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STM32F103VBT7TR

STMicroelectronics

STM32F103VBT7TR by STMicroelectronics

STM32F103VBT7TR by STMicroelectronics is a 32-bit microcontroller with Cortex-M3 CPU, offering 131072 ROM words and 20480 RAM bytes. With a max clock frequency of 72 MHz, it features 16-Ch 12-Bit ADC channels and PWM channels for applications requiring CAN, I2C, IRDA, LIN, SPI, USART, and USB connectivity in industrial-grade environments.

Median Price

$5.547

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 39 parts In-Stock

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$5.547

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39

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Chip Stock

USA . 11,180 parts In-Stock

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Vyrian

USA . 5,748 parts In-Stock

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5,748

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Anansix

USA . 1,295 parts In-Stock

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1,295

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Digiode

USA . 254 parts In-Stock

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254

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 169 parts In-Stock

1+ parts

$1.000

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-

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169

$1.000

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Vigor

Singapore . 2,560 parts In-Stock

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$4.660

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2,560

$4.660

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Aranea Global

USA . 1,000 parts In-Stock

1+ parts

$5.436

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$5.219

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1,000

$5.436

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$5.219

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Continental Prestige Electronics

USA . 488 parts In-Stock

1+ parts

$5.547

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$5.436

488

$5.547

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$5.436

AZTECH Wire

Italy . 504 parts In-Stock

1+ parts

$12.474

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504

$12.474

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Microchip USA

USA . 4,685 parts In-Stock

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$15.792

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4,685

$15.792

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IDEA Electronic Components Group

UK . 1,258 parts In-Stock

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$17.537

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$15.783

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1,258

$17.537

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$15.783

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MKK Technologies

India . 1,005 parts In-Stock

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$32.977

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1,005

$32.977

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DigiPath Technology Company

USA . 1,005 parts In-Stock

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$32.977

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$32.977

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Perfect Parts

USA . 5,600 parts In-Stock

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5,600

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Argo Parts USA

USA . 4,993 parts In-Stock

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Lixinc

USA . 4,775 parts In-Stock

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Parana Technologies

USA . 2,264 parts In-Stock

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$20.968

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2,264

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$20.968

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Corphita

USA . 1,555 parts In-Stock

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1,555

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Electronic Sources GmbH

Germany . 9 parts In-Stock

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9

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Overview

Unlock endless possibilities with the STM32F103VBT7TR microcontroller from STMicroelectronics. Known for its superior quality and innovative technology, STMicroelectronics has once again delivered a product that exceeds expectations. Ideal for a wide range of applications, this microcontroller offers customers unparalleled value with its advanced features and capabilities. Experience seamless performance and reliability with the STM32F103VBT7TR, and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY - This material provides durability and protection for the microcontroller.

Surface Mount

YES - Allows for easy and convenient mounting on circuit boards.

Maximum Supply Voltage

3.6 V - Supports a wide range of voltage inputs for versatile applications.

Address Bus Width

32 - Enables efficient handling of memory addresses for data storage and retrieval.

Package Shape

SQUARE - Facilitates easy integration into circuit designs and layout.

Bit Size

32 - Offers high processing power and performance for complex tasks.

DAC Channels

YES - Allows for accurate analog signal output for various applications.

Power Supplies (V)

2.5/3.3 - Provides flexibility in power options for different system requirements.

No. of Terminals

100 - Offers ample connectivity options for interfacing with other components.

Package Style (Meter)

FLATPACK, LOW PROFILE, FINE PITCH - Ensures a compact and space-efficient design for tight installations.

Minimum Supply Voltage

2 V - Supports low power operation for energy-efficient applications.

Maximum Operating Temperature

105 °C - Ideal for high-temperature environments and reliable performance.

CPU Family

CORTEX-M3 - Offers a powerful and efficient processing unit for diverse computing needs.

Minimum Operating Temperature

40 °C - Suitable for operation in extreme cold conditions without sacrificing performance.

ADC Channels

YES - Provides accurate digital conversion of analog signals for precise data processing.

DMA Channels

YES - Enhances data transfer efficiency and speeds up system performance.

Terminal Position

QUAD - Simplifies connections and reduces the risk of errors during installation.

ROM Words

131072 - Offers ample memory space for storing program data and instructions.

Maximum Seated Height

1.6 mm - Ensures compatibility with compact and slim devices.

Width

14 mm - Compact dimension for easier integration into tight spaces.

External Data Bus Width

32 - Facilitates fast and efficient data transfer between components.

Peripherals

DMA(7), POR, RTC, TIMER(7) - Provides a range of peripheral functions for enhanced functionality.

Maximum Clock Frequency

72 MHz - Enables high-speed processing for quick response times.

Length

14 mm - Compact size for space-saving and efficient circuit layouts.

Temperature Grade

INDUSTRIAL - Designed for reliable operation in industrial environments with varying temperatures.

Peripheral IC Type

MICROCONTROLLER, RISC - Features a microcontroller with reduced instruction set computing for optimized performance.

RAM Bytes

20480 - Offers ample memory for storing and accessing temporary data during operation.

Technology

CMOS - Utilizes Complementary Metal-Oxide-Semiconductor technology for power efficiency and reliable performance.

Terminal Form

GULL WING - Provides secure and reliable terminal connections for stable operation.

Analog To Digital Convertors

16-Ch 12-Bit - Supports multiple analog-to-digital conversions with high resolution for accurate data processing.

Maximum Supply Current

50.3 mA - Ensures efficient power consumption and reduced heat dissipation.

Nominal Supply Voltage

3.3 V - Standard voltage supply for compatibility with various systems.

PWM Channels

YES - Enables precise control of analog devices and motors for smooth operation.

Connectivity

CAN, I2C(2), IRDA, LIN, SPI(2), USART(3), USB - Offers multiple communication interfaces for versatile connectivity options.

ROM Programmability

FLASH - Allows for reprogramming of the read-only memory for flexibility in updating software.

Terminal Pitch

0.5 mm - Provides precise spacing for easy and accurate terminal connections.

Speed

1.25 rpm - Capable of high-speed processing for quick data handling.

On Chip Program ROM Width

8 - Provides ample storage for program data and instructions on the chip.

No. of I/O Lines

80 - Offers multiple input/output lines for versatile connectivity options.

Technical Specifications

Microcontrollers STM32F103VBT7TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

32

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

72 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

32

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

80

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

20480

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

1.25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

50.3 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C(2), IRDA, LIN, SPI(2), USART(3), USB

Peripherals:

DMA(7), POR, RTC, TIMER(7)

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

STM32F103VBT7TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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