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STM32F103V8H6TR

STMicroelectronics

STM32F103V8H6TR by STMicroelectronics

STM32F103V8H6TR by STMicroelectronics is a versatile 32-bit microcontroller with a max clock frequency of 72 MHz, supporting up to 80 I/O lines. It operates within -40 °C to 85°C and features integrated ADC/DAC channels for efficient data processing. Ideal for industrial applications, it offers robust connectivity options like CAN and USB.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,936 parts In-Stock

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5,936

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Anansix

USA . 1,317 parts In-Stock

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1,317

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Digiode

USA . 928 parts In-Stock

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928

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Distributors (Availability)

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AZTECH Wire

Italy . 928 parts In-Stock

1+ parts

$10.220

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-

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928

$10.220

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Microchip USA

USA . 5,173 parts In-Stock

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$30.518

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5,173

$30.518

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IDEA Electronic Components Group

UK . 279 parts In-Stock

1+ parts

$48.704

100+ parts

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$43.833

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279

$48.704

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$43.833

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MKK Technologies

India . 1,015 parts In-Stock

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$91.584

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1,015

$91.584

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DigiPath Technology Company

USA . 1,015 parts In-Stock

1+ parts

$91.584

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1,015

$91.584

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QUARKTWIN TECHNOLOGY LTD

USA . 19,142 parts In-Stock

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Vigor

Singapore . 9,154 parts In-Stock

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9,154

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Corphita

USA . 3,697 parts In-Stock

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3,697

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Parana Technologies

USA . 540 parts In-Stock

1+ parts

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$58.233

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540

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$58.233

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Overview

Unlock the potential of your projects with the STM32F103V8H6TR microcontroller from STMicroelectronics, renowned for its exceptional quality and reliability. Designed for versatility, this powerful Cortex-M3 device excels in a wide array of applications, from industrial automation to consumer electronics. Experience superior performance, energy efficiency, and seamless connectivity, all while benefitting from ST's commitment to innovation and excellence. Elevate your designs and stay ahead of the competition!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy body material provides resilience and protects the microcontroller from environmental factors, ensuring longevity.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient utilization of PCB space, making it suitable for modern electronic devices.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6 V, this microcontroller is optimized for low-power applications, enhancing energy efficiency.

Address Bus Width: 32

A 32-bit address bus allows for larger addressable memory, enabling complex applications and improved performance.

Package Shape: SQUARE

The square package shape supports efficient cooling and optimal layout design in PCB assemblies.

Bit Size: 32

The 32-bit architecture supports advanced computing capabilities, allowing for efficient processing of complex algorithms.

DAC Channels: YES

Integrated DAC channels enable the microcontroller to output analog signals, boosting versatility for various applications.

Power Supplies (V): 2.5/3.3

Supports dual supply voltages for flexibility in system design and compatibility with a wide range of components.

No. of Terminals: 100

A higher number of terminals facilitates multiple connectivity options and peripheral integration, enhancing functionality.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The low-profile and fine pitch design makes it suitable for high-density applications, catering to space-constrained environments.

Minimum Supply Voltage: 2 V

A minimum supply voltage of 2 V ensures the device functions well in low-power scenarios, improving overall energy efficiency.

Maximum Operating Temperature: 85 °C

An operating temperature of up to 85 °C allows this microcontroller to function reliably in industrial conditions.

CPU Family: CORTEX-M3

Utilizing the energy-efficient Cortex-M3 architecture results in optimized performance for embedded applications.

Minimum Operating Temperature: -40 °C

A wide temperature range (-40 °C to 85 °C) makes it suitable for harsh environments, enhancing its industrial application potential.

ADC Channels: YES

Integrated ADC channels allow for direct input from analog sensors, expanding the range of application possibilities.

DMA Channels: YES

DMA channels enable high-speed data transfer with minimal CPU intervention, resulting in more efficient processing.

Terminal Position: BOTTOM

Bottom positioning of terminals simplifies PCB layout and enhances solderability.

ROM Words: 65536

An ample ROM capacity allows for substantial firmware storage, catering to complex application requirements.

Maximum Seated Height: 1.7 mm

A low seated height enhances compact design possibilities, suitable for portable and space-sensitive applications.

Width: 10 mm

Compact width further contributes to space-saving designs in electronics, enabling integration into smaller devices.

External Data Bus Width: 32

A 32-bit external data bus supports high data throughput, making it suitable for performance-intensive applications.

Peripherals: DMA(7), POR, RTC, TIMER(7)

Diverse peripherals increase the microcontroller’s capabilities, allowing integration of various functions in a single chip.

Maximum Clock Frequency: 72 MHz

High clock frequency ensures fast processing speeds, facilitating real-time applications and improving response times.

Temperature Grade: INDUSTRIAL

Industrial temperature grade guarantees reliability and performance in demanding environments, enhancing its operational longevity.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture provides efficient instruction execution, optimizing performance for embedded systems.

RAM Bytes: 20480

Generous RAM provision supports complex processing and multitasking capabilities, enhancing overall application performance.

Technology: CMOS

CMOS technology ensures high speed and low power consumption, making it ideal for battery-operated devices.

Terminal Form: BALL

Ball terminal form facilitates soldering and enhances the reliability of connections on the PCB.

Analog To Digital Converters: 16-Ch 12-Bit

With 16 channels of 12-bit ADCs, this microcontroller can handle multiple sensor inputs, increasing versatility for various applications.

Maximum Supply Current: 50 mA

A maximum supply current of 50 mA indicates power efficiency, making it suitable for low-power applications.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3 V aligns with standard logic levels, ensuring compatibility with common components.

PWM Channels: YES

The inclusion of PWM channels allows for efficient control of motors and other electronic devices, enhancing application versatility.

Connectivity: CAN, I2C(2), IRDA, LIN, SPI(2), USART(3), USB

Multiple connectivity options ensure compatibility with various peripherals, enhancing integration possibilities in diverse applications.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications to firmware, ensuring flexibility in application development.

Terminal Pitch: 0.8 mm

A terminal pitch of 0.8 mm allows for finer placement on PCBs, improving design compactness and layout flexibility.

Speed: 1.25 rpm

Low-speed motor control applications can be handled effectively, making it suitable for specific embedded tasks.

On Chip Program ROM Width: 8

An 8-bit program ROM width supports compatibility with a variety of software applications, enhancing usability.

No. of I/O Lines: 80

With 80 I/O lines, this microcontroller supports extensive peripheral interfacing, making it adaptable to a wide range of projects.

Technical Specifications

Microcontrollers STM32F103V8H6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

32

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

72 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B100

Length:

10 mm

No. of I/O Lines:

80

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA100,10X10,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

20480

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.7 mm

Speed:

1.25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

50 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C(2), IRDA, LIN, SPI(2), USART(3), USB

Peripherals:

DMA(7), POR, RTC, TIMER(7)

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

STM32F103V8H6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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