speed:

72 rpm

Maximum Supply Current:

69 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C(2), I2S(2), LIN, IRDA, SDIO, SPI(3), USART(5), USB

Peripherals:

DMA(12), PDR, POR, PVD, RTC, TIMER(11)

Analog To Digital Convertors:

21-Ch 12-Bit

Digital To Analog Convertors:

2 Ch 12-Bit

Trade Compliance

STM32F103ZEH6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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