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STM32F103VBH7

STMicroelectronics

STM32F103VBH7 by STMicroelectronics

STM32F103VBH7 by STMicroelectronics is a 32-bit microcontroller with 131072 ROM words, 20480 RAM bytes, and 16 MHz clock frequency. Ideal for industrial applications, it features CAN, I2C(2), SPI(2), USART(3), USB connectivity and 16-Ch 12-Bit ADC channels for precise analog to digital conversion.

Median Price

$8.090

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 718 parts In-Stock

1+ parts

$5.140

100+ parts

$3.860

1k+ parts

$3.840

10k+ parts

-

718

$5.140

$3.860

$3.840

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Newark

USA . 718 parts In-Stock

1+ parts

$8.090

100+ parts

-

1k+ parts

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718

$8.090

-

-

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Element14

Singapore . 718 parts In-Stock

1+ parts

$11.150

100+ parts

$7.980

1k+ parts

$7.490

10k+ parts

-

718

$11.150

$7.980

$7.490

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EBV Elektronik

Germany . 6,624 parts In-Stock

1+ parts

-

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6,624

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Avnet

USA . 4,784 parts In-Stock

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-

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4,784

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$6.411

100+ parts

-

1k+ parts

-

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50

$6.411

-

-

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Digiode

USA . 531 parts In-Stock

1+ parts

$6.850

100+ parts

-

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531

$6.850

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Vyrian

USA . 6,536 parts In-Stock

1+ parts

-

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-

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6,536

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-

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Anansix

USA . 535 parts In-Stock

1+ parts

-

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535

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 733 parts In-Stock

1+ parts

$3.410

100+ parts

-

1k+ parts

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10k+ parts

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733

$3.410

-

-

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Ampacity Inc.

Singapore . 1,339 parts In-Stock

1+ parts

$6.130

100+ parts

-

1k+ parts

-

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1,339

$6.130

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

$6.411

100+ parts

$6.283

1k+ parts

-

10k+ parts

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2,000

$6.411

$6.283

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-

Corphita

USA . 4,844 parts In-Stock

1+ parts

$6.489

100+ parts

-

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10k+ parts

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4,844

$6.489

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-

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Semicontronic

India . 2,138 parts In-Stock

1+ parts

$6.630

100+ parts

$6.464

1k+ parts

$6.431

10k+ parts

-

2,138

$6.630

$6.464

$6.431

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Vigor

Singapore . 5,106 parts In-Stock

1+ parts

$7.610

100+ parts

-

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5,106

$7.610

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IDEA Electronic Components Group

UK . 2,306 parts In-Stock

1+ parts

$14.254

100+ parts

-

1k+ parts

$12.828

10k+ parts

-

2,306

$14.254

-

$12.828

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MKK Technologies

India . 1,719 parts In-Stock

1+ parts

$26.803

100+ parts

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1,719

$26.803

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DigiPath Technology Company

USA . 1,719 parts In-Stock

1+ parts

$26.803

100+ parts

-

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10k+ parts

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1,719

$26.803

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Corohmni

South Africa . 172 parts In-Stock

1+ parts

$40.142

100+ parts

-

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172

$40.142

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Aztec Data Supply Inc.

USA . 8,146 parts In-Stock

1+ parts

$55.320

100+ parts

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8,146

$55.320

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Lixinc

USA . 18,253 parts In-Stock

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18,253

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Perfect Parts

USA . 4,795 parts In-Stock

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4,795

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iodParts Technologies Inc.

India . 2,773 parts In-Stock

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2,773

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Argo Parts USA

USA . 2,000 parts In-Stock

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2,000

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Eastek

USA . 916 parts In-Stock

1+ parts

-

100+ parts

$7.250

1k+ parts

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916

-

$7.250

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GreenTree Electronics

Israel . 916 parts In-Stock

1+ parts

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916

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Parana Technologies

USA . 624 parts In-Stock

1+ parts

-

100+ parts

$17.042

1k+ parts

-

10k+ parts

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624

-

$17.042

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Overview

Unleash the power of innovation with the STM32F103VBH7 microcontroller by STMicroelectronics. Crafted with precision and expertise, this device offers unparalleled performance and reliability. Perfect for a wide range of applications in the industrial sector, this microcontroller provides seamless connectivity and advanced features. Experience the benefits of cutting-edge technology with the STM32F103VBH7, where quality meets value for all your project needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto PCBs.

Maximum Supply Voltage: 3.6 V

Support for a high maximum supply voltage provides flexibility in powering options.

Bit Size: 32

A 32-bit architecture ensures high processing power and performance.

Power Supplies (V): 2.5/3.3

Support for multiple power supply options allows for compatibility with different systems.

No. of Terminals: 100

Having a high number of terminals provides ample connectivity options for external devices.

Minimum Supply Voltage: 2 V

A low minimum supply voltage allows for operation in a range of power conditions.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature ensures reliability in harsh environments.

CPU Family: CORTEX-M3

Being part of the Cortex-M3 family indicates a high-performance, energy-efficient processor.

RAM Bytes: 20480

With a large amount of RAM, the product can efficiently handle data processing tasks.

Technical Specifications

Microcontrollers STM32F103VBH7 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

16 MHz

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B100

JESD-609 Code:

e1

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

80

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA100,10X10,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

20480

ROM Words:

131072

ROM Programmability:

FLASH

Speed:

72 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

50.3 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C(2), SPI(2), USART(3), USB

Peripherals:

DMA(7), POR, RTC, TIMER(7)

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

STM32F103VBH7 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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